臺灣博碩士論文加值系統

本論文研究之晶圓傳送手臂廣泛用於運送晶圓。為改善晶圓傳送效率，將感測器安裝在每個工作站估計運送中的晶圓偏心量。

但是，由於非理想因素，如:光束半徑，機器人運動誤差和系統非線性和不確定性，很難實現高精度偏心量估計，滿足半導體製造的苛刻要求。進一步改善偏心估計精度，之間的關係機器人運動誤差，傳感器校準誤差和偏心量分析識別錯誤。

提出的晶圓偏心量估計技術通過驗證在晶圓運送機器手臂上進行的實驗。該結果表明，所開發的方法可用於提高晶圓處理精度並減少晶圓在半導體製造中的循環時間。

Wafer-handling robot developed in this paper is widely used for wafer-transporting semi-conduction manufacturing. To improve the wafer transport efficiency, optical sensor are installed at each workstation to estimate the wafer eccentricity during transport.
However, due to non-ideal factors such as sensor, robot motion error, system nonlinearity and uncertainty, it is difficult to achieve high-precision eccentricity estimation to meet the demanding requirements of semiconductor manufacturing. Improve on the accuracy of eccentricity estimation, the relationship between robot motion error, sensor calibration error and eccentricity analysis identifies errors.
The proposed eccentricity estimation technique verifies the experiments performed on a wafer processing robot. The results show that the developed method can be used to improve wafer transport positioning in accuracy and reduce cycle time in wafer fabrication.

摘要 I
ABSTRACT II
致謝 III
目錄 IV
表目錄 VI
圖目錄 VII
符號說明 IX
第一章、緒論 1
1.1 研究動機 1
1.2 研究目的 1
1.3 文獻探討 3
1.4 論文大綱 3
第二章、晶圓偏心量分析 4
2.1 偏心量識別的誤差來源 4
2.2 分析方法 4
2.3 偏心量估計 6
2.4 偏心量估計(運動參數誤差) 8
2.5 晶圓凹口所造成估計誤差 9
第三章、晶圓機械手臂 14
3.1 概述 14
3.2 機構設計 14
3.3 運動學分析 22
第四章、實驗 24
4.1 概論 24
4.2 驗證 24
4.3 偏心量估計模擬(晶圓片誤差) 29
4.4 偏心量估計模擬(運動參數誤差): 31
第五章、結論 34
參考文獻 35

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