臺灣博碩士論文加值系統

在現代工業，電漿在許多領域扮演著重要的角色應用，例如：晶片製造商及蔬果保鮮。最近，常壓非熱電漿產生的氣體放電已被關注，一些在常壓下新的放電資源已被開發。在本篇論文中採用CFD_RC動態流體模型來模擬兩種模式，一種是將一篇博士論文的模式重新模擬，以證實這個模式適合CFD_RC的模型；另一種模式關於實驗設備後來已經被當成模型。
第一種模式是常壓電漿噴流，這種模式是依照參考文獻10進行重新模擬。在這個模型中，電漿的產生主要是氦氣，外加1％的氧氣，在兩個平行電極間以13.56 MHz的射頻功率。再將所得之氣體流速、氣體溫度分佈、氦正離子密度、電子密度等結果與參考文獻的結果進行比較。
第二種模式是電容耦合電漿體，這種模式是由電漿儀器所模擬而來的。在這個模型中，電漿幾乎都是由純氦氣在電漿室，以13.56 MHz的射頻功率所產生。並由此模型得到氣體流速、氣體溫度分佈、氦正離子密度和電子密度等結果。

In modern industry, plasma plays an important role in many fields such as chip manufacturer and refresh fruit. Recently, gas discharges for the production of atmospheric pressure non-thermal plasma has been paid much attention, and some novel discharge sources under atmospheric pressure have been developed. In the thesis, CFD_RC a dynamic fluid modeling was used to simulate two models, one is to resimulate a model from a Ph.D. thesis to validate the model is suitable for the model. The other model regarding experiment an equipment was modeled thereafter.
The first model is Atmospheric Pressure Plasma Jet, this model is resimulated as in reference [10]. In this model plasma was produced by main gas is helium with addition of 1% oxygen between two parallel electrode by 13.56 MHz RF power. Results is gas velocity, gas temperature distribution, helium positive ion density, electron density and some of these results are compared with reference results.
The second model is Capacitively Coupled Plasma, this model is simulated from an plasma instrument. In this model, plasma was almost produced by main gas is pure helium in a plasma chamber by 13.56 MHz RF power. Gas velocity, gas temperature distribution, helium positive ion density and electron density are the results achieved from this model.

摘要 I
ABSTRACT II
ACKNOWLEDGMENT III
TABLE OF CONTENTS IV
LIST OF FIGURES VII
NOMENCLATURE IX
CHAPTER 1 INTRODUCTION 1
1.1 BACK GROUND AND MOTIVATION 1
1.2 ATMOSPHERIC PRESSURE PLASMA JET (APPJ) 2
1.3 CAPACITIVELY COUPLED PLASMA (CCP) 2
1.4 MODELING AND SIMULATION 3
1.5 SPECIFIC OBJECTIVES AND THESIS OUTLINE 3
CHAPTER 2 NUMERICAL METHOD 5
2.1 THEORY 5
2.1.1 Fluid Module Theory 5
2.1.2 Heat Transfer Module Theory 6
2.1.3 Chemistry Module Theory 7
2.1.4 Theory-Electric Conduction Module Theory 11
2.1.5 Plasma Module Theory 12
2.2 BOUNDARY CONDITION 16
2.2.1 Heat Transfer Module 16
2.2.2 Electric Module 17
2.3 VELOCITY-PRESSURE COUPLING 18
CHAPTER 3 RESULTS AND DISCUSSION OF APPJ SIMULATION 20
3.1 HEAT TRANSFER MODEL 20
3.1.1 Model description 21
3.1.2 Gas velocity distribution 22
3.1.3 Simulation results with water cooled electrodes 22
3.1.4 Simulation results with adiabatic walls 22
3.2 PLASMA MODULE 23
3.2.1 Simulation results of helium positive ion and electron number density 24
CHAPTER 4 RESULTS AND DISCUSSION OF CCP SIMULATION 32
4.1 HEAT TRANSFER MODEL 32
4.1.1 Velocity distribution 33
4.1.2 Simulation results with adiabatic walls 33
4.1.3 Simulation results with atmosphere gas cooled grounded electrode 33
4.1.4 Simulation results with atmosphere gas cooled grounded and powered electrodes 34
4.2 PLASMA MODEL 34
4.2.1 Simulation results of positive Helium ion number density 34
4.2.2 Simulation results of electron number density 34
CHAPTER 5 CONCLUSIONS AND RECOMMENDATION FOR FUTURE WORK 47
REFERENCE 48
APPENDIX: CFD_RC AND PROCEDURE TO SIMULATE 50

