臺灣博碩士論文加值系統

本研究
主要目的 在 探討使用 不同材質 的奈米等級厚度 鍍膜表面 增強流體噴
嘴的噴霧冷卻系統之冷卻性能。 以 及 探討孔徑為 1.6 mm的二流體噴嘴，經由改
變不同的空氣與液體質量比 (R=0.083、 0.097、 0.119、 0.129、 0.172、 0.194、 0.258、
0.323、 0.332、 0.431、 0.465、 0.575)在固定噴霧高度 H= 50 mm，觀 察 溫度場 之 變
化。
實驗中，加熱系統由銅塊及加熱棒組成，
以銅 為 測試表面 基底， 在 其 表面鍍
上不同之材質薄膜 ，如 :石墨烯 (graphene)轉印 、 石墨烯 (graphene)沉積。加熱銅塊
至指定溫度 350℃ 進行焠火冷卻 實驗， 使用 DI water做為工作流體 。 溫度場量
測， 使用 K-Type熱電偶進行量測，並透過計算、分 析以獲得最佳的 CHF (Critical Heat flux)定義沸騰曲線區域。
實驗結果顯示，不同奈米鍍膜表面下熱傳增強效果最好達到
23.4%，然而最
佳臨界熱通量發生在鍍膜表面為石墨烯沉積時氣液比為 0.119，其 溫度最大的降
幅來到 93.2oC/sec。
關鍵詞：二流體噴嘴、噴霧冷卻、沸騰曲線
、 奈米鍍膜表面 、 CHF

This aim of study used coating surfaces with nano-scale thickness of various materials to explore the cooling performance of spray cooling systems which contain reinforced fluid nozzles. It also observes changes in a temperature field using two-fluid nozzles with a bore diameter of 1.6 mm by changing the air-to-liquid mass ratios (R = 0.083, 0.097, 0.119, 0.129, 0.172, 0.194, 0.258, 0.323, 0.332, 0.431, 0.465, and 0.575) at the fixed spray height of 50 mm.
In the experiment, the heating system comprised copper bars and heating rods. Copper was used as the base for the surface being tested; its surface was coated in thin films of various materials via graphene transfer and deposition. Copper bars were heated to the designated temperature of 350°C to conduct the quenching and cooling experiment, while DI water was used as the working fluid. The temperature field was measured using a type K thermocouple. The highest critical heat flux (CHF) was obtained via calculation and analysis to define the boiling curve regions.
The experiment results showed that the reinforcing effects of heat transfer on different nanocoating surfaces could achieve 23.4% at best. However, the highest CHF occurred when the air-to-liquid mass ratio was 0.119 on the coating surface with graphene deposition. The largest temperature drop reached 93.2oC/sec.
iv
Keywords: Two-fluid nozzles, Spray cooling, Boiling curve, Nanocoating surfaces, CHF

論文審定書
i
中文摘要
ii
ABSTRACT iii
TABLE OF CONTENTS v
LIST OF TABLES viii
LIST OF FIGURES ix
NOMENCLATURE xiii
CHAPTER 1 INTRODUCTION 1
1.1 Introduction 1
1.2 Motivation and background 1
1.3 Research purposes 3
1.4 Literature Review 3
1.4.1 Boiling regimes 7
1.4.2 Enhanced effects 13
1.4.3 Twin-fluid nozzle 20
CHAPTER 2 EXPERIMENT SYSTEM AND EQUIPMENT 26
2.1 Heater system 26
2.2 Fluid circulation system 26
2.2.1 Two-fluid nozzle 26
2.2.2 Working medium 26
2.2.3 Working platform 27
vi
2.3 Data acquisition system ................................................................................................................................................ 27
2.3.1 Temperature record module ................................................................................................................ 27
2.3.2 LabVIEW ........................................................................................................................................................................ 27
2.4 Other experimental peripheral equipment ........................................................................................ 28
2.4.1 Gas flow meter ........................................................................................................................................................ 28
2.4.2 Liquid flow meter ................................................................................................................................................ 28
2.4.3 Power supply .............................................................................................................................................................. 28
CHAPTER 3 EXPERIMENTAL METHODSAND PROCEDURE............................................ 37
3.1 Spray cooling circulation system .................................................................................................................... 37
3.1.1 Two-fluid nozzle .................................................................................................................................................. 37
3.1.2 Spray test area .......................................................................................................................................................... 37
3.1.3 Fluid circulation system ............................................................................................................................ 38
3.2 Test surface preparation ................................................................................................................................................ 38
3.3 Temperature measurement system ................................................................................................................ 40
CHAPTER 4 THEORETICAL ANALYSIS .................................................................................................................... 43
4.1 Air to liquid ratio (R) ........................................................................................................................................................ 43
4.2 Heat flux (q") ................................................................................................................................................................................ 43
4.3 Heat transfer coefficient (h) .................................................................................................................................... 43
CHAPTER 5 UNCERTAINTY ANALYSIS .................................................................................................................... 44
CHAPTER 6 RESULTS AND DISCUSSION .............................................................................................................. 47
6.1 The cooling measurements ...................................................................................................................................... 47
vii
6.1.1. Quench curve of the polished copper surface .......................................................... 48
6.1.2. Quench curve of the single-layer graphene transfer on copper surface .................................................................................................................................................................................. 53
6.1.3. Quench curve of the graphene deposition on copper surface ............ 59
6.1.4. Boiling curve of the polished copper surface ............................................................ 64
6.1.5. h and q' vs ΔT of the polished copper surface ........................................................ 67
