臺灣博碩士論文加值系統

本研究於科學園區某晶圓廠微影製程無塵室中，微影顯影製程使用的液體分別為顯影液及超純水，使用市售噴霧瓶分別盛裝顯影液及去離子水，噴灑於有塗佈光阻的晶圓後進行曝光，比較兩者所產生的缺陷差異。利用熱線式溫濕度/風速計來檢測顯影槽在閒置時與製程中相對濕度的差異，來確認顯影過程中是否產生氣態水分子。利用熱線式溫濕度/風速計檢測機械手臂區的相對濕度變化，透過相對濕度變化來取代顯影液濃度，以釐清顯影液的影響。
研究結果顯示顯影液混合水分子會形成圓形的缺陷圖形。當顯影槽的層流風壓大於機械手臂區的層流風壓時，機械手臂區內相對濕度逐漸上升，實驗發現機械手臂區內相對濕度變化量大於0.1%RH，測試晶圓中可發現圓形缺陷產生，數據結果發現機械手臂的相對濕度變化量與圓形缺陷數量呈正相關。

This study is conducted in a lithography clean room in a semiconductor fab. The liquids used in the lithography process include developer and ultrapure water. A developer solution and deionized water was sprayed on a wafer with a coated photoresist using a commercially available spray bottle, and the difference in the shape of defects by these two liquids are compared. A hot-wire type temperature / humidity / anemometer is used to detect the relative humidity change in the robot arm region, and the relative humidity change is used to express the concentration of the developer to clarify the effect of the developer.
The results of the study show that the developer mixes water molecules to form a circular defect pattern. When the laminar wind pressure of the develop unit is greater than the laminar wind pressure in the robotic arm region, the relative humidity in the robotic arm gradually rises. It was found that the relative humidity change in the robotic arm region is greater than 0.1% RH, and round defects can be found in the test wafer. The data shows that the relative humidity change of the robotic arm is positively correlated with the number of circular defects.

中文摘要 Ⅰ
ABSTRACT Ⅱ
誌謝 Ⅲ
目錄 Ⅳ
表目錄 Ⅵ
圖目錄 Ⅶ
第一章 緒論 1
1.1 研究動機 1
1.2 研究目的 1
第二章 文獻回顧 3
2.1 潔淨室規範 3
2.2 潔淨室氣態分子污染物種類及來源 6
2.3 氣態分子污染物來源及影響 9
2.4 微影製程缺陷的研究 12
第三章 研究方法 14
3.1 研究流程 14
3.2 測試晶圓 16
3.3 製程機台 17
3.3.1 光阻塗布與顯影機(TRACK) 17
3.3.2 曝光機(SCANNER) 20
3.4 量測系統與儀器 22
3.4.1 光學顯微鏡（Optical Microscope） 22
3.4.2 缺陷掃描機（KLA Defect Scan Tool） 22
3.4.3 掃描式電子顯微鏡（Scanning Electron Microscope ,SEM) 23
3.4.4 熱線式風速/溫濕度計 23
3.5 濕度相關公式說明 23
3.5.1 空氣中蒸汽分壓計算 23
3.5.2 濕度相關公式說明 24
3.6 實驗材料 27
3.6.1 光阻（Resist） 27
3.6.2 顯影液（Solution） 27
3.6.3 去離子水（Deionized water） 27
3.7 實驗設計及步驟方法 27
3.7.1 氣態水分子的缺陷圖形 27
3.7.2 氣態水分子污染來源 28
3.7.3 顯影槽層流風壓對機械手臂區相對濕度的影響 29
3.7.4 機械手臂區晶圓受污染驗證 29
第四章 結果與討論 30
4.1 微影製程中的水分子的缺陷形態分析 30
4.2 顯影各步驟濕度比的變化 31
4.3 顯影槽層流風壓對機械手臂區相對濕度的影響 33
4.4 機械手臂區晶圓受微污染造成缺陷影響 34
第五章 結論與建議 41
5.1 結論 41
5.2 建議 42
參考文獻 43

