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研究生:蔡發達
研究生(外文):TSAI FA TA
論文名稱:氧化銦錫薄膜之機械性質與磨耗特色研究
論文名稱(外文):Study of mechanical properties and wearing characteristics of ITO thin films
指導教授:張瑞慶張瑞慶引用關係
學位類別:碩士
校院名稱:聖約翰科技大學
系所名稱:自動化及機電整合研究所
學門:工程學門
學類:機械工程學類
論文種類:學術論文
論文出版年:2008
畢業學年度:96
語文別:中文
論文頁數:96
中文關鍵詞:氧化銦錫濺鍍奈米壓痕奈米刮痕磨耗特性
外文關鍵詞:Indium Tin Oxide、Sputter、Nanoindentatio、Nanoscratch、Wearing characteristic
相關次數:
  • 被引用被引用:7
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  • 評分評分:
  • 下載下載:153
  • 收藏至我的研究室書目清單書目收藏:1
本文是將透明且具有導電特性的氧化銦錫(ITO)薄膜,以射頻濺鍍沉積在玻璃基材與聚乙烯對苯二甲酸酯(PET)上,藉由改變濺鍍功率探討ITO薄膜的機械性質與磨耗特色。濺鍍過程控制在室溫以及低功率的條件下,沉積薄膜厚度為200 nm ±10 nm,ITO薄膜電阻值己可低於35 Ω/□,薄膜透光率在可見光(400nm~900nm)範圍內平均有80 %以上的穿透率,XRD分析出ITO薄膜最佳的結晶方向為(222)。由奈米壓痕實驗得知,當濺鍍功率由30 W上升至50 W時,ITO薄膜硬度與彈性模數因基材之不同而改變,硬度值由11.61 GPa上升至13.02 GPa,當基材選用玻璃時其彈性模數為116.3 GPa ~ 118.17 GPa,選用PET基材時為32.15 GPa ~ 47.63 GPa。再由奈米刮痕實驗得知,當基材選用玻璃時其磨耗強度為0.465 GPa ~ 0.339 GPa,選用PET基材時為0.037 GPa ~ 0.022 GPa,兩種基材相差甚多。由此可知,ITO沉積在PET基材時其附著性遠不及沉積在玻璃基材上,因此透明導電薄膜沉積於軟性基板之製程技術需再進一步探討。
Mechanical properties and wearing characteristics of transparently conductive Indium Tin Oxide (ITO) thin films deposited on glass and PET substrates with various sputtering power are studied in this work. A RF magnetron sputter is employed to deposit a 200±10nm thickness ITO film on the substrate in which the sheet resistance is controlled under 35 Ω/□ and the light transmittance is over 80 % at 400 nm ~ 900 nm visible as well. The preferred orientation of the ITO thin film is (222) measured by X-ray diffraction. The mechanical properties of the specimens are subsequently tested by nanoindentation and nanoscratch. The results show that, as the sputtering power increases from 30 to 50 W, the hardness of the ITO thin film increases from 116.3 to 13.02 GPa. Meanwhile, the Young’s modulus increases from 116.3 to 118.17 GPa for the glass substrate, and 32.15 to 47.63 GPa for the PET substrate, respectively. From the nanoscratch testing, the wearing resistance decreases from 0.465 to 0.339 GPa for the glass substrate, and 0.037 to 0.022 GPa for the PET substrate. The results indicate that the mechanical properties of the ITO thin film deposited on the glass substrate are much better than the values on the PET substrate. It emphasizes that depositing transparently conductive thin film on flexible substrate is crucial.
目 錄

論文摘要 I
ABSTRACT II
誌謝 III
目 錄 IV
圖目錄 VI
表目錄 X
第一章 緒論 1
1.1 前言 1
1.2 研究動機與目的 2
1.3文獻回顧 3
1.3.1 透明導電膜簡介 3
1.3.2量測薄膜機械性質 4
1.4 本文作法 6
第二章 基礎理論 8
2.1 濺鍍技術 8
2.2 四點探針量測(Four-point-probe) 10
2.3 機械性質量測理論 11
2.3.1 奈米壓痕儀原理 11
2.3.2 奈米刮痕儀原理 16
2.3.3 原子力顯微鏡原理 22
2.4 X光繞射儀量測 25
第三章 薄膜製作 28
3.1基材選用 28
3.2薄膜濺鍍參數 29
3.3表面輪廓儀膜厚量測 32
第四章 實驗結果 36
4.1 薄膜厚度量測結果 36
4.2表面電阻值量測結果 42
4.3 透光率量測結果 43
4.4 機械性質量測結果 45
4.4.1 奈米壓痕量測 45
4.4.2 奈米刮痕量測 51
4.4.3 原子力顯微鏡觀察ITO薄膜表面結果 64
4.5 X光繞射儀量測薄膜結構 79
第五章 結論 87
參考文獻 90
作者簡介 96
參考文獻

[1] Furong Z., Kwran Z., Guenther E., Chua S. J.,2000, Thin Solid Films, 363, pp 314~317.
