臺灣博碩士論文加值系統

本研究針對選擇性雷射熔融純銅，在不同溫度下進行熱處理後，對樣品的密度、晶粒結構、導電率及熱傳導等性能進行了測量和分析。結果顯示，孔隙率隨著熱處理溫度由100°C提高至1000°C而增加，相對密度由As-built的99.8%下降至99.4%，並可觀察孔洞明顯擴散至晶界上的現象。在600°C以上熱處理的銅材中可以觀察到明顯的再結晶與高角度晶界的形成。此外，200-400°C熱處理由於組織回復的活動有助於提升純銅的熱導率和導電率，導電率達94%IACS；400°C熱處理後，則熱導率為400 W/m∙K，與國際標準值相近。但以更高溫的熱處理後，再結晶造成孔洞大量轉移到晶界，因此產生高於傳統製造純銅的膨脹率，熱導也因孔洞的增加，降低到373W/m∙K，電導則因為再結晶後的差排與晶界大幅減少，上升到99%IACS。以選擇性雷射熔融製造的純銅部件與傳統製造純銅的熱處理有顯著的不同，本研究為純銅的積層製造技術應用於工業用途，提供了重要的組織與性質的觀察與解析。

This study investigates the density, grain structure, electrical conductivity, and thermal conductivity of pure copper fabricated by Selective Laser Melting (SLM) and heat treated at different temperatures. The results show that porosity increases as the heat treatment temperature rises from 100°C to 1000°C, with the relative density decreasing from 99.8% in the as-built state to 99.4%. Pores diffuse to the grain boundaries due to recrystallization and the formation of high-angle grain boundaries after heat-treatment at temperatures above 600°C. Heat treatments between 200°C and 400°C are observed to increase thermal and electrical conductivity due to recovery activities in the microstructure. Electrical conductivity was 94% IACS after 200°C heat treatment. Thermal conductivity was 400 W/m·K after 400°C heat treatment which is close to international standards. With even higher heat treatment temperatures, recrystallization caused significant void migration to the grain boundaries, increasing thermal expansion coefficient. Due to the formation of pores at grain boundaries, thermal conductivity are reduced to 373 W/m·K. Electrical conductivity, on the other hand, increases to 99% IACS due to reduced dislocation density and grain boundaries. The heat treatment of pure copper components fabricated by SLM shows significant different properties compared to traditionally manufactured pure copper. This study provides important microstructural and property analyses for industrial applications of the additive manufactured pure copper.

摘 要 i
ABSTRACT ii
誌謝 iv
目錄 v
表目錄 vii
圖目錄 viii
第一章 緒論 1
1.1 前言 1
1.2 研究動機 3
第二章 文獻回顧 4
2.1 銅及銅合金 4
2.2 選擇性雷射熔融(Selective Laser Melting) 5
2.2.1 SLM和傳統製造比較 7
2.2.2 顯微組織之差異 7
2.2.3 EBSD晶粒取向差異及影響 9
2.2.4 熱處理對機械及物理性質之差異 10
2.3 銅合金熱處理製程 14
2.3.1 退火(Annealing) 14
2.3.2 應力消除退火(Stress Relief Annealing) 17
2.3.3 均質化退火(Homogenization) 18
2.4熱膨脹性質分析 20
第三章 實驗方法 22
3.1 實驗流程 22
3.1.1 純銅原料 24
3.1.2 選擇性雷射熔融(SLM)設備 25
3.1.3 熱處理設備 26
3.2 實驗分析設備 27
3.2.1 精密電子天秤(Density Test) 27
3.2.2 光學顯微鏡(Optical Microscope, OM) 27
3.2.3 冷場發掃描式電子顯微鏡(FE-SEM/EBSD) 27
3.2.4 熱機械分析儀(Thermal Mechanical Analyzer) 28
3.2.5 雷射閃光分析儀(Laser Flash Apparatus, LFA) 28
3.2.6 DC微歐姆電阻表(DC Milli-Ohm Meter) 29
第四章 結果與討論 30
4.1 顯微組織分析 30
4.1.1 光學顯微組織分析 30
4.1.2 As-built及熱處理後之EBSD分析 34
4.1.3 電腦斷層掃描分析(Computed Tomography, CT) 47
4.1.4 缺陷及孔洞觀察 50
4.2 熱膨脹性質分析 54
4.2.1 積層製造材之熱膨脹性質 54
4.2.2 傳統製造材之熱膨脹性質 56
4.3 物理性質分析與組織關係 58
4.3.1 熱傳導 58
4.3.2 導電率 61
第五章 結論 64
參考文獻 65

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