臺灣博碩士論文加值系統

由於氮化鉻具有極佳的抗黏著性，是一個重要保護層材料。然而，由於它硬度比較低所以限制了氮化鉻無法廣泛地使用在工業應用上。Cr-W-N系鍍膜利用封閉式非平衡磁控濺鍍法被覆於微鑽針上；探討不同鎢含量對於氮化鉻鍍膜機械性質之影響。首先以微硬度機、刮痕試驗機及Pin-on-disk試驗機對於鍍膜之基本性質有所了解，再進一步實際利用印刷電路板鑽削來討論其磨耗行為。
實驗結果顯示：Cr-W-N系鍍膜之鎢含量隨著鎢靶材電流的增加而增加，且Cr-W-N系鍍膜隨著鎢元素含量的增加而硬度值增加。而附著度隨著鎢含量的增加而變得較差。在刮痕試驗中發現Cr-W-N系鍍膜則以鎢元素之含量約為6.8at.%之鍍膜具有最好的耐磨耗性。而後在PCB鑽削實驗中Cr-W-N系鍍膜以W10鍍膜（鎢含量6.8at.%）之鑽針做壽命測試發現可提昇約四倍的壽命。

Due to its excellent adhesive resistance, CrN is a prominent material for protective coatings. Still, its comparatively low hardness prevents CrN from being widely used in industrial applications. The Cr-W-N coatings were deposited on micro drills by the closed field unbalances magnetron sputtering method. The effects of various tungsten in CrN films were investigated. At first, in order to understand basic properties of the Cr-W-N coatings, the experiments of micro-hardness tester, scratch tester, and Pin-on-disk tester were employed. Finally, in field PCB through hole drilling was used to examine the tribological properties of the coated micro drills.
The experiment results are shown as following : The Cr-W-N coatings show a steep increase in hardness with only small addition of tungsten. But the adherence of the Cr-W-N coatings become poor with increasing tungsten. When tungsten contents were 6.8 at.%, the coating had best tribological performance.
In the PCB drilling tests, W10 caoting with 6.8 at.% tungsten contents improved 4 times than uncoated ones.

摘要…………………………………………………...……………………………I
英文摘要……………………………………………...…………………………...II
誌謝………………………………………………..…...…………………………III
總目錄…………………………………………………...…………………...…..IV
圖目錄…………………………………………………...………………………VII
表目錄…………………………………………………...…………………...…..XI
第一章 前言.……………………………………………...……………………….1
第二章 理論基礎……………………………………………………….…………3
2-1 奈米複合薄膜………………………………………………………3
2-1-1 奈米級複合材料…………………..……………………………3
2-1-2 奈米複合薄膜…………………………………..……..………..4
2-1-3 奈米複合薄膜強化機構…………………….………..………...8
2-1-4 奈米複合材料機械性質之探討………………....………….….9
2-2 CrN鍍膜……………………………………………………….…..….9
2-3 鍍膜表面及截面型態結構………………...…………………..…..11
2-4 微鑽針…………………………………………………………….14
2-4-1 微鑽針的幾何外形……………………………………………14
2-4-2 微鑽針磨耗破壞…………………………………………..…..14
2-5 非平衡磁控濺鍍………………………………………………..…17
2-6 基板偏壓的效應…………………………………………………...17
2-7 影響鍍層的因素………………………………………………..….21
第三章 實驗步驟…………………………………………………………….….24
3-1 實驗目的…………………………………………….………….….24
3-2 實驗流程…………………………………………….………….….24
3-3 濺鍍設備與靶材配置…………………………………….…….….24
3-3-1 非平衡式磁控濺射系統……………………………………...24
3-3-2 濺鍍參數與鍍膜配置……………………………………..….26
3-4 鍍膜性質分析…………………………………………………...…29
3-4-1 附著性測試……………………………………………..…….29
3-4-2 微硬度試驗………………………………………………...…31
3-4-3 磨耗試驗………………………………………………..…….31
3-4-4 鍍膜結構分析…………………………………………….…..31
3-4-5 鎢含量分析…………………………………………………...33
3-4-6 原子力顯微鏡…………………………………………….…..33
3-4-7穿透式電子顯微鏡………………………………………..…..34
3-4-8 PCB鑽削試驗………………………………………………….35
第四章 結果與討論…………………………………………………………..….38
4-1 鍍膜基本性質……………………………………………..……….38
4-1-1 靶材電流與鍍膜含鎢量之關係………………………..…….38
4-1-2 Cr-W-N系鍍膜硬度值………………………………………..38
4-1-3 附著度測試………………………………………………..….42
4-1-4 Pin-on-disk磨耗試驗………………………………………….42
4-2 組織結構分析…………………………………………………..….45
4-3 鑽削磨耗試驗………………………………………………….…..47
4-4 表面粗糙度分析…………………………………………………..67
4-5穿透式電子顯微鏡觀察……………………………………………67
第五章 結論……………………………………………………………………..73
第六章 參考文獻………………………………………………………………..75

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