臺灣博碩士論文加值系統

阿里巴巴集團創辦人馬雲去年（2018年）曾公開表示，接下來的30年是真正互聯網應用時代！
市場研究報告Statista預估2019年底IoT物聯網連接設備可達270億台，到2025年將成長三倍以上到達750億台，IDC預測到2022年全球物聯網支出就可高達1.2兆美元，可見物聯網為當紅的新興技術產業，也帶來各式各樣的應用以及龐大的商機，並且以快速驚人的速度成長著。
本研究根據競爭優勢理論及新產品開發流程，針對台灣具有競爭力的優勢產業-IC半導體晶片設計廠商，探討在物聯網的需求及技術趨勢下，以個案研究的方式來歸納瞭解IC晶片設計廠商如何面對競爭，以其競爭優勢依據產品開發流程的新產品規劃評估、設計開發、及行銷策略來實施新一代物聯網IC晶片的新產品開發，該公司如何透過產品創新策略將新一代物聯網晶片行銷上市，提升競爭力及產品獲利能力。

Jack Ma (Ma Yun), the co-founder and former executive chair of Alibaba Group, publicly stated in last year (2018) that the next 30 years is the era of true Internet of Things (IoT) applications!
Market research report “Statista” estimates that IoT connected equipment will reach 27 billion units by the end of 2019, and will increase more than three times to reach 75 billion units by 2025. “IDC report” also predicts that worldwide technologies spend on the Internet of Things will reach US$1.2 trillion in 2022. Internet of Things (IoT), bringing a wide variety of comprehensive applications and extreme huge business opportunities, which is a popular emerging technology and future industry trend. According to market analysis reports, IoT will grow up and flourish in the coming years.
Based on the competitive advantage and new product development process theory, this thesis is targeted to the core component of IoT equipment-the IC chip design company, taking a case study of A company, tring to summarize and understand how IC chip design company faces competition and uses their competitive advantages to implement new product development of next-generation IoT IC chips based on new product development process including new product planning, design development and marketing strategies; and how IC chip design company designs and sells new IC chips to market to enhance their competitiveness and product profitability through innovative strategies.

摘 要 i
ABSTRACT ii
誌 謝 iv
目 錄 v
表 目 錄 vii
圖 目 錄 viii
一、 緒論 1
1.1 研究背景與動機 1
1.2 研究目的 2
1.3 研究流程 4
二、 文獻探討 5
2.1 物聯網的定義及介紹 5
2.2 微控制處理晶片的介紹 9
2.3 競爭優勢 12
2.4 創新產品開發 15
2.4.1 創新動力模型 17
2.4.2 產品開發流程 20
三、 研究方法與設計 24
3.1 個案研究法 25
3.1.1 個案公司簡介 25
3.2 SWOT分析模型 (SWOT Analysis) 26
3.3 次級資料蒐集法 30
3.4 深度訪談法 30
3.4.1 訪談對象及大綱 31
四、 個案研究 33
4.1 個案公司背景介紹 33
4.2 個案公司的SWOT分析 39
4.3 新一代物聯網產品的規劃及評估 44
4.4 新一代物聯網晶片設計及開發 45
4.5 新一代物聯網晶片上市及行銷策略 50
4.5.1 建構開放平台及資源共享 52
4.5.2 物聯網行銷成功案例 54
五、 結論與建議 57
5.1 研究結論 57
5.2 後續研究建議 59
參考文獻 60

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