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研究生:呂人楷
論文名稱:倒掛式反射器扇出型天線構裝之輻射特性提升
論文名稱(外文):Radiation Characteristics Improvement on a Fan-Out Antenna in Package with Inverted Reflector
指導教授:羅本喆
口試委員:陳永樹羅本喆鍾賢
口試日期:2020-11-13
學位類別:碩士
校院名稱:國防大學理工學院
系所名稱:航空太空工程碩士班
學門:工程學門
學類:航空工程學類
論文種類:學術論文
論文出版年:2020
畢業學年度:109
語文別:中文
論文頁數:94
中文關鍵詞:扇出型天線構裝單一因子最佳化設計
相關次數:
  • 被引用被引用:2
  • 點閱點閱:60
  • 評分評分:
  • 下載下載:0
  • 收藏至我的研究室書目清單書目收藏:0
誌謝 ii
摘要 iii
Abstract iv
目錄 vi
表目錄 viii
圖目錄 xi
符號表 xvi
1. 緒論 1
1.1 前言 1
1.2 天線簡介 4
1.3 扇出型天線構裝(FO_AiP) 7
1.4 研究動機與目的 9
1.5 文獻回顧 9
1.6 論文架構 20
2. 原理探討 21
2.1 電磁波理論 21
2.1.1 高斯定律 21
2.1.2 法拉第感應定律 24
2.1.3 安培-馬克斯威爾定律 24
2.2 天線特性 25
2.2.1 回波損耗(Return Loss, RL) 25
2.2.2 反射系數(Reflection Coefficient) 26
2.2.3 散射參數(Scattering Parameters) 28
2.2.4 天線效率(Antenna Efficiency) 29
2.2.5 天線方向性(Antenna Directivity) 30
2.2.6 增益(Gain) 30
3. 模擬方法與最佳化設計 32
3.1 模擬規劃 32
3.1.1 模擬方法 33
3.1.2 初步設定 34
3.1.3 原始模型 35
3.1.4 單一因子分析 38
3.2 最佳化設計 39
3.2.1 單激發與雙激發最佳化 40
4. 結果與討論 42
4.1 原始FO_AiP模型設計與初步模擬結果 42
4.2 單一因子分析結果 45
4.3 最佳化設計 60
4.3.1 單激發最佳化 61
4.3.2 雙激發最佳化 66
5. 結論及未來工作 86
6. 參考文獻 88
附錄一 91
附錄二 94

[1]https://xueqiu.com/2788586870/136241214
[2]Zhang, Y. and Mao, J., 2019, “An Overview of the Development of Antenna-in-Package Technology for Highly Integrated Wireless Devices,” in Proceedings of the IEEE, vol. 107, no. 11, pp. 2265-2280.
[3]https://kknews.cc/zh-tw/digital/ekq4jny.html
[4]Lee, L., Kang, L. S., Kwon, Y. Y., Kim, T. H., Kim J. H., Lee, E. J. and Lee, J. K., 2017, “FOWLP Technology as Wafer Level System in Packaging (SiP) Solution,” 2017 International Conference on Electronics Packaging (ICEP), Yamagata, pp. 491-493.
[5]Pour Mousavi, M., Wojno wski, M., Agethen, R., Weigel, R. and Hagelauer, A., 2013, “The impact of embedded wafer level BGA package on the antenna performance,” 2013 IEEE-APS Topical Conference on Antennas and Propagation in Wireless Communications (APWC), Torino, pp. 828-831.
[6]鄭明德,“電磁波特性與天線原理”行政院災害防救委員會,2004
[7]https://en.wikipedia.org/wiki/Antenna_gain
[8]https://en.wikipedia.org/wiki/Fan-out_wafer-level_packaging
[9]Tsai, C. H., Hsieh, J. S., Liu, M., Yeh, E. H., Chen, H. H., Hsiao, C. W., Chen, C. S., Liu, C. S., Liu, M. J., Wang, C. T. and Yu, D., 2013, “Array Antenna Integrated Fan-out Wafer Level Packaging (InFO-WLP) for Millimeter Wave System Applications,” 2013 IEEE International Electron Devices Meeting, Washington, DC, USA, pp. 25.1.1-25.1.4.
[10]Wang, C. T., Hsieh, J. S., Tsai, J. S., Liu, M. and Yu, C. H., 2017, “Integrated Fan Out Antenna and Method of Forming the Same,” United States Patent, US 9,843,106 B2.
[11]Liu, D., Gu, X., Baks, C. W. and Valdes-Garcia, A., 2017, “Antenna-in-Package Design Considerations for Ka-Band 5G Communication Applications,” in IEEE Transactions on Antennas and Propagation, vol. 65, no. 12, pp. 6372-6379.
[12]Wang, C. T., Tang, T. C., Lin, C. W., Hsu, C. W., Hsieh, J. S., Chung, H. T., Wu, K. C., Pu, H. P. and Yu, D., 2018 “InFO_AiP Technology for High Performance and Compact 5G Millimeter Wave System Integration,” 2018 IEEE 68th Electronic Components and Technology Conference (ECTC), San Diego, CA, USA, pp. 202-207, 2018.
[13]Cheng, U. H., Hsieh, S., Jhong, M., Kuo, H., Ting, C. and Wang, C., 2019, “A Low-Cost Antenna-in-Package Solution for 77GHz Automotive Radar Applications,” 2019 International Conference on Electronics Packaging (ICEP), Niigata, Japan, pp. 110-114.
[14]Hsieh, S. C., Chu, C. F., Cheng, Y. H. and Wang, C. C., 2019, “Advanced Thin-Profile Fan-Out with Beamforming Verification for 5G Wideband Antenna,” 2019 IEEE Electronic Components and Technology Conference (ECTC), Las Vegas, NV, USA, pp. 977-982.
[15]Sun, Y., Sun, Y., Luo, J., Wang, H., Yang, Z., Wang, Y., Ding, G. and Han, K., 2019, “Enhancing Efficiency of Antenna-in-Package (AiP) by Through-Silicon-Interposer (TSI) with Embedded Air Cavity and Polyimide Dielectric Micro-Substrate,” 2019 IEEE 69th Electronic Components and Technology Conference (ECTC), Las Vegas, NV, USA, pp. 707-711.
[16]Wang, S., Rahui, D., Xie, D., Guan, L. T., Che, F., Han, Y. and Bhattacharya S., 2019, “Automated Design Flow for Millimeter-Wave Antenna in Fan-Out Wafer Level Packaging,” 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC), Singapore, Singapore, pp. 448-451.
[17]Kam, D. G., Liu, D., Natarajan, A., Reynolds, S. K. and Floyd, B. A., 2011, “Organic packages with embedded phased-array antennas for 60-GHz wireless chipsets,” IEEE Trans., Compon, Packag, Manuf, Technol, pp. 1806–1814.

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