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The CPU computation speed of consumer electronic product increase rapidly due to the progress of electronic technology. Also, the heat generated by CPU increase simultaneously. The other constraint is the limitation of product size. Such that heat pipe and heat sink traditional combination cannot satisfied the cooling application. Small refrigeration and cool liquid double cycles system with large cooling temperature difference and higher heat dissipation rate is much suitable for high power density electronic cooling. In this study cooling pump flow rate, flow direction of evaporator, compressor speed and cooling fan voltage of condenser are investigated the effects on COP and surface temperature of dummy heaters. The experiment results show that when pump flow rate change from 1850 to 2700 c.c./min., COP changed from 3.3 to 4.0 and temperature of dummy heaters all under 45℃. When change flow direction of evaporator from parallel to counter flow, the COP dropped obviously. If the speed of compressor change from 2400 to 5400 rpm, the COP changed from 3.8 to 1.6 due to the increase of compressor work. When the apply voltage of condenser cooling fan change from 12 to 7V, the COP dropped about 0.7. By application of results, the maximum cooling capacity of this small system can reach 500W. And the temperature of dummy heaters is no more than 61℃.
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