臺灣博碩士論文加值系統

現今晶片黏結膜常用環氧樹脂當作基底與不同的固化劑做交聯反應，因其在高溫交聯後具有較低的收縮程度、較好的黏著性、較強的硬度。然而因環氧樹脂較硬而脆的特性，使其具有較低抗衝擊性及低韌性成為一大問題，因此我們開發了在此環氧樹脂系統中加入丙烯酸樹脂共聚物(acrylate resin copolymer)作為增韌劑強化其韌性並形成半IPN結構，以增強環氧樹脂-酚醛樹脂網絡的韌性。實驗中主要會透過調整懸浮聚合實驗(Suspension polymerization)合成不同玻璃轉化溫度之壓克力樹脂，搭配與不同固化劑組成比例引入環氧樹脂體系中，來設計最佳晶片黏結膜的最佳配方，隨之而來的晶片黏結膜顯示出了較高的成膜性，可以從GPC分析結果得知我們合成出來的壓克力樹脂皆屬於高分子的產物(分子量大約介於50萬)，因此對於後續製膜的加工性能會有所降低，因此調整添加比例會是本實驗主要研究的目標，也可以藉由DMA數據分析結果得知當添加較多比例的壓克力樹脂會使得玻璃轉化溫度(Tg)有明顯的提升(約150℃)，而在DMA數據上也有明顯顯示出兩個玻璃轉化溫度(Tg)點(壓克力樹脂相及環氧樹脂相)這代表著相分離的情況發生，但由於壓克力樹脂中主要配方的Methyl methacrylate (MMA)與環氧樹脂相溶性較差的緣故，會使得製膜難度提高導致晶片黏結膜應力破碎，因此調整出最適當的晶片黏結膜製膜手法以及提高成膜性，完成晶片黏結膜的基礎配方及技術開發是本實驗主要的研究方向及目標。

Nowadays,epoxy resin is often used as a substrate for wafer bonding film to cross-link with different curing agents because it has lower shrinkage, better adhesion and stronger hardness after cross-linking at high temperature. However, due to the hard and brittle nature of epoxy resin, it has low impact resistance and low toughness. Therefore, we developed an epoxy resin system by adding acrylate resin copolymer as a toughening agent to strengthen its toughness and form a semi-IPN structure to enhance the toughness of epoxy-phenol resin network. In the experiments, the best formulation of the epoxy resin system was designed by adjusting the composition ratio of acrylate resin with different curing agents at different glass transition temperatures in Suspension polymerization experiments to design the best formulation of the epoxy resin film, and the resultant film showed high film-forming properties, which can be seen from the GPC analysis results.We synthesized acrylic resins are all macromolecular products(molecular weight :500,000),so the processing performance of the subsequent film will be reduced, so adjusting the addition ratio will be the main goal of this experiment, and we can also learn from the DMA data analysis results that when adding a larger proportion of acrylic resins will make the glass transition temperature(Tg)has a significant increase(150℃).The DMA data also clearly shows two glass transition temperature(Tg)points(acrylic resin phase and epoxy resin phase), which represents the occurrence of phase separation, but because the main formulation of acrylic resin Methyl methacrylate(MMA)is less compatible with epoxy resin, it will make the film making difficult and lead to broken wafer bonding film stress.Therefore, it is the main research direction and goal of this experiment to adjust the most suitable film making method and improve the film forming property, and to complete the basic formulation and technology development of wafer bonding film.

摘要 i
Abstract iii
致謝 v
目錄 vi
表目錄 viii
圖目錄 x
第一章 緒論 1
1.1 研究背景與動機 1
第二章 文獻回顧 2
2.1 環氧樹脂 2
2.1.1 環氧樹脂的歷史與發展 2
2.1.2 環氧樹脂的定 義 3
2.2 環氧樹脂的加工與反應機制 8
2.2.1 環氧樹脂開環機制 8
2.2.2 環氧樹脂固化反應 9
2.2.3 環氧樹脂的增韌機制 19
第三章 實驗方法與材 料 29
3.1 壓克力樹脂增韌劑材料 29
3.1.1 環氧樹脂複合材料 30
3.2 實驗儀器 31
3.2.1 製備壓克力所需儀器 31
3.2.2 製備環氧樹脂複合材料所需儀器 31
3.2.3 材料性質測試各項儀器 32
第四章 實驗設計與儀器分析 33
4.1.1 壓克力高分子量之增韌劑製備 33
4.1.2 低分子量之壓克力增韌劑製備 36
4.1.3 環氧樹脂複合材料的製備 38
4.1.4 低分子量 之壓克力增韌劑製備環氧樹脂複合材料 45
4.2 樣品性質檢測與儀器分析 47
4.2.1 壓克力增韌劑性質檢測 47
4.2.2 環氧樹脂複合材料儀器分析 50
第五章 結果與討論 52
5.1 利用懸浮聚合法合成高分子 量之壓克力增韌劑 52
5.1.1 凝膠滲透層析儀分析分子量 (GPC) 52
5.1.2 差式掃描熱量分析 (DSC) 54
5.1.3 熱重 分析儀 (TGA) 55
5.2 利用懸浮聚合法合成低分子量壓克力增韌劑 56
5.2.1 凝膠滲透層析儀分析分子量 (GPC) 56
5.2.2 差式掃描熱量分析 (DSC) 58
5.2.3 熱重 分析儀 (TGA) 59
5.3 不同 Tg高分子量壓克力增韌環氧樹脂複合材料 60
5.3.1 環氧 -酚醛固化系統之複合材料 60
5.3.2 環氧 -酸酐固化系統之複合材料 80
5.4 低分子量之壓克力增韌環氧樹脂複合材料 99
5.4.1 環氧 -酚醛固化系統之複合材料 99
5.4.2 環氧 -酸酐固化系統之複合材料 104
第六章 結論 109
第七章 參考文獻 110

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