[2] Kaneko E., 1987, Liquid Crystal Display, KTK Scientific, Tokyo
[3] Dimos D., Warren W. L., Sinclair M.B., Tuttle B.A., Schwartz R.W., 1994, Journal Appl. Phys, 76 , p 4305.
[4] Sreenivas K., Sudersena J. R., Mansingh A., Chanadra S., 1958, Journal Appl. Phys., 57, p 384.
[5] Toki.M., Aizawa M., 1995, Sol-gel formation of ITO thin films from a sol including ITO power, Journal of Sol-Gel Science and Technology, pp 717~720.
[6] Hokkaido U., 1994, Preparation of ITO thin films by sol-gel method ,Journal of the Ceramic Society Japan, 102, pp 202~207.
[7] Indian Inst of Technology, 1992, Photovoltaic properties of indium tin oxide(ITO)/silicon junction prepared by spray pyrolysis, Dependence on oxidation time, Semiconductor Science and Technology, 7,pp 1471~1475.
[8] Manifacier J. C. and Fillard J. P., 1981, Deposition of In2O3-SnO2 Layer on glass substrate using a spraying method, Thin Solid Films, 76, pp 89~95.
[9] Kwang H. K., Lee S. W., 1994, Effect of antimony addition on electric and optical properties of tin oxide films, Journal of the American Ceramic Society, 77, pp 915~921.
[10] Rakhshani A. E., Makdisi Y., Ramazaniyan H. A., 1998, Electronic and optical properties of fluorine-deped tin oxide films, Journal of Applied Physics, 83, p 1049.
[11] Watkins J. C., 1992, Highly conductively and transparent films of tin and fluorine doped indium oxide produced by APCVD, Thin Soild Films, 221, pp 166~182.
[12] May C., Strumpfel J., 1999, ITO coating by magnetron sputtering comparison of properties from DC and MF processing , Thin solid films, 351, pp 48~52.
[13] Meng L. J., Santos M. P., 1997, Properties of indium tin oxide(ITO) films prepared by r.f. reactive magnetron sputtering at difference pressure, Thin Solid fimls, 303, pp 151~155.
[14] Zhang H., Zhang Y.G., 1994, Effect of substrate bias and/reactive gas partical pressure on the resistivity of sputtered ITO films, Vaccum, 45, pp 145~148.
[15] Lee W. K., Machino T., Sugihara T., 1993, Low pressure and temperature deposition of transparent conductive indium tin oxide (ITO) films by the face target sputtering (FTS) process ,Thin Solid Films, 224, pp 105~111.
[16] Bender M., Seelig W., Daube C., 1998, Depandence of oxygen flow on optical and electrical properties of DC-magnetron sputtered ITO films, Thin Solid Films, 326, pp 72~77.
[17] Countal C., Azema A., Roustan J. C., 1996, Fabrication and characterization of ITO films deposited by excimer laser evaporation, Thin Solid Films, 288, pp 248~253.
[18] Cruz L. R. O., Santos O. j., 1991, Electrical properties of ITO films deposited by activited reactive evaporation ,Matericals Letters, 12, pp 72~76.
[19] Jin M., Zhang, et al., 1998, Preparation and characterization of ITO films deposited on polyimide by reactive evaporation at low temperature, Applied Surface Science, 19, pp 198~201.
[20] Kim H., Gilmore C. M., 1999, Electrical optical and structure properties of indium-tin-oxide thin films for organic light-emitting devices, Journal of Applied Physics, 86, pp 6451~6461.
[21] Lan J.H., Kanicki J., 1997, ITO surface ball formation induced by atomic hydrogen in PECVD and HW-CVD tools, Thin Solid Films, 304, pp 123~129.
[22] Watkins J. C., 1992, Highly conductive and transparent films of tin and fluorine doped indium oxide produced by APCVD”, Thin Solid Films, 221, pp 166~182.
[23] Akihiko N., Mami A. , Hisanao U., Eiji S., Yoshio , 2006, Fabrication of nickel oxide and Ni-doped indium tin oxide thin films using pyrosol process, Thin Solid Films, 498 pp 240 ~ 243.
