臺灣博碩士論文加值系統

本論文開發出適用於先進封裝製程材料的高分子異質接合技術及新型HRDL (Hyper Re-distribution Layer)之可堆疊中介層整合平台結構。其主要目的為達成低熱預算且具成本效益的製程技術的同時，最大限度地降低熱膨脹係數差異及翹曲造成的後續可靠度問題。為此，本論文主要針對三款高分子材料進行開發及研究。
首先，一款低熱膨脹係數的感光型聚醯亞胺為基底的PSPI-314在開發後，針對其微影製程、附著性強度、可靠度測試等進行了深入的研究和改進，使其能有效作為重佈線製程中的保護層，並應用於扇出型封裝技術中。此外，本研究透過電漿前處理有效降低接觸角，提升銅與感光型聚醯亞胺的表面能以及加入添加劑大幅提升與銅金屬接觸介面之附著性。本款材料的優勢在於其低熱膨脹係數，使其在進行熱循環可靠度測試後，其仍然保有穩定的電阻值以及良好的附著力強度。
其針對已商用化的低玻璃轉化溫度的感光型聚醯亞胺為基底的Fuji Film進行研究，成功將其應用於低溫及室溫的異質接合結構中。玻璃轉化溫度對於高分子接合至關重要，若過低的玻璃轉化溫度會導致後續製程之高分子材料不穩定，而過高的玻璃轉化溫度會使低溫接合介面品質、接合強度不如預期，本論文針對玻璃轉化溫度對接合結果的影響進行了討論。本高分子材料在經過測試後，除了有良好之接合品質外，也有優異的接合強度、電性表現。經過可靠度測試後，阻值無明顯變化。
此外，本研究進一步將此材料應用於新型HRDL可堆疊中介層整合平台結構。相較於傳統的半加成製程(SAP)，HRDL堆疊結構能顯著減少多層RDL中介層的翹曲，其翹曲程度至少減少20倍。基於聚合物混合接合的HRDL堆疊結構在接合溫度180度的大氣環境中進行，其接合品質和強度都非常出色，斷裂面直接碎於矽晶片區域而非接合介面，證明了其良好的接合強度。在經過1000次熱循環和168小時無偏壓加速應力的可靠度測試後，其電阻變化小於1.5%，證明了其穩定性。另外，HRDL結構使用雷射去接合材料做為暫時性接合材料，而暫時性接合在先進封裝中也是相當重要的製程之一，因此，本研究也針對雷射去接合的機制進行討論，並歸納了一些雷射去接合製程中樣品可能受到的損傷以及其解決方式。此外，這款Fuji Film高分子材料也應用於室溫接合。經過1小時的200-250度退火，該材料也能獲得良好的接合品質和強度，其碎裂區同樣發生於矽晶片區非接合介面，經過可靠度測試後，阻值變化接近小於2.5%，顯示出優秀的穩定性。
本論文研究的第三款高分子材料為以環氧樹脂為基底的DPAS 100，這款材料的主要特點是其CTE（熱膨脹係數）與銅相近，大大減少了因升溫導致的CTE不匹配問題。此材料在180-250度低溫接合時，也能達到良好的接合品質、強度和電性表現。最後，本論文也對金屬接合進行了研究。以往的研究中，開發了金屬鈍化層接合技術來避免銅氧化，顯著降低了接合溫度。本論文針對金屬鈍化層使用無電鍍沉積法，與業界常用的物理氣相沉積法(PVD)相比，無電鍍沉積法因可以在大氣條件下將金屬鈍化層直接選擇性的鍍到銅的表面上，無須額外的微影製程，因此可以簡化製程，進而提高產量、降低生產成本。本論文採用聚合物基的無電鍍銀金屬鈍化層混合接合結構，達成大氣條件下160度下接合300秒後，仍能保持良好的接合品質、接合強度及電性表現（<10-8 Ω·cm²）。

