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[1]Tseng, Yen-Chang, Manufacturing process analysis of Ag/Pd thick film conductor circuits (1995). Theses and Dissertations. Paper 389. [2]G. M. Le, A. Godfrey and N. Hansen, Structure and strength of aluminum with sub-micrometer/micrometer grain size prepared by spark plasma sintering, Materials and Design, vol. 49, pp. 360-367, 2013. [3]R. M. German, Powder Metallurgy & Particulate Materials Processing, Princeton, New Jersey: Metal Powder Industries Federation, 2005. [4]J. E. Garay, Current-activated, pressure-assisted densification of materials, Annual Review of Materials Research, pp. 445-468, 2010. [5]G. B. Schaffer, T. B. Sercombe and R. N. Lumley, Liquid phase sintering of aluminum alloys, Materials Chemistry and Physics, no. 67, pp. 85-91, 2001.
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