6.1.6. Boiling curve of the single-layer graphene transfer on copper surface .................................................................................................................................................................................. 70
6.1.7. h and q' vs ΔT of the single-layer graphene transfer on copper surface .................................................................................................................................................................................. 73
6.1.8. Boiling curve of the graphene deposition on copper surface ............ 76
6.1.9. h and q' vs ΔT of the graphene deposition on copper surface ........ 79
6.1.10. Heat flux under different ratio of smooth and nanotextured surface .................................................................................................................................................................................. 82
6.1.11. Nanotextured surface heat transfer effect enhancement .......................... 83
CHAPTER 7 CONCLUSION AND RECOMMENDATION .......................................................... 128
7.1 Conclusions ................................................................................................................................................................................ 128
7.2 Recommendations ............................................................................................................................................................ 130
REFERENCES .................................................................................................................................................................................................................... 131
APPENDIX A ........................................................................................................................................................................................................................ 139
viii
LIST OF TABLES
Table 2-1 Specifications of twin-fluid nozzle ............................................................................................................................ 30
Table 2-2 Specifications of gas flow meter .................................................................................................................................... 31
Table 2-3 Specifications of liquid flow meter ............................................................................................................................ 32
Table 2-4 Specifications of Power supply ...................................................................................................................................... 33
Table 3-1 Experimental parameters .......................................................................................................................................................... 41
Table 5-1 Uncertainty analysis .......................................................................................................................................................................... 46
Table 6-1 The parameters of critical heat flux under different ratio for smooth and nano-texted surface (CHF) ...................................................................................................................................................................... 86
Table 6-2 Boiling curve parameter under different ratio for smooth and nano-texted surface .................................................................................................................................................................................................................................... 87
Table 6-3 The parameters of heat transfer coefficient under different ratio for smooth and nano-texted surface .............................................................................................................................................................................. 88
ix
LIST OF FIGURES
Figure 1-1 The flow pattern map .................................................................................................................................................................. 25
Figure 1-2 Boiling curve ............................................................................................................................................................................................ 25
Figure 2-1 Fluid circulation system .......................................................................................................................................................... 34
Figure 2-2 Data acquisition system............................................................................................................................................................ 35
Figure 2-3 Other experimental peripheral equipment .................................................................................................... 36
Figure 3-1 Schematic of experimental setup .............................................................................................................................. 42
Figure 6-1 Integrated cooling curve of the polished copper surface at Ratio= (a) 0.083~0.194 (b) 0.258~0.575 .................................................................................................................... 89
Figure 6-2 Integrated heat flux of the polished copper surface at Ratio= (a) 0.083~0.194 (b) 0.258~0.575 .................................................................................................................... 90
Figure 6-3 Quench curve of the polished copper surface at Ratio= (a) 0.083 (b) 0.097 (c) 0.119 (d) 0.129........................................................................................ 91
Figure 6-4 Quench curve of the polished copper surface at Ratio= (a) 0.172 (b) 0.194 (c) 0.258 (d) 0.323 ...................................................................................... 92
Figure 6-5 Quench curve of the polished copper surface at Ratio= (a) 0.332 (b) 0.431 (c) 0.465 (d) 0.575 ...................................................................................... 93
Figure 6-6 Integrated cooling curve of the single-layer graphene transfer on copper surface at Ratio= (a) 0.083~0.194 (b) 0.258~0.575 .................................................................................... 94
Figure 6-7 Integrated heat flux of the single-layer graphene transfer on copper surface at Ratio= (a) 0.083~0.194 (b) 0.258~0.575 .................................................................................................. 95
Figure 6-8 Quench curve of the single-layer graphene transfer on copper surface at
x
Ratio= (a) 0.083 (b) 0.097 (c) 0.119 (d) 0.129........................................................................................ 96