1.A. Chirokov, S. N. Khot, S. P. Gangoli, A. Fridman, P. Henderson, A. F. Gutsol and A. Dolgopolsky, “Numerical and experimental investigation of the stability of radio-frequency (RF) discharges at atmospheric pressure,” Plasma Sources Sci. Technol. 18, (2009).
2.CFD-ACE+TM V2004 Modules Manual-Volume 1
3.CFD-ACE+TM V2004 Modules Manual-Volume 2
4.CFD-ACE+TM V2004 User Manual- Volume 2
5.S. Takayama, S. Ono, S. Teii, “Surface treatment of plastics by an atmospheric pressure corona torch,” Transactions of IEE of Japan 122-A, 8, 722–728, (2002).
6.T. Akitsu, H. Ohkawa, M. Ohnishi, M. Tsuji, M. Kogoma,” A study on anti-bacterial effect of non-thermal oxygen plasma and bio-medical application,” Proceedings of the 3rd Asia-Pacific International Symposium on the Basic and Application of Plasma Technology, ROC, Taiwan, 139–144, (2003).
7.B.N. Chapman, Glow Discharge Process Sputtering and Plasma Etching, Wiley, New York, (1980).
8.K. Pochner, W. Neff, R. Lebert, “Atmospheric pressure gas discharges for surface treatment,” Surface and Coatings Technology 74–75, 394–398, (1995).
9.X. Duan, X. Xu, L. Zhao, Sh. Wang, “Temperature Comparison for Non-Equilibrium Atmospheric Pressure Ar and He Plasma Jet, Japanese Journal of Applied Physics, 46, 1700-1703, (2007).
10.A. V. Chirokov, “Stability of Atmospheric Pressure Glow Discharges,” Drexel University Doctor of Philosophy November (2005).
11.F. F. Chen, Introduction to Plasma Physic and controlled fusion, Second edition Volume 1 Plasma Physics.
12.Selwyn, G. S., Park, J., Herrmann, H., Snyder, H., Henins, I., Hicks, R. F., Babayan, S. E., Jeong, J. Y., Tu, V. J., “The atmospheric pressure plasma jet (APPJ): science and applications,” Advances in Applied Plasma Science, 2, 111-118, (1999).
13.J.W. Shon, Mark J. Kushner, “Excitation mechanisms and gain modeling of the high-pressure atomic Ar laser in He/Ar mixtures,” J. Appl. Phys. 4, 75, (1994).
14.D. S. Stafford, M. T. Kushner, “O2 (1 ) production in He/O2 mixtures in flowing low pressure plasmas,” J. Appl. Phys. 5, 96, (2004).
15.M. A. Lieberman and A. J. Lichtenberg, Principles of Plasma Discharges and Material Processing. New York, cha. 11, (1994).
16.F.F. Chen and J. P. Chang, Lecture Notes on Principles of Plasma Processing. New York: Kluwer/Plenum, (2003).
17.T. Makabe and Z.L. Petrovic, “ Development of optical computerised tomography in CCP and ICP for plasma etching,” in Advances in Low Temperature RF, T. Makabe, Ed. New York: Elsevier, 88-114, (2002).
18.V.A. Godyak, R.B. Piejak, and B. M. Alexandrovic, “ Ion flux and ion power losses at the electrode sheaths in a symmetrical RF discharge,” J. Apply. Phys., 69, no.6, 3455-3460, Mar. (1991).