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研究生:楊寅崧
研究生(外文):YANG YIN SONG
論文名稱:半導體封裝銅線製程參數最佳化之研究
論文名稱(外文):Research on the Optimization of Semiconductor Package Copper Process Parameters
指導教授:楊炳章楊炳章引用關係
指導教授(外文):YANG BING ZHANG
口試委員:李顯億黃勝斌
口試委員(外文):LI XIAN YIHUANG SHENG BIN
口試日期:2018-06-26
學位類別:碩士
校院名稱:逢甲大學
系所名稱:資訊電機工程碩士在職學位學程
學門:工程學門
學類:電資工程學類
論文種類:學術論文
論文出版年:2018
畢業學年度:106
語文別:中文
論文頁數:71
中文關鍵詞:封裝銅線製程參數實驗設計統計軟體
外文關鍵詞:Package copper wire process parametersexperimental designStatistical software
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隨著科技時代快速演進與科技的進化,電子產品日益更新,積體電路相關產業功勞不小,日益推出的消費性產品不僅要達到短、小、薄、輕而且要還要多功能才能符合消費者的個人化產品需求。
數據分析對於人類近進步有非常重大的影響,隨著科學技術深入發展,科學研究所需大量的研究數據而近科學、合理、高效的數據分析,在從數據分析結果中獲得重要的展規律,而使科技進步。
本研究使用透過JUMP統計軟體,探討半導體封裝銅線製程參數最佳化之研究,此研究分為兩個階段式的實驗設計,第一階段整理出關鍵參數水準的範圍,然後找出較顯著因子準,在進行實驗與研究參數最佳化第一次實驗是尋找出半導體封裝銅線製程參數範圍,第二階段求得最佳參數範圍後,使用研究材料、設備及量測器具,做為此參數最終數據結果為佳為最佳參數,求得最佳參數範圍後再將範圍帶入JUMP統計軟體求得最佳化參數。

With the rapid evolution of the technology era and the evolution of technology Electronic products are increasingly updated, and the industry of integrated circuits is not a small credit. The consumer products launched by Yiyi must not only be short, small, thin, light, but also multi-functional to meet the consumer's personalized product needs.
Data analysis has a very significant impact on human progress With the in-depth development of science and technology, scientific research requires a large amount of research data and scientific, reasonable and efficient data analysis. Obtain important development rules from the results of data analysis, and make science and technology progress.
This study uses statistical software through JUMP Discussion on optimization of process parameters of semiconductor package copper wire This study is divided into two stages of experimental design. The first stage sorts out the range of key parameter levels Then find out the more significant factors In the experiment and research parameters optimization, the first experiment is to find the range of semiconductor package copper wire process parameters. Use of research materials, equipment and measuring instruments The final data result for this parameter is the best parameter After obtaining the optimal parameter range, the range is brought into the JUMP statistical software to obtain the optimization parameters.

第一章 緒論…………………………………………………………………..1
1-1 前言………………………………………………………………………..1
1-2 研究動機…………………………………………………………………..4
1-3 文獻回顧………………………………………………………………….6
1-4 研究目的………………………………………………………………...10
第二章 銅線銲線製程原理與分析………………………………………….13
2-1半導體封裝製程和流程介紹……………………………………………13
2-2銲線接合技術介紹………………………………………………………15
2-3 銲線接合流程…………………………………………………………..18
2-4影響銲線品質之要因……………………………………………………22
2-5 接合材料介紹…………………………………………………………...24
2-6銲針介紹…………………………………………………………………26
2-7銅線品質檢驗…………………………………………………………….27
第三章 研究方法…………………………………………………………...36
3-1 實驗設計………………………………………………………………...36
3-2實驗參數設計……………………………………………………………45
3-3 研究材料/設備/量測儀器……………………………………………..47
第四章 實驗結果與綜合討論……………………………………………...56
4-1銲線製程實驗結果………………………………………………………56
4-2銲線製程實驗結果資料分析……………………………………………60
4-3最適合參數範圍………………………………………………………....61
4-4最佳參數…………………………………………………………………65
第五章結論與未來展望……………………………………………………...67
5-1研究成果與結論…………………………………………………………67
5-2未來展望…………………………………………………………………68
參考文獻…………………………………………………………………69

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