臺灣博碩士論文加值系統

摘要...i
Abstract...ii
誌謝...iii
目錄...iv
表目錄...vii
圖目錄...ix
第一章 緒論...1
1.1 研究背景...1
1.2 研究目的...2
第二章 文獻回顧...3
2.1 印刷電路板...3
2.1.1 銅箔基板...4
2.1.2 結構種類...5
2.1.3 電路板製程...6
2.1.4 銅箔厚度...6
2.1.5 銅箔分類...8
2.2 拆板分片...9
2.2.1 分板方法...10
2.2.2 分板機種類...11
2.2.3 專利檢索...11
2.3 兩片現象...12
2.3.1 投板時兩片...13
2.3.2 兩片現象文獻...14
2.4 機械加工...15
2.4.1 磨削加工...15
2.4.2 加工動作...16
2.5 六個標準差的品質管制...17
2.5.1 DMAIC...18
2.5.2 高階系統圖...18
2.5.3 失效模式與效應分析...19
第三章 系統架構...23
3.1 定義階段...23
3.1.1 所需資源估計...24
3.1.2 系統規格...25
3.2 量測階段...26
3.2.1 特性要因圖...26
3.2.2 優先矩陣...26
3.3 薄板送板機...31
3.3.1 機架組...32
3.3.2 昇降機構組...33
3.3.3 移載機構組...34
3.3.4 輸送機構組...35
3.4 去毛邊機構組...38
3.4.1 系統架構...38
3.4.2 機構組成...40
3.4.3 控制面板...42
3.4.4 動作說明...43
3.4.5 I/O配置...44
第四章 失效模式與效應分析...45
4.1 銅屑集塵...45
4.2 皮帶跳齒...47
第五章 結果與討論...49
5.1 結論...49
5.2 未來展望...49
參考文獻...50
Extended Abstract...54

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