臺灣博碩士論文加值系統

半導體產業已經存在60年以上，而現在，我們從摸到的或看到的電子產品，例如手機，電腦，監視器，家電等等，都內藏著很多顆的IC晶片。半導體產業一直以來跟隨著市場的IC需求，而市場需求的成長與改變導致此產業持續擴張，伴隨著科技進步和創新去滿足市場需求。中國目前為世界第二大的經濟體，也是IC晶片消耗量最大的國家。由於中國想轉型成為世界第一大的IC出產國，這個野心也造成對美國的威脅，而因此在2018年引發了貿易戰。中國在過去30年的成長極快，經濟的成長率平均落在6%左右，而中國在半導體產業也從1950年至今持續成長。經由策略規劃，中國已在IC設計，製作，封裝，和測試領域上占有一席之地。在本篇研究當中，會分析什麼樣的策略形態能在半導體產業上生存，以及中國如何制定策略來縮短與領先企業之間的能力差距。中國半導體產業也已經慢慢的轉型，例如把國營企業轉為私營企業，以及從抄襲仿冒成為新創大國。中國很有可能超越美國成為世界最大的經濟體，但在半導體產業，中國需更長的時間才能跟上台灣和美國。

The semiconductor industry has existed for over 60 years. Everything we see and touch nowadays, such as computers, mobiles, security, appliances, and consumer products consist of integrated devices called ICs. Throughout the years, semiconductor growth has been driven by the market demand. The increasing growth of demand speeds up technological innovation or disruption, causing the industry to continuously evolve in order to accommodate the demand. China, being the 2nd largest economy in the world, takes up the largest percentage of semiconductor consumption in the world. Its ambition in becoming the world’s semiconductor leader posed a threat to the US and ignited the trade war in 2018. Over the past 30 years or so, the China’s economy has accelerated exponentially, with an average growth rate of 6%. China has a long history in the semiconductor industry, starting in the late 1950’s. Through long-term strategic planning, China is able to establish a foothold in IC design, wafer manufacturing, and packaging and testing. This paper is an analysis of a study regarding the strategic pattern used to survive in the semiconductor industry and how Chinese firms strategized to close the gap from other global leaders. China’s semiconductor industry has gradually gone through the transformation from government-owned to privately owned enterprises, and from copycat culture to #1 patent filer. China could possibly overtake the economy in the US, becoming the largest in the world. However, in terms of the semiconductor sector, China may require a longer time to catch up with Taiwan and the US.

Table of Contents
口試委員會審定書…………………………………………………….. i
Acknowledgement………………………..……………………………. ii
中文摘要………………………………………………………...….… iii
Abstract……………………………………….……………………...... iv
Table of Contents…………………………………………….…............ v
List of Tables…………………………………………………………. vii
List of Figures…………………………………………………….….. viii
Chapter 1 Introduction………………………………………………..... 1
1.1 Background and purpose of the study………………………. 1
Chapter 2 Semiconductor industry and strategies…………………….... 2
2.1 Industry overview………………………………………….... 2
2.2 Strategy to tackle semiconductor industry…………...……… 3
2.3 Identify initial market with commitment………………….… 3
2.4 Heavy investment……………………………......................... 4
2.5 Technology capability…………………………….................. 4
2.6 Competitive advantage………………………….………........ 6
2.7 Barrier to entry…………………………….…………..…..... 7
Chapter 3 History on semiconductor growth………………………..…. 8
3.1 Why semiconductor………………………………………..... 8
3.2 Rise of Japan in DRAM market………….………………….. 8
3.3 Korea’s dominance in DRAM industry………………......... 10
3.4 Taiwan’s R&D institution & foundry service……...……… 11
Chapter 4 Catching up as a latecomer………………………………… 14
4.1 Early era in China’s semiconductor industry…….……..….. 14
4.2 Current China………………………………………………. 14
4.3 Funding from Chinese government………………………… 16
4.4 SMIC’s fast expansion…………………………................... 18
4.5 Hisilicon the top fabless in China……………..……………. 21
Chapter 5 Comparison and insights………………………………....… 25
5.1 Case comparison analysis………………………………….. 25
5.2 Comparison between firms………………….….….............. 26
5.3 Insights and recommendation……………………………… 28
Chapter 6 Conclusion………………………………………………….31
6.1 Conclusion……………………………………….……….... 31
Reference…………………………………………………………...… 32

List of Tables
Table 1: DRAM Shares in Japanese Firms.………………………...…. 10
Table 2: Pure-play foundries ranking in 2017…………………….…... 20
Table 3: Hisilicon & Huawei’s R&D spending……….…....…..……... 22
Table 4: Fabless ranking in 2018……………….….........................….. 23
Table 5: Comparison between 5 firms………………………...…….… 25

List of Figures
Figure 1: Worldwide semiconductor revenue and units………………... 2
Figure 2: Strategic framework for entering semiconductor industry….... 3
Figure 3: Michael Porter’s competitive advantage…………………....... 6
Figure 4: R&D/Capital investment from Japanese & US firms………... 9
Figure 5: Memory market shares between US/Japan/Korea…………... 11
Figure 6: ITRI’s strategy in supporting industries in Taiwan………..... 12
Figure 7: IC consumption market share worldwide to 2019, by region.. 15
Figure 8: Crude oil and chip import amount to China……………..….. 16
Figure 9: CapEx & R&D Investment in SMIC………………………... 19
Figure 10: Technology node between top foundries and IDMs…….…. 20
Figure 11: Huawei’s revenue and R&D spending from 2008-2018…... 21
Figure 12: Huawei’s R&D spending percentage change, 2014-2018…. 22

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