臺灣博碩士論文加值系統

模糊理論在晶圓隱形雷射切割技術中的應用，目標是提升切割參數的精度與效率。隨著科技進步和電動車產業的發展，半導體晶片的需求急速增加，促使晶圓切割技術向更高效、更精確的方向發展。相較於傳統的刀片切割和雷射切割技術，隱形雷射切割技術能夠避免刀片切割造成的崩邊和雷射切割的熱損傷，提供一種無應力且無熱損傷的解決方案。本研究通過模糊控制系統，採用分層設定的方法來優化切割參數。系統的第一層根據加工物的厚度和金屬層的厚度來確定最適合的雷射功率；第二層則利用最終晶片厚度和第一層確定的雷射功率作為輸入，計算出最佳的打點高度。這樣的參數設定旨在提升切割質量和效率，同時也驗證模糊控制系統在實際應用中的效果。實驗結果顯示，模糊控制系統能顯著提高切割精度和效率，具體表現在切割成功率100%、材料消耗減少66%、能耗降低4%和參數調整工時節省50%。模糊控制系統在雷射功率控制上的精確性超過人工設定，打點高度的設置也得到顯著改善。研究證明模糊理論在晶圓隱形雷射切割中具有廣泛的應用潛力，未來研究可結合人工智慧技術進一步提升切割參數的自動化設定，以提高生產效率和產品質量。

The application of fuzzy theory in stealth laser dicing technology for wafers aims to enhance the precision and efficiency of cutting parameters. With technological advancements and the growth of the electric vehicle industry, the demand for semiconductor chips has rapidly increased, driving wafer cutting technology towards greater efficiency and precision. Compared to traditional blade cutting and laser cutting techniques, stealth laser dicing technology can avoid the chipping caused by blade cuts and the thermal damage caused by laser cuts, providing a stress-free and thermal damage-free solution. This study optimizes cutting parameters through a fuzzy control system using a layered setting method. The first layer determines the most suitable laser power based on the thickness of the workpiece and the metal layer; the second layer uses the final wafer thickness and the laser power determined in the first layer as inputs to calculate the optimal scribing height. These parameter settings aim to enhance cutting quality and efficiency while also verifying the practical application effects of the fuzzy control system. Experimental results show that the fuzzy control system significantly improves cutting precision and efficiency, achieving a 100% cutting success rate, a 66% reduction in material consumption, a 4% reduction in energy usage, and a 50% reduction in parameter adjustment labor time. The precision of the fuzzy control system in controlling laser power surpasses manual settings, and the optimization of scribing height is also significantly improved. The study demonstrates that fuzzy theory has extensive potential applications in stealth laser dicing of wafers. Future research may integrate artificial intelligence technology to further enhance the automation of cutting parameter settings, thereby improving production efficiency and product quality.

摘要..........................................................................................................................i
英文摘要.................................................................................................................ii
致謝........................................................................................................................iii
目錄.........................................................................................................................iv
圖目錄..................................................................................................................viii
表目錄..................................................................................................................xiii
第一章 緒論
1.1 研究背景與動機..................................................................................................1
1.2 研究目的...............................................................................................................................4
1.3 論文架構.............................................................................................................5
第二章 晶圓切割簡述
2.1半導體封裝簡介..................................................................................................6
2.1.1晶圓構造........................................................................................................6
2.1.2封裝流程.........................................................................................................................7
2.2晶圓切割.............................................................................................................9
2.2.1刀片切割.......................................................................................................9
2.2.2雷射切割.....................................................................................................12
2.2.3隱形雷射切割..............................................................................................14
2.2.4切割效能比較.............................................................................................................16
第三章 研究方法
3.1 製程參數說明....................................................................................................17
3.1.1測試樣品條件...............................................................................................17
3.1.2控制參數......................................................................................................18
3.1.3條件與參數對應...........................................................................................18
3.1.4額外現象說明...............................................................................................20
3.2 模糊理論..........................................................................................................25
3.2.1模糊理論概述..............................................................................................25
3.2.2模糊集合和隸屬函數.................................................................................................27
3.2.3模糊邏輯.....................................................................................................28
3.2.4模糊理論應用..............................................................................................29
3.2.5 模糊控制器.................................................................................................30
3.3 系統設計..........................................................................................................31
3.3.1 模糊控制器設定說明..................................................................................31
3.3.2 雷射功率設定.............................................................................................32
3.3.3 打點高度設定.............................................................................................35
第四章 實驗結果與分析
4.1 系統測試..........................................................................................................38
4.1.1 雷模糊控制器執行雷射輸出功率測試........................................................38
4.1.1.1 加工物厚度600μm雷射功率測試......................................................39
4.1.1.2 加工物厚度650μm雷射功率測試......................................................41
4.1.1.3 加工物厚度700μm雷射功率測試......................................................44
4.1.1.4 加工物厚度750μm雷射功率測試......................................................46
4.1.1.5 加工物厚度800μm雷射功率測試...............................................................49
4.1.2 打點位置測試.............................................................................................50
　　　4.1.2.1 加工物厚度 600μm打點高度測試..............................................................51
4.1.2.1.1晶圓厚度125μm，加工物厚度600μm打點高度測試.....................52
4.1.2.1.2晶圓厚度150(200) μm，加工物厚度600μm打點高度測試...........55
4.1.2.1.3晶圓厚度175(130) μm，加工物厚度600μm打點高度測試...........57
4.1.2.2加工物厚度 650μm打點高度測試................................................................60
4.1.2.2.1晶圓厚度125μm，加工物厚度650μm打點高度測試.....................60
4.1.2.2.2晶圓厚度150(200) μm，加工物厚度650μm打點高度測試...........63
4.1.2.2.3晶圓厚度175(130) μm，加工物厚度650μm打點高度測試...........65
4.1.2.3加工物厚度 700μm打點高度測試................................................................68
4.1.2.3.1晶圓厚度125μm，加工物厚度700μm打點高度測試.....................68
4.1.2.3.2晶圓厚度150(200) μm，加工物厚度700μm打點高度測試...........71
4.1.2.3.3晶圓厚度175(130) μm，加工物厚度700μm打點高度測試...........73
4.1.2.4加工物厚度 750μm打點高度測試................................................................76
4.1.2.4.1晶圓厚度125μm，加工物厚度750μm打點高度測試.....................76
4.1.2.4.2晶圓厚度150(200) μm，加工物厚度750μm打點高度測試...........79
4.1.2.4.3晶圓厚度175(130) μm，加工物厚度750μm打點高度測試...........81
4.1.2.5加工物厚度 800μm打點高度測試................................................................84
4.1.2.5.1晶圓厚度125μm，加工物厚度800μm打點高度測試.....................84
4.1.2.5.2晶圓厚度150(200) μm，加工物厚度800μm打點高度測試...........87
4.1.2.5.3晶圓厚度175(130) μm，加工物厚度800μm打點高度測試...........89
4.2 實驗結果............................................................................................................92
4.3 結果分析.............................................................................................................94
第五章 結論與未來展望
5.1研究貢獻..........................................................................................................95
5.2未來發展趨勢...................................................................................................96
第六章 參考文獻........................................................................................................................97

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