Figure 6-9 Quench curve of the single-layer graphene transfer on copper surface at Ratio= (a) 0.172 (b) 0.194 (c) 0.258 (d) 0.323 ...................................................................................... 97
Figure 6-10 Quench curve of the single-layer graphene transfer on copper surface at Ratio= (a) 0.332 (b) 0.431 (c) 0.465 (d) 0.575 ...................................................................................... 98
Figure 6-11 Integrated cooling curve of the graphene deposition on copper surface at Ratio= (a) 0.083~0.194 (b) 0.258~0.575 .................................................................................................................... 99
Figure 6-12 Integrated heat flux of the graphene deposition on copper surface at Ratio= (a) 0.083~0.194 (b) 0.258~0.575 ................................................................................................................ 100
Figure 6-13 Quench curve of the graphene deposition on copper surface at Ratio= (a) 0.083 (b) 0.097 (c) 0.119 (d) 0.129.................................................................................... 101
Figure 6-14 Quench curve of the graphene deposition on copper surface at Ratio= (a) 0.172 (b) 0.194 (c) 0.258 (d) 0.323 .................................................................................. 102
Figure 6-15 Quench curve of the graphene deposition on copper surface at Ratio= (a) 0.332 (b) 0.431 (c) 0.465 (d) 0.575 .................................................................................. 103
Figure 6-16 Integrated heat transfer coefficient of the polished copper surface at Ratio= (a) 0.083~0.194 (b) 0.258~0.575 ................................................................................................................ 104
Figure 6-17 Boiling curve of the polished copper surface at Ratio= (a) 0.083 (b) 0.097 (c) 0.119 (d) 0.129.................................................................................... 105
Figure 6-18 Boiling curve of the polished copper surface at Ratio= (a) 0.172 (b) 0.194 (c) 0.258 (d) 0.323 .................................................................................. 106
Figure 6-19 Boiling curve of the polished copper surface at Ratio= (a) 0.332 (b) 0.431 (c) 0.465 (d) 0.575 .................................................................................. 107
Figure 6-20 h and q' vs ΔT of the polished copper surface at
xi
Ratio= (a) 0.083 (b) 0.097 (c) 0.119 (d) 0.129.................................................................................... 108
Figure 6-21 h and q' vs ΔT of the polished copper surface at Ratio= (a) 0.172 (b) 0.194 (c) 0.258 (d) 0.323 .................................................................................. 109
Figure 6-22 h and q' vs ΔT of the polished copper surface at Ratio= (a) 0.332 (b) 0.431 (c) 0.465 (d) 0.575 .................................................................................. 110
Figure 6-23 Integrated heat transfer coefficient of the single-layer graphene transfer on copper surface at Ratio= (a) 0.083~0.194 (b) 0.258~0.575 .............................................. 111
Figure 6-24 Boiling curve of the single-layer graphene transfer on copper surface at Ratio= (a) 0.083 (b) 0.097 (c) 0.119 (d) 0.129.................................................................................... 112
Figure 6-25 Boiling curve of the single-layer graphene transfer on copper surface at Ratio= (a) 0.172 (b) 0.194 (c) 0.258 (d) 0.323 .................................................................................. 113
Figure 6-26 Boiling curve of the single-layer graphene transfer on copper surface at Ratio= (a) 0.332 (b) 0.431 (c) 0.465 (d) 0.575 .................................................................................. 114
Figure 6-27 h and q' vs ΔT of the single-layer graphene transfer on copper surface at Ratio= (a) 0.083 (b) 0.097 (c) 0.119 (d) 0.129.................................................................................... 115
Figure 6-28 h and q' vs ΔT of the single-layer graphene transfer on copper surface at Ratio= (a) 0.172 (b) 0.194 (c) 0.258 (d) 0.323 .................................................................................. 116
Figure 6-29 h and q' vs ΔT of the single-layer graphene transfer on copper surface at Ratio= (a) 0.332 (b) 0.431 (c) 0.465 (d) 0.575 .................................................................................. 117
Figure 6-30 Integrated heat transfer coefficient of the graphene deposition on copper surface at Ratio= (a) 0.083~0.194 (b) 0.258~0.575 ................................................................................ 118
Figure 6-31 Boiling curve of the graphene deposition on copper surface at Ratio= (a) 0.083 (b) 0.097 (c) 0.119 (d) 0.129.................................................................................... 119
Figure 6-32 Boiling curve of the graphene deposition on copper surface at
xii
Ratio= (a) 0.172 (b) 0.194 (c) 0.258 (d) 0.323 .................................................................................. 120
Figure 6-33 Boiling curve of the graphene deposition on copper surface at Ratio= (a) 0.332 (b) 0.431 (c) 0.465 (d) 0.575 .................................................................................. 121
Figure 6-34 h and q' vs ΔT of the graphene deposition on copper surface at Ratio= (a) 0.083 (b) 0.097 (c) 0.119 (d) 0.129.................................................................................... 122
Figure 6-35 h and q' vs ΔT of the graphene deposition on copper surface at Ratio= (a) 0.172 (b) 0.194 (c) 0.258 (d) 0.323 .................................................................................. 123
Figure 6-36 h and q' vs ΔT of the graphene deposition on copper surface at Ratio= (a) 0.332 (b) 0.431 (c) 0.465 (d) 0.575 .................................................................................. 124
Figure 6-37 Heat flux under different ratio of the polished copper surface ............................ 125
Figure 6-38 Heat flux under different ratio of the single-layer graphene transfer on copper surface ........................................................................................................................................................................................................ 126
Figure 6-39 Heat flux under different ratio of the graphene deposition on copper surface ................................................................................................................................................................................................................................ 127

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