臺灣博碩士論文加值系統

無黏著層存在的雙層軟式印刷電路板的新型結構正積極開發，由於聚醯亞胺的鈍性與疏水性特質，因此如何讓聚醯亞胺基板與沉積在其上的銅層之間保持一定的黏著性與穩定性是相當重要的課題。本研究提出新穎的複合式矽烷分子層概念，藉由兩種不同結構的矽烷化合物，其中一種具有胺基的結構，可強化鈀催化劑與電鍍銅層之間的黏著性，另一種具有吡啶的結構，可作為立體屏障，有效阻隔胺基類矽烷化合物之間的團聚，經矽烷化反應後複合式矽烷分子層能均勻分布在聚醯亞胺基板上。
本研究利用水滴接觸角與化學分析電子能譜儀檢驗聚醯亞胺親水性處理程度以及極表面的化學狀態，搭配原子力顯微鏡觀察改質聚醯亞胺前後的表面形貌與平均粗糙度變化，使用90度拉力試驗機分析經由複合式矽烷分子層改質聚醯亞胺的抗撕強度差異，並透過掃描式電子顯微鏡與EDS判定斷裂面的位置，最後藉由穿透式電子顯微鏡對Cu/Silane/PI剖面分析檢驗銅原子的擴散行為。

The adhesion between the metallization and polyimide film is one of the crucial factors in the performance and reliability for electrical applications. In this study, we demonstrate the process let an organosilane molecular composite layer which comprises two different organosilane compounds be able to enhance the adhesion strength of the copper foil on the polyimide film. One of the organosilane compounds contains amino (-NH2) group, which owns the ability of strengthening the adhesion strength between copper foil (and Pd catalyst) and substrate. The other contains a pyridine group, which can serve as barrier and effectively separate amino-terminated organosilane to prevent it from agglomeration.
Surface-modified PI film was examined by X-ray photoelectron spectroscopy (XPS) to ensure the surface chemical composition, and metal/PI interfaces were characterized using a transmission electron microscopy (TEM). The 90-degree peeling test was used to measure the adhesion strength of the metal layer on the PI film.

摘要 i
Abstract ii
目錄 iii
圖目錄 v
表目錄 ix
第一章、緒論 1
1.1. 前言 1
1.2. 研究動機 2
第二章、文獻回顧 3
2.1. 軟性印刷電路板 3
2.1.1. 軟性印刷電路板簡介 3
2.1.2. 聚醯亞胺 4
2.1.3. 發展趨勢與市場需求 5
2.2. 聚醯亞胺表面處理 6
2.2.1. 乾式預處理 6
2.2.2. 濕式預處理 26
2.3. 化學鍍 31
2.3.1. 化學鍍的機制 31
2.3.2. 化學鍍銅 32
第三章、實驗方法 33
3.1. 材料與藥品 33
3.2. 儀器設備 34
3.3. 儀器原理 35
3.3.1. 表面改質機 (Vacuum Plasma Treater) 35
3.3.2. 接觸角測量儀 (Contact Angle Measurement) 35
3.3.3. 原子力顯微鏡 (Atomic Force Microscope) 35
3.3.4. 化學分析電子能譜儀 (Electron Spectroscope for Chemical Analysis, ESCA) 36
3.3.5. 掃描式電子顯微鏡 (Scanning Electron Microscope, SEM) 36
3.3.6. 穿透式電子顯微鏡 (Transmission Electron Microscope, TEM) 36
3.3.7. 多功能拉力測試機 (Pull off Tester) 37
3.4. 實驗流程 38
3.4.1. 聚醯亞胺表面改質 38
3.4.2. 吸附奈米Pd觸媒 39
3.4.3. 聚醯亞胺金屬化 40
第四章、結果與討論 41
4.1. 聚醯亞胺親水性處理 41
4.1.1. AFM分析 41
4.1.2. 水滴接觸角測試 42
4.1.3. 聚醯亞胺親水性表面之鍵結分析 43
4.2. 矽烷化反應及其金屬化 46
4.2.1. 矽烷化合物選擇 46
4.2.2. 複合式矽烷分子層改質 47
4.3. 聚醯亞胺與矽烷化合物之間的鍵結型態 59
4.3.1. 複合式與單一矽烷分子層ESCA分析 59
4.3.1. 複合式與單一矽烷分子層ESCA分析Si 2p軌域 60
4.3.2. 複合式與單一矽烷分子層ESCA分析N 1s軌域 61
4.4. 濺鍍銅在聚醯亞胺基材中的擴散 63
4.5. 銅/複合式矽烷分子層/聚醯亞胺之銅擴散現象 64
4.5.1. 熱退火前之銅/複合式矽烷分子層/聚醯亞胺 64
4.5.2. 熱退火後之銅/矽烷分子層/聚醯亞胺 66
第五章、結論 71
參考文獻 72

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