This thesis develops a polymer-based hybrid bonding technology and a novel HRDL (Hyper Re-distribution Layer) stackable interposer platform structure suitable for advanced packaging applications. The research goal is to achieve a low thermal budget and cost-effective process technology while minimizing the issues caused by the CTE (coefficient of thermal expansion) mismatch and warpage that cause the reliability issue. To achieve the goal, three types of polymer materials have been developed and investigated in this thesis.
First, a developed PSPI-based (photosensitive polyimide-based) with a low CTE, named PSPI-314 was studied with extensive investigations. Optimizations were performed on its lithography process, adhesion strength, and reliability testing, enabling its effective use as a protective layer in the RDL (re-distribution layer) process and its application in fan-out packaging technology. Additionally, plasma pretreatment effectively reduced the contact angle, enhancing the surface energy between Cu and the PSPI. Adding additives significantly improved the adhesion strength at the Cu/PSPI interface. The advantage of PSPI-314 lies in its low CTE, allowing it to maintain stable resistance and outstanding adhesion strength on the Cu surface after thermal cycling reliability tests.
Second, a commercial PSPI with a low glass transition temperature (Tg) , named Fuji Film E19, was successfully applied to low-temperature and room-temperature hybrid bonding schemes. The Tg is crucial in polymer bonding since a too low Tg results in instability in subsequent high-temperature processes, while a too high Tg produces low bonding quality and poor bonding strength in low bonding temperature conditions. This thesis discusses the impact of the Tg on bonding results. In conclusion, Fuji Film E19 demonstrated excellent bonding quality, bonding strength, and electrical performance, with no significant change in resistance values after reliability testing.
Furthermore, E19 was applied in a novel HRDL stackable interposer platform. Compared to conventional semi-additive processes (SAP), the HRDL stackable platform significantly reduces warpage in multilayer RDL structure by at least 20 times. The HRDL stackable structure, based on polymer-based hybrid bonding, performed excellently in bonding quality and bonding strength after bonding in an atmospheric environment at 180 °C, with fracture area occurring directly in the silicon wafer rather than the bonding interface, proving its excellent bonding strength. After 1000 cycles of TCT and 168 hours of un-biased HAST, the resistance change was less than 1.5%, demonstrating its good stability. The HRDL structure used laser release materials as temporary bonding materials, which is crucial in advanced packaging processes. This thesis also discusses the laser release mechanism, summarizing potential sample damage during the laser release process and the solutions. Additionally, the E19 PSPI material was used for room temperature bonding. After 1 hour of annealing at 200-250 °C, the bonded material achieved excellent bonding quality and bonding strength, with fractures area occurring in the silicon wafer rather than the bonding interface. After reliability testing, the resistance change was close to less than 2.5%, indicating excellent stability.
The third polymer material studied in this thesis was an epoxy-based DPAS 100, characterized by its CTE being close to that of copper, significantly reducing CTE mismatch issues caused by the high-temperature process. DPAS 100 also achieved excellent bonding quality, bonding strength, and electrical performance at 180-250 °C low bonding temperature. Finally, low-temperature metal bonding was studied. Previous research developed a metal passivation layer bonding technology to avoid copper oxidation, significantly reducing bonding temperature. This thesis used an electroless plating method for the metal passivation layer. Compared to the industry standard physical vapor deposition (PVD) process, the electroless plating method can directly selectively deposit the metal passivation layer onto the copper surface under atmospheric conditions without additional lithography processes, thus simplifying the process, increasing throughput, and reducing production costs. This thesis achieved a polymer-based electroless Ag metal passivation layer hybrid bonding at 160 °C for 300 seconds under atmospheric with excellent bonding quality, bonding strength, and electrical performance (<10-8 Ω·cm²).

Abstractiv
Contentviii
Figure Captionsxi
Table Captionsxxi
Chapter 1 Introduction1
1.1General Background of 3DIC1
1.2Introduction of Bonding Technology2
1.3Organization of the Thesis4
Chapter 2 Investigation of PSPI Featuring Low CTE and Superior Adhesion for Advanced Packaging Applications 10
2.1Introduction10
2.2Preparation of Materials and Samples11
2.2.1PSPI and Samples Fabrication11
2.2.2Abilities of PSPI for Lithography Process12
2.3Adhesion Strength Enhancement for PSPI13
2.3.1Four-Point Bending System13
2.3.2Adhesion Test on Different Substrate15
2.3.3Adhesion Improvement16
2.4Reliability Investigation of PSPI19
2.4.1Chemical Resistance Test19
2.4.2Adhesion Strength after TCT19
2.5 Summary20
Chapter 3 Low Temperature (180 ℃) and Room Temperature Polymer-based Hybrid Bonding35
3.1Introduction35
3.2Materials Selection37
3.3 Process Flow of Polymer Bonding and polymer-based hybrid bonding.38
3.3.1Low Temperature Polymer Bonding and Polymer-based Hybrid Bonding Application39
3.3.2Room Temperature Polymer Bonding and Polymer-based Hybrid Bonding Application41
3.4 Summary43
Chapter 4 Low-Temperature (< 250 ℃) Hybrid Bonding Application Using Electroless Metal Passivation58
4.1Introduction58
4.2Mechanism of Electroless Deposition 59
4.3Result of Metal Passivation Deposition by Electroless Deposition60
4.4Bonding Results with Ag Passivation62
4.5 Summary63
Chapter 5 Hyper RDL Interposer by Low Temperaute (< 250 ℃) Polymer-based Hybrid Bonding Schemes75
5.1Introduction75
5.2Temporary Bonding Materials Investigation76
5.3Mechanism of Laser Release Process78
5.4The Novel Hyper RDL Structure80
5.4.1Core concept of HRDL80
5.4.2Warpage Reduction81
5.4.3Process Flow of HRDL83
5.4.4Results and Disscussion84
5.5Summary86
Chapter 6 Conclusion and Prospects107
6.1Conclusion107
6.2Future Prospects108
Reference110

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