臺灣博碩士論文加值系統

本研究將以不同種類之銀基填料BAg-1及BAg-27，進行C1100P純銅同質材料之對接。並利用保護氣氛爐焊及真空硬焊等製程，針對不同填料選擇片狀(Filler)及絲狀焊料(Wire)進行硬焊接合。探討氣氛爐焊及真空硬焊製程參數之差異(升溫速率、持溫時間、保護性氣氛及真空度)對材料之機械性質、接合強度及微結構之影響。遵循ASTM D5868標準規範利用剪切拉伸試驗(Lap Shear Adhesion)來進行接合強度之研究，以不同搭接長度測試其強度變化。
經金相觀察及SEM-EDX發現BAg-1及BAg-27的組織主要為α-Cu及α-Ag兩固溶相所組成，且裂痕發生於界面/母材間，受元素擴散產生之缺陷隨時間增加。經微硬度量測焊接界面硬度，BAg-1持溫5分鐘時有最高硬度約146 HV0.05，而BAg-27則是238 HV0.05，硬度不隨持溫時間變化，差異不大。但經EPMA分析發現隨持溫時間及溫度升高增加，元素擴散趨於嚴重，母材的合金化導致其硬度大幅提升。BAg-1及BAg-27接合工件持溫5分鐘時，有最剪切高強度分別為103.9、66.7MPa。持溫超過10分鐘時，合金化的界面/母材間缺陷增加導致材料機械性質降低，剪切強度下降。

In this study, different kinds of silver-based filler BAg-1 and BAg-27, has been used to produce the C1100P pure copper brazed joint. The protective atmosphere and vacuum and other processes, were used for different brazing process. Heating rate, holding time, protective atmosphere and vacuum degree were the important parameter to affect the mechanical properties, bonding strength and microstructure of the joint. Lap Shear Adhesion be following the ASTM D5868 standard specification, the bonding strength of joints using a shear tensile test was obtained with varying lap length.
The microstructures of BAg-1 and BAg-27 joints were mainly composed of α-Cu and β-Ag, and the rupture occurred in the interface / parent material, which was caused by the diffusion of elements. Increase over time. The hardness of the interface was measured by microhardness. BAg-1 had the highest hardness of about 146 HV0.05 for 5 minutes, while BAg-27 was 238 HV0.05. The hardness did not be changed by the holding temperature. However, EPMA analysis showed that with the holding temperature and temperature increased, the diffusion of elements tends to be serious, the alloying of the base material leads to its hardening and brittle. Shear strength of BAg-1 and BAg-27 joints are holding at brazing temperature for 5 minutes, were 103.9 and 66.7MPa, respectively. When the temperature time duration is over 10 minutes, the increase in the interface between the alloyed interface and the parent material leads to the brittleness of the material and the decrease in the shear tensile strength.

ENGLISH ABSTRACT v
中文摘要 vii
目錄 viii
圖目錄 xii
表目錄 xvii
第 1 章 前言 1
第 2 章 文獻回顧 3
2.1 接合母材-銅及銅合金 3
2.2 接合定義 4
2.3 接合製程簡介 4
2.3.1 軟焊(Soldering) 5
2.3.2 硬焊(Brazing) 6
2.3.3 真空硬焊(Vacuum Brazing)及其應用 7
2.4 硬焊接合之現象 9
2.4.1 潤濕性值(Wetting)與接觸角 11
2.4.2潤濕性指標(Wettability Index) 15
2.4.3毛細現象 15
2.5 影響硬焊製程因素 18
2.6 接合強度之探討 22
2.7銀基填料及其接合之特性研究 23
第 3 章 實驗方法與步驟 29
3.1 實驗目的及流程 29
3.2 接合母材 30
3.3 硬焊填料金屬 31
3.4 石墨載台 31
3.5 硬焊接合 33
3.5.1 焊接試片前處理 33
3.5.2 硬焊試片製備 33
3.5.3 真空爐硬焊接合 34
3.5.4 氣氛爐焊接 36
3.6 分析方法 37
3.6.1 光學顯微鏡觀察 37
3.6.2 硬度測試 37
3.6.3 搭接(剪切)強度測試 37
3.6.4 掃描式電子顯微鏡(SEM) 38
3.6.5 電子探測微分析儀(EPMA) 39
第 4 章 結果與討論 40
4.1 微觀組織觀察 40
4.1.1 母材及其退火組織 40
4.1.2 BAg-1銀基填料焊接界面金相組織 42
4.1.3 BAg-27銀基填料焊接界面金相組織 45
4.1.4 界面/母材組織變化 47
4.2 維克氏微硬度曲線量測及分析 50
4.2.1 BAg-1銀基填料硬度量測及分析 50
4.2.2 BAg-27銀基填料硬度量測及分析 52
4.2.3 BAg-1真空爐焊及火炬焊接之硬度量測 54
4.2.4 維克氏微硬度數據整理 56
4.3 剪切強度測試 57
4.3.1 Cu/BAg-1/Cu氣氛爐焊件剪切強度測試 58
4.3.2 Cu/BAg-27/Cu氣氛爐焊件剪切強度測試 60
4.3.3 Cu/BAg-1/Cu火炬焊件剪切強度測試 62
4.3.4銀基填料硬焊件之剪切強度與搭接長度之關係 63
4.4掃描式電子顯微鏡(SEM-EDX) 65
4.4.1 氣氛爐Cu/BAg-1/Cu焊接界面元素分析 65
4.4.2 氣氛爐Cu/BAg-27/Cu焊接界面元素分析 67
4.4.3晶間穿透元素分析 69
4.5電子探測微分析儀(EPMA)元素分佈分析 70
4.5.1銀基填料BAg-1元素分佈 70
4.5.2銀基填料BAg-27元素分佈 74
4.5.3火炬硬焊件界面元素分析及分布 78
4.6焊接界面/母材邊緣之缺陷分析比對 81
第 5 章 結論 84
第 6 章 參考文獻 86

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