[24]Lua J., Hultkera A., Niklassona G.A., Granqvista C.G., Olsson E., 2005, Microstructure of sputter deposited tin doped indium oxide films with silver additive, Thin Solid Films, 479, pp 107~ 112.
[25] Young T., 1802, Philosophical Transactions of the Royal Society of London B Biological Sciences, p. 387.
[26] 楊明輝,2001.11,金屬氧化物透明導電材料的基本原理,工業材料雜誌,179 期,pp 134~144。
[27] 陳宏仁、王立義、邱文英,2002.12,有機太陽電池之發展現況,工業材料雜誌 192期,pp 102~113。
[28] Rath J.K., 2003, Low temperature polycrystalline silicon a review on deposition, physical properties and solar cell applications, Solar Energy Materials & Solar Cells, 76, pp 431~487.
[29] Carlin J.A., Ringel S.A., Fitzgerald A., Bulsara M., 2001, High lifetime GaAs on Si using GeSi bulers and its potential for space photovoltaics, Solar Energy Materials & Solar cells, 66, pp 621~630.
[30] 許巧玲,2002,二十一世紀的新能源-太陽電池,工業材料雜誌192 期,pp.89~95。
[31] 李秀文,2004,奈米材料對ITO光電特性之改質研究,元智大學碩士論文。
[32]Sharpe W.N., Yuan Jr., B., and Vaidyanathan R., 1997, Measurements of Young’s modulus, Poisson’s ratio, and tensile strength of polysilicon, IEEE Micro Electro Mechanical Systems, Nagoya, Japan, pp. 420~430
[33] Ogawa H., Ishikawa Y., and Kitahara T., 1996, Measurements of stress-strain diagrams of thin films by a developed tensile machine, SPIE, Microlithography and Metrology in Micromachining II, Austin, TX, pp 270~280.
[34] Ogawa H., Suzuki K., Kaneko, Ishikawa Y., and Kitahara T., 1997, Measurements of Mechanical properties of microfabricated thin films, IEEE, Micro Electro Mechanical Systems, Nagoya, Japan, pp 430~440.
[35] Tsuchiya T., Tabata O., Sakata J., and Taga Y., 1998, Specimen size effect on tensile strength of surface-micromachined polycrystalline silicon thin films, Journal of Microelectromechanical systems, pp 610~620.
[36] Tabata O., Kawahata K., Sugiyama S. and Igaraashi I., 1989, Mechanical property measurements of thin films, Sensors and Actuators A, 20, pp 135~145.
[37] Tabata O., Tsuchiya T. and Fujitsuka N., 1994, Poisson’s ratio evalution of thin films for sensor application, Technical Digest of the 12th Sensor Symposium, pp 15~25.
[38] Petersen K. and Guarnieri C., 1979, Young’s modulus measurements of thin films using micromachanics, Journal of Applied Physic, 50, pp 6761~6766.
[39] Guckel H., Randazzo T. and Burns D., 1985, A simple technique for the determination of mechanical strain in thin films with application to polysilicon, Journal of Apply Physic, 57, pp 1671~1675.
[40] Zhang L.M., Uttamchandani D. and Culshaw B., 1991, Measurement of Mechanical properties of silicon microresonators, Sensors and Actuators A, 29, pp 79~84.
[41] Kiesewetter L., Zhang Jr. M., Houdeau D and Steckenborn A., 1992, Determining of Young’s modulus of micromechanical thin films using the resonance method, Sensors and Actuators A, 35, pp 153~159.
[42] Herman D., Gaitan M. and DeVoe D., 2001, MEMS test structures of Mechanical Characterization of VLSI thin films, Proc. SEM Conference, Portland Oregon, pp 1~5.
[43] Weihs T.P., Hong S., Bravman J.C., and Nix W.D., 1988, Mechanical deflection of antilever microbeams: A new technique for testing the mechanical properties of thin films, Journal of Materials Research, 3, pp 931~942.
[44] Nix W.D., 1989, Mechanical Properties of Thin Films, Metallurgical Transaction A, 20A, pp 2217~2245.
[45] Weihs T.P., Hong S., Bravman J.C., and Nix W.D., 1989, Measuring the strength and stiffness of thin film materials by mechanically deflecting cantilever microbeams, Thin Films: Stresses and Mechanical Properties, Symposium Proc. Pittsburgh, PA, pp. 87~92.
[46] Johansson S., Schweitz J.A., Tenerzand L. J. tiren, 1988, Fracture testing of silicon microelements in situ in a Scanning Electron Microscope, Journal of Applied Physics, 66, pp 130-140.
[47] Serre C., Gorostiza P., Perez A., Sanz F. and Morante J., 1998, Measurement of micromechanical properties of polysilicon microstructures with an atomic force microscope, Sensors and Actuators A, 57, pp 215~219.
