臺灣博碩士論文加值系統

台灣在產業高度群聚效應推動下，於全球電子產業站穩關鍵性地位，為維持產業競爭優勢，除了技術創新外，提昇產品可靠度是電子產業界研發的重點方向。材料實驗室指出部分產品失效原因與積體電路(integrated circuit, IC)元件故障相關。本研究旨在建立電子元件壽命評估流程，針對失效應力 (如電流、CTE mismatch等) ，考量其使用條件及工作環境進行加速壽命試驗，期望在短時間內獲得失效數據，建立分析模型，有效預估電子元件的使用壽命，以確保電子產品具備市場期望之可靠度，提升企業競爭力。並以手持產品為例，考量當時間限制或未能取得樣本而無法進行實際試驗時，應用CAE模擬軟體估計產品加嚴試驗條件下之壽命，進而以失效數據計算產品活化能、加速因子並預測產品正常使用壽命，並以Norris-Landzberg模型建置壽命評估使用者介面。

Driven by the high concentration of industry, Taiwan has established a stable position in the global electronics industry. In order to maintain the competitive advantage of the industry, in addition to technological innovation, improving product reliability is the focus of research and development in the electronics industry. The materials laboratory pointed out that some product failure causes are related to integrated circuit (IC) component failure. This study aims to establish an electronic component life assessment process. For failure stress (such as current, CTE mismatch, etc.), consider the conditions of use and working environment for accelerated life testing. It is expected to obtain failure data in a short time, establish an analysis model, and effectively estimate the service life of electronic components. To ensure that electronic products have the reliability of market expectations and enhance the competitiveness of enterprises. Taking hand-held products as an example, considering the time limit or failure to obtain samples and failing to conduct actual tests, the CAE simulation software is used to estimate the life of the product under severe test conditions, and then the product activation energy, acceleration factor and prediction are calculated from the failure data. The product has a normal service life and the life assessment user interface is built using the Norris-Landzberg model.

摘 要 i
ABSTRACT ii
誌 謝 iv
目 錄 v
表目錄 vii
圖目錄 viii
第一章 緒論 1
1.1 研究背景與動機 1
1.2 研究目的 2
1.3 研究範圍與限制 3
1.4 研究流程 3
第二章 文獻探討 4
2.1 電子元件失效分析 4
2.1.1 Flip Chip Ball Grid Array (FCBGA) 4
2.1.2 Quad Flat No leads (QFN) 5
2.2 電子元件壽命評估方法 5
2.3 加速試驗分析 6
2.3.1 電遷移 8
2.3.2 熱應力 9
2.3.3 非熱應力 10
2.3.4 複合應力 11
第三章 研究方法 13
3.1 加速試驗模型 13
3.1.1 Arrhenius 模型 13
3.1.2 The Generalized Eyring模型 14
3.1.3 Inverse Power Law模型 15
3.1.4 Coffin-Mason 模型 16
3.1.5 Blacks Equation 18
3.2 產品失效數據研究 18
3.3 可靠度相關函數運算 20
3.4 常見之壽命分配及其相關函數運算 21
3.4.1 指數分配 21
3.4.2 常態分配 23
3.4.3 韋伯分布 25
3.5 可靠度參數估計 28
3.5.1 最大概似估計表 28
3.5.2 機率繪圖紙估計法 29
3.6 適合度檢定 30
3.6.1 卡方檢定 30
3.6.2 K-S檢定 31
3.7 斜率檢定 32
第四章 建立流程與介面 33
4.1 建立壽命評估流程 33
4.2 個案流程 35
4.2.1 蒐集產品資訊並定義使用條件 36
4.2.2 探索失效機制與模式與決定失效因子 37
4.2.3 決定預測壽命模型 38
4.2.4 規劃加速壽命測試條件 38
4.2.5 韋伯分配與參數估計 41
4.2.6 模擬期望壽命與計算模型參數 42
4.2.7 計算加速因子並預測正常使用下壽命 43
4.3 使用者介面 43
4.3.1 樣本全部失效介面 44
4.3.2 樣本部份失效介面 46
4.3.3 計算正常使用壽命介面 48
4.4 使用者介面驗證 50
4.4.1 樣本全部失效介面驗證 50
4.4.2 樣本部份失效介面驗證 52
第五章 結論與建議 54
5.1 結論 54
5.2 研究貢獻 54
5.3 未來研究方向 55
參考文獻 56

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