臺灣博碩士論文加值系統

本篇論文提出了一種系統級的熱建模方法，將所有系統元件簡化為晶片邊界的等效熱傳導係數。我們應用熱學和電路定理的技巧進行簡化，並與先前的工作相結合，包括電路板建模、擴散熱阻等。在實驗驗證中，我們測試了德州儀器的 AWR1843 雷達傳感器（單熱源）和三星 Galaxy S4 的智能手機（雙熱源）。實驗結果顯示，簡化前和簡化後的模型，用 Ansys Icepak 模擬的運行時間分別減少了 11.64 倍和 12.61 倍。其中，隨著運行時間的改善，AWR1843 的均方根誤差僅約為 0.657 ℃，Galaxy S4 各源的誤差為 0.684 ℃ 和 0.694 ℃。最後，我們將我們的簡化模型以有限差分法演示給系統級和晶片級混合模擬，使得運行時間減少了 1000 倍以上。

This work presents a system-level thermal modeling method, which simplifies all system components to effective heat transfer coefficients for the boundaries of the integrated circuit. We apply several thermal and circuit theorem techniques for simplification and combine them with previous work, including PCB modeling, spreading resistance, etc. In experimental validation, we test the AWR1843 radar sensor of Texas Instrument (single source) and smartphone of Samsung Galaxy S4 (multiple sources). The experimental result shows that the model before and after simplifying reduced the runtime by 11.64× and 12.61× simulated with Ansys Icepak. With the runtime improvement, the root-mean-square (RMS) error is only about 0.657 ℃ for AWR1843 and 0.684 ℃ & 0.694 ℃ for each source of Galaxy S4. Ultimately, we also demonstrate our simplified model with finite difference method to a system-level and chip-level simulation hybrid, where the runtime reduces by over 1000×.

Chinese Abstract i
English Abstract ii
Acknowledgements iii
Contents iv
1 Introduction 1
1.1 Motivation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.2 Related Work . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
1.3 Contributions of This Work . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.3.1 Constructed Thermal Resistance Model . . . . . . . . . . . . . . . . . 3
1.3.2 Simplified System Components to HTCs Boundaries . . . . . . . . . . 3
1.3.3 Combined Chip-level Simulation with System-level Structures in Ultra-
Fast Time . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.4 Organization of the Thesis . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2 Preliminary 5
2.1 Conduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2.1.1 One-Dimensional Thermal Model . . . . . . . . . . . . . . . . . . . . 5
2.2 Free Convection and Radiation . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2.2.1 Thermal Radiation . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2.2.2 Natural Convection . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
3 Methodology of Heat Transfer Coefficients Estimation and Temperature Calculation
9
3.1 Methodology Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
3.1.1 Compute Thermal Resistance and Convert to Effective HTCs . . . . . . 9
iv
3.1.2 Combine Chip-Level Thermal Simulation with System-Level Structure 10
3.2 Thermal Spreading Resistance . . . . . . . . . . . . . . . . . . . . . . . . . . 11
3.3 Heat Transfer in Print Circuit Board . . . . . . . . . . . . . . . . . . . . . . . 12
3.4 Techniques for Simplifying . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
3.4.1 Common Thermal Resistance . . . . . . . . . . . . . . . . . . . . . . 14
4 Validating Model Formulation and Solution Methods 18
4.1 Radar Sensor Model . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
4.2 Smartphone Model . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
5 Experimental Results 23
5.1 Experimental Setting . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
5.2 Experimental Results and Discussion . . . . . . . . . . . . . . . . . . . . . . . 23
6 Conclusion 26
Bibliography 27

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