臺灣博碩士論文加值系統

本論文研究針對指紋辨識器元件在鍍膜製程中脫層原因進行探討與分析，因為鍍膜附著的失效會導致指紋辨識器有脫層的風險，製程中發現在基材表面和鍍膜之間的附著力與表面粗糙度有很大的關聯性，因此，我們藉由實驗分析來找出鍍膜附著的控制因子與最佳化參數。實驗中先對失效區域使用非破壞性光學影像確認鍍膜外觀有無異常，再針對確定的失效區域做水平或垂直研磨以電子顯微鏡(SEM)了解脫層的模式。根據實驗分析，設計兩種加強基材與鍍模附著力的解決方案，一種是以電漿離子轟擊的製程使其表面粗糙度增加並測量其表面能量變化與電漿轟擊的條件如電將密度，電漿電壓之關係，另外再搭配鍍膜前製程烘烤與後製程烘烤的條件如溫度及烘烤時間以有效改善薄膜的附著力。 實驗結果確認，電漿離子轟擊能夠有效粗化表面降低基材表面能以提薄膜附著力，再搭配鍍膜前/後烘烤溫度及時間可達到鍍膜良率的提升。

This thesis is focus on the study of the failure modes of the fingerprint sensor which has been delaminated and causing high risk in application. In principle, surface energy between substrate and coating layer is the key factor for thin film adhesion. In experiments, parameters in thin film coating process were tested and to improve the functional property of the fingerprint device. First, optical inspection tool was used to identify the failure area with cosmetic issue. Then, by horizontal or vertical cross section inspection of scanning electron microscopy to verify the detailed delamination between substrate and the coated layer. To improve the adhesion property of the coated layer, plasma process was applied to increase the roughness and the adhesion property. As a result, it was found that the delamination of the coated layer can significantly be improved by plasma process which can effectively lowing the surface energy of the substrate in order to improve the adhesion of the coated layer as well. In addition, pre-baking/post baking process were evaluated to thin film coated samples during coating process. It was found that pre/post baking temperature and time could remove moisture contamination during coating process and increasing the yield of the fingerprint sensor package.

摘要 III
ABSTRACT IV
致謝 V
目錄 VII
圖目錄 VIII
表目錄 X
第一章 緒論 1
1-1前言 1
1-2研究背景和動機 2
1-3研究目的 2
第二章 失效模式分析 3
2-1 失效分析手法 3
2-1-1 非破壞失效分析 3
2-1-2 破壞失效分析 6
2-2 失效原因分析與討論 9
第三章 理論分析 11
3-1 水珠角量測 11
3-2 表面能 12
3-3 Plasma電漿清洗原理 19
3-4 表面粗糙度 22
第四章 數值模擬與實驗設計 23
4-1 實驗產品準備 23
4-2 產品設備介紹 24
4-3 實驗流程 26
第五章 結果與討論 30
5-1 理論模擬與實驗驗證 30
5-2 Plasma表面能結果與討論 30
5-3 Coating製程結果與討論 31
5-4結論 33
參考文獻 35

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