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研究生:王維綱
研究生(外文):Wei-Kang Wang
論文名稱:鎢銅電接觸複合材料製程與性質之研究
論文名稱(外文):The study on the processing and properties of W-Cu electrical contact materials
指導教授:李勝隆李勝隆引用關係
指導教授(外文):Sheng-Long Lee
學位類別:碩士
校院名稱:國立中央大學
系所名稱:機械工程研究所
學門:工程學門
學類:機械工程學類
論文種類:學術論文
論文出版年:1999
畢業學年度:87
語文別:中文
論文頁數:71
中文關鍵詞:鎢銅複合材料電接觸材料熔滲骨架散熱片定距單弧
外文關鍵詞:W-Cu compositeElectrical Contact MaterialsInfiltrationSkeletonHeat SinkStatic-GapSingle-Spark
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本研究係利用熔滲法,將三種不同粒徑之鎢粉末,依不同成形壓力與燒結溫度,製作W-15wt%Cu複合材料,比較其顯微結構、物理性質及機械性質,並藉由電弧沖蝕試驗,探討W/Cu複合材料抗電弧沖蝕之能力。
結果顯示,在氫氣氛中,以熔滲法製作W/Cu複合材料可達近似理論密度。而其熱膨脹係數,是隨著鎢粉顆粒減小而逐漸降低(7.61∼6.23×10-6/0C)。且鎢骨架彎曲強度,隨著鎢粉顆粒減小而增強,當鎢顆粒較細小(1μm及3μm)時,燒結程度達燒結中期階段,此時,燒結溫度為影響彎曲強度之主要因素;而鎢顆粒較粗大(21μm)時,燒結程度僅達燒結初期階段,此時,燒結溫度的影響不及成形壓力來得顯著。此外,細鎢顆粒之 W/Cu複合材料的破斷模式,主要是頸部斷裂與燒結後之顆粒間的穿晶劈裂為主,同時在鎢銅界面處,以沿晶破壞為主;而粗鎢顆粒之W/Cu複合材料的破斷面,除了頸部斷裂及穿晶劈裂外,由於未燒結之鎢顆粒被拉離,而形成凹洞。同時W/Cu複合材料之硬度值,與鎢顆粒大小成反比,顆粒愈小,硬度值愈高。經定距單弧沖蝕試驗,細鎢顆粒之W/Cu複合材料,其鎢骨架仍完整,而粗鎢顆粒之W/Cu複合材料的鎢顆粒有被沖蝕剝離現象,且經沖蝕後,粗鎢顆粒之W/Cu複合材料的表面粗度遠大於細鎢顆粒之W/Cu複合材料。

總 目 錄
謝誌……………………………………………………………………Ⅰ
摘要……………………………………………………………………Ⅱ
總目錄…………………………………………………………………Ⅲ
圖目錄…………………………………………………………………Ⅴ
表目錄…………………………………………………………………Ⅶ
一、 前言……………………………………………………………… 1
二、 文獻回顧與理論基礎…………………………………………… 3
2.1鎢銅複合材料之特性………………………………………… 3
2.2鎢銅複合材料之製程及其對性質之影響…………………… 3
2.3微量添加物之影響…………………………………………… 4
2.4燒結理論……………………………………………………… 5
2.4.1燒結驅動力……………………………………………… 5
2.4.2基本燒結機構…………………………………………… 6
2.4.3液相燒結之過程………………………………………… 7
2.5電接觸材料簡介……………………………………………… 9
2.5.1電接觸材料之性質要求………………………………… 9
2.5.2電接點之破壞模式……………………………………… 10
2.5.3鎢銅合金在電接觸材上之應用………………………… 12
2.6電弧沖蝕模式………………………………………………… 12
三、實驗方法與步驟………………………………………………… 29
3.1粉末、鎢骨架及鎢銅複合材料之製作……………………… 29
3.2物理性質量測………………………………………………… 32
3.2.1密度量測………………………………………………… 32
3.2.2熱膨脹係數量測………………………………………… 33
3.3機械性質試驗………………………………………………… 33
3.3.1彎曲試驗………………………………………………… 33
3.3.2硬度量測………………………………………………… 34
3.4電弧沖蝕試驗………………………………………………… 34
3.5微結構分析…………………………………………………… 35
四、結果與討論……………………………………………………… 50
4.1鎢骨架及鎢銅複合材料之微結構…………………………… 50
4.2物理性質分析………………………………………………… 51
4.3機械性質分析………………………………………………… 52
4.4電弧沖蝕試驗………………………………………………… 54
五、 結論..…………………………………………………………… 70
六、 參考文獻………………………………………………………… 71

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