臺灣博碩士論文加值系統

本研究主要在探討開發新型異質接面奈米結構之熱介面材料(TIMs) ，因高功率電子元件運作時必須轉移到一個散熱器，並最終消散到周圍環境，會產生大量熱能，若電子元件與散熱話接觸面會產生間隙，進而形成一層熱阻抗(Thermal resistance)，因此透過開發高熱導率TIMs可將電子元件與散熱器之間間隙填補進而提升熱傳導性能，對於高功率電子元件的散熱能大幅改善並提高電子元件壽命。本研究主要分為兩部份，第一部分係利用球磨方式，將多層石墨烯(Exfoliated Graphite Nanoplatelets，EGN)製備成球磨石墨烯(Ball-Milled Exfoliated Graphite Nanoplatelets，BMEGN)，混入奈米銀線(Sliver nanowires，AgNWs) ，將材料嵌入聚二甲基矽氧烷(PDMS)，製成熱介面材料，再利用網印技術將再生石墨烯作為高度拉伸和低成本的熱界面材料，探討其TIMs之水平與垂直方向之熱傳導系數，並且實際應用於絕緣閘雙極電晶體(IGBT)與散熱片之間的溫度量測。第二部分則是將市售之少層石墨烯(A Few Layer Graphite，AFLG)，同樣混入奈米銀線(AgNWs)填料再利用網印技術印刷至3D結構(纖維/銅片)上，發展新型異質接面奈米結構熱介面材料，並探討其對於所製備熱介面材料熱傳導系數的影響，並進行一系列的實驗分析，並量測TIMs之水平與垂直方向之熱傳導系數，再將TIMs實際應用於電子元件的溫度量測。將熱介面材料夾在其中，利用熱電偶觀察其散熱效果，並且實際應用於核研所現有之15kW電力轉換器與鋁散熱鰭片之間進行溫度散熱量測。

This study explored the development of new heterogeneous nanostructured thermal interface materials (TIMs).High-power electronic components must be transferred to a heat sink when operating, and eventually dissipated into the surrounding environment. If electronic components of the contact surface with the heat sink will create a gap, which will form a thermal resistance. Therefore, by developing high thermal conductivity TIMs, the gap between the electronic component and the heat sink can be filled to improve the heat conduction performance, and the heat dissipation performance of the high power electronic component can be improved. This study is divided into two parts. The first part is the use of ball milling to prepare the multi-graphene (Exfoliated Graphite Nanoplatelets, EGN) into Ball-Milled Exfoliated Graphite Nanoplatelets (BMEGN), which is mixed into the silver nano wire (AgNWs). Fillers are embedded and thermally cured with Polydimethylsiloxane (PDMS). Then, fillers via screen printing technology as a highly stretched and low-cost thermal interface material to explore the thermal conductivity of horizontal and vertical TIMs , and are used in temperature measurement between Gate Bipolar Transistor(IGBT) and heat sink. The second part is to sell the commercially available A Few layer graphite (AFLG), which is also mixed into the nano silver wire (AgNWs) filler and then printed on the 3D structure (fiber/copper sheet) by screen printing technology. A new type of heterogeneous nanostructured thermal interface materials, and its influence on the thermal conductivity of the prepared thermal interface material with a series of experimental analysis, and measure the thermal conductivity of the horizontal and vertical directions of TIMs. Finally, the TIMs apply on the electronic components and temperature measurement.

摘要 I
Abstract II
致謝……………………………………………………………...………V
目錄 VI
圖目錄 VIII
第一章 緒論 1
1-1前言 ..1
1-2研究動機與目的 3
1-3論文架構 5
第二章 文獻回顧………………………………………………………..6
2-1 球磨處理……………………………………………………..6
2-2 異質接面增強熱傳導路徑………………….…………….......8
2-2 奈米材料之熱介面材料製備與應用………..........................10
第三章 研究方法與過程 12
3-1 球磨石墨烯(BMEGN)球磨處理與奈米銀線(AgNWs) 12
3-1-2利用網印技術製備熱介面材料……………………..14
3-2 多維度製備熱介面材料 14
3-2-1 利用網印技術製備多維度熱介面材料 16
3-3 實驗設備 ……………………………………………………18
第四章 主要發現與結果 23
4-1 奈米銀線(1D)與球磨石墨烯(2D)實驗分析製備熱介面材料 ..23
4-1-1 掃描式電子顯微鏡(SEM) 23
4-1-2 熱介面材料之熱傳導係數……………...…..……25
4-1-3 拉曼光譜(Raman spectroscopy) 27
4-1-4 X-ray繞射分析(XRD) 29
4-1-5 熱重分析 (TGA) 31
4-1-6 CPU的散熱測試 32
4-1-7 實際應用核研所現有之15kW電力轉換器 34
4-2 多維結構複合材料製備熱介面材料實驗與分析 37
4-2-1 掃描式電子顯微鏡(SEM) 36
4-2-2 多維結構熱介面材料之熱傳導係數 39
4-2-3 紅外線熱顯像儀測 41
4-2-4 熱重分析 (TGA) 43
4-2-5 實際應用核研所現有之15kW電力轉換器 44
第五章 結論 46
參考文獻.………..……….......................................................................48

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