[1] Kitajima, H. and Shiramizu, Y. (1997). Requirements for Contamination Control in the Gigabit Era. IEEE Trans. Semicond. Manuf., 10(2), 267-272.
[2] 吳必鈞(2012)，” 潔淨室氯離子微污染物造成有圖晶圓之金屬線路腐蝕探討”國立交通大學環境工程研究所博士論文
[3] M. F. Hallock, S. K. Hammond, C. J. Hines, S. R Woskie, and M. B. Schenker. “Patterns of chemical use and exposure control in the semiconductor health study”. American Journal of Industrial Medicine.28:681-697,1995.
[4] Whyte W., Cleanroom Technology Fundamentals of design testing and Operation, Wiley InterScience(2001).
[5] ISO（International Organization for Standardization），ISO-14644-1，1999。
[6] 鴻威消防科技股份有限公司網頁，法規資料首頁，http://www.homewelltec.com/law/helpframeset.html?page=source/867.html。
[7] 康育豪，”潔淨室凝結性有機污染物之晶圓表面吸附沉積行為探討”國立交通大學環境工程研究所博士論文，民94。
[8] Whyte W., Cleanroom Technology Fundamentals of design testing and Operation, Wiley InterScience(2001).
[9] 官瑋俐(2001), 半導體廠無塵室中氣態污染物之成分分析. 私立長庚大學化學工程研究所碩士論文.
[10] Forsland M. and Oeilly S. (2000), Prevention of airborne molecular contamination, Semiconductor Fab. Technol., 12th Edition.
[11] Saga K. and Hattori J. (1996), “Identification and removal of trace organic contamination on silicon wafers stored in plastic boxes“, J. Electrochem. Soc., 143(10), 3279-3284.
[12] Saga K. and Hattori, J. “Identification and removal of trace organic contamination on silicon wafers stored in plastic boxes”. J. Electrochem. Soc., Vol. 143, No. 10, October, 1996.
[13]大西謙之、合田陽、黃寶川(1999).半導體廠超級無塵室的化學污染和”PURATEX” 化學空氣過濾器之介紹. 電子月刊,5(9),164-168.
[14] SEMI F21-1102 classification of airborne molecular contamination levels in clean environmentals. Semiconductor Equipment and Materials International. 2001.
[15] K. Saga and T. Hattoril. “Influence of Surface Organic Contamination on the Incubation Time in Low-Pressure Chemical Vapor Deposition. ”J. Electrochem. Soc., Vol.144,No.9,September 1997.
[16] Y. Ishihara, D. Nakajima, and T. Ohmi. “Economical clean dry air system for closed manufacturing system.” IEEE Transactions on Semiconductor Engineering, February, 2000.
[17] Weizhen Lu, Andrew T. Howarth, “Numerical analysis of Indoor Aerosol Particle Deposition and Distribution Two-Zone Ventilation Systemc Building and Environment 31 (1996) 41-50..
[18] Muller, A.J., Psota-Kelty, L.A., Krautter, H.W. and Sinclair, J.D. (1994). ”Volatile Cleanroom Contaminants: Sources and Detection. ” Solid State Technology, 37(9), 61-72.
[19] MacDonald et al. (1993)”Airborne Contamination of a Chemically Amplified Resist. I. Identification of Problem”, Chem. Mater., Vol.5, 348.
[20] Kawai, Y. et al., (1994)”The Effects of an Organic Base in a Chemically Amplified Resist on Patterning Characteristics Using KrF Lithography”, Digest of Papers, MicroProcess ’94, The 7th MicroProcess Conference, 202-203.
[21] Hinsberg, W.D., MacDonald, S.A., Clecak, N.J., and Snyder, C.D. (1994). “ Airborne Contamination of a Chemically Amplified Resist. 2. Effect of Polymer Film Properties on Contamination Rate. “ Chem. Mater., 6(4), 481-488.
[22] Barzaghi S., Pilenga A., Vergani G., and Guadagnuolo S., “Purged gas purification for contamination control of DUV stepper lenses“, Solid State Technol., 44(9), 99-104 (2001).
[23] Hayashi, T., Kusakabe, U., Yanagisawa, Y. and Kamata, T. (1998). Influence of Wafer Backside Organic Contamination on GOI, Proceedings of Ion Implantation Technology, 1, 502-505.
[24] Kinhead, D.A. (1995). Forecast of Airborne Molecular Contamination Limits for 0.25 Micron High Performance Logic Process, Technology Transfer Report 95052812A-TR, SEMATECH, May 31.
[25]劉享星 (2009). “無塵室環境監測使用之Ti-W有圖晶圓於空氣中HCl不同濃度之研究” 國立交通大學工學院永續環境科技學程碩士論文.
[26] Ingrid Peterson, Breaux Louis, Andrew Cross,and Mike von den Hoff,”Yield Management solutions”,Vol.5,pp.39-40,2003.
[27] 陳毅彰 (2006) “積體電路微影製程缺陷因素對線寬影響之研究”，私立南台科技大學電子工程研究所碩士學位論文.
[28] 馮丁樹(2001).“濕空氣之特性”，國立台灣大學生物產業機電工程學系。
[29] ASHRAE 2001 Handbook of Fundamentals, 「American Society of Heating, Refrigerating, and Air Conditioning Engineers, 2001.」。