[48] Serre C., Perez A., Morante J., Gorostiza P. and Esteve J., 1999. Determination of micromechanical properties of thin films by beam bending measurements with an atomic force microscope, Sensors and Actuators A, 74, pp 134~138.
[49] Pharr G.M., and Oliver W.C., and F.R. Brotzen, 1992, On the generality of therelationship among contact stiffness contact area and elastic modulus during indentation, Journal of Materials Research, 7, pp 613~617.
[50] Oliver W.C., and Pharr G.M., 1992, An improved technique for determining hardness andelastic modulus using load and 52 displacement sensing indentation experiments, Journalof Materials Research, 7, pp 1564~1583.
[51] Pharr G.M., and Oliver W.C., 1992, Measurement of thin film mechanical properties using nanoindentation, MRS Bulltin, 7, pp 28~33.
[52] Oliver W.C., and Pharr G..M., 2004, Measurement of hardness amd elastic modulus by instrumented indentation: Advances in understanding and refinements to methodology,Journal of Materials Research, 19, pp 9~20.
[53] Oliver W.C., and Pethica J.B., 1989, Methods for continuous determination of the elastic stiffness of contact between two bodies, U.S. Patent 4848141.
[54] Doerner M.F., Gardner D.S., and Nix W.D., 1986, Plastic properties of thin films on substrates as measured by submicron indentation hardness and substrate curvature techniques, Journal of Materials Research, 1, pp 845~851.
[55] Doerner M.F., and Nix W.D., 1986, A method for interpreting the data from depth-Sensing indentation instruments, Journal of Materials Research, 1, pp 601~609.
[56] 郭俊頡、張美濙,2005,利用射頻濺鍍技術於室溫下將ITO成長在塑膠基板上之研究,國立中山大學碩士論文。
[57] Shih C.W., Yang M., and Li J.C.M., 1991, Effect of tip radiuson nanoindentation, Journal of Materials Research, 6, pp 2623~2628.
[58] Baker S.P., 1997, Between nanoindentation and scanning force microscopy: Measuringmechanical properties in the nanometer regime, Thin Solid Films, 308~309, pp289~296.
[59] Bobij M.S., Biswas S.K., 1998, Estimation of hardness by nanoindentaton of roughsurfaces, Journal of Material Research 13, pp 3227~3233.
[60] Lepienski C.M., Pharr G.M., Park Y.J., Watkins T.R., Misra A. and Zhang X., 2004, Factors limiting the measurement of residual stresses in thin films by nanoindentation,Thin Solid Films, 447~448, pp 251~257.
[61] Bhushan B., 1999, Handbook of micro/nanotribology, 2nd ed., CRC Press, BocaRaton.
[62] Michael J. A., Alexander A , Brian J. B ,Peter J. D , David M. G, Simon A. ,2001, An experimental study of the nano-scratch behaviour of poly(methyl methacrylate), Wear 251 , pp 1579~1583.
[63]McElhaney K.W., Vlassak J.J. and Nix W. D., 1997, Determination of indenter tip geometry and indentation contact area for depth-sensing indentation experiments, Journal of Materials Research 13, 5, pp 1300~1306.
[64]Guille´n C., Herrero J., 2005, Comparison study of ITO thin films deposited by sputtering at room temperature onto polymer and glass substrates , Thin Solid Films, 481, pp 129~132.
[65]Michael J. A., Alexander A., Brian J. B., 2001, An experimental study of the nano-scratch behaviour of poly(methyl methacrylate), Wear 251, pp 1579~1583.
[66]Chen J., Bull S.J., 2007, Loading rate effects on the racture behaviour of solar control coatings during noindentation, Thin Solid Films, 516, pp 128~135.
[67]http://www.matweb.com/.
[68]Daeil K., Sungjin K., 2003, AFM observation of ITO thin films deposited on polycarbonate substrates by sputter type negative metal ion source, Surface and Coatings Technology, 176, pp 23~29.
[69]Gorjanc T.C., Leong D., Py C., Roth D., 2002, Room temperature deposition of ITO using r.f. magnetron sputtering, Thin Solid Films, 413, pp 181~185.
[70] 馬虹任,2005,利用磁式濺鍍機成長高品質ITO薄膜於顯示器之應用,國立中山大學碩士論文。
[71]Ranjana S., William D. N., 2002, Effects of the substrate on the determination of thin film mechanical properties by nanoindentation, Acta Materialia, 50, pp 23~38.
[72]許樹恩,吳泰伯,1993,X光繞射原理與材料結構分析,中國材料科學學會,第八章。
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