臺灣博碩士論文加值系統

本研究旨在開發超硬微型研磨工具，提供微型模具的線上精研加工，並以低成本及陣列式開發，專用於脆性材料如細胞檢測之載玻片微溝加工、陶瓷光纖接頭的去角加工或模具材料如NAK80模具鋼的微溝加工等。研究中，提出一種複合製造技術，結合『精密複合沉積』與『微型線切割放電加工』，將粒徑0-2µm的鑽石或立方晶氮化硼(CBN)顆粒以電化學複合沉積方式沉積於基材上，而成特定形狀的微細鑽石(或立方晶氮化硼)工具。微細工具粗胚以高速主軸夾持，再以線切割放電加工方式，將之線上削正成型，完成的精微研削工具不拆卸，直接透由CNC刀具路徑移位至工件處，進行微細研削加工。由於本技術採線上複合式製造，故刀具沒有定位問題，可獲致製程之高同心度與高定位精度。刀具具『精微』與『超硬』外，製程所需費用低、環保、成型速度快、加工精度高，加工的工件更能獲致『精密快速』效果。

The major aim of the thesis is to develop the micro cubic boron nitride (CBN) wheel tool array and rod-shaped diamond grinding tool for generating the micro grooves array on the optical glass and mould steel of NAK80, and chamfering at the edge of micro ceramic ferrule, respectively. A hybrid fabrication technique combining precise co-deposition with micro w-EDT is used to the process development. The tool blank is first fabricated through micro EDM and composite electroforming process so that the super abrasives, which includes cubic boron nitride (CBN) and diamonds with grain size of 0-2 µm, are uniform deposited onto the cylindrical substrate that made of aluminum alloy or tungsten carbide for producing a miniature multilayered grinding tool. Nickel, diamond and CBN play the role of binder and cutter, respectively. Some fabrication strategies including the partition plate for improving the convection in the electroforming solution, a miniature funnel mould enables the abrasives to converge toward the cathode to increase their deposition probability on the substrate, are designed and proposed. The dispersion of abrasive grains and displacement of nickel ions are noticeably made better. A non-continuous substrate design is proved that the current crowding effect is able to be restricted validly, thereby improving their distribution on the substrate surface. The finished wheel tool blank is clamped on a high speed spindle and formed into disk-shaped tool array with 10-µm for the thickness of each piece by means of micro w-EDT process. The miniature diamond grinding tool usable with the outside diameter of 100-µm for the precise micro grinding of miniature parts is also presented. They are individually directly used in grinding the workpiece using the ‘high-speed and fast-shallow grinding’ technique, with which a very high grinding velocity and very shallow grinding depth are employed, is used for precisely machining the microgrooves. The microgrooves with a checkerboard-like layout on optical glass and NAK80 mould steel are successfully fabricated for the application of cells counter. Also, a micro ZrO2 ceramic ferrule is finely chamfered at the edge of the inner hole by the developed tapered grinding tool so that the fiber easily passes through it. High dimensional and geometrical accuracy can be achieved with this hybrid technique. Further, the proposed technique is rapid, cost effective, environment friendly and easily controllable.

中文摘要 I
英文摘要 II
目錄 III
圖目錄 VII
表目錄 XI
符號說明 XII
第一章 緒論 1
1-1 前言 1
1-2 研究動機 2
1-3 研究目的 2
1-4 研究方法 3
1-5 文獻回顧 4
1-5-1 微溝槽加工應用文獻回顧 4
1-5-2 精微內孔加工應用文獻回顧 9
第二章 精微超硬研削工具開發之原理應用 12
2-1 鋅置換化學反應 12
2-1-1 鋅置換理論 12
2-1-2 鋅置換處理 13
2-2 電化學複合沉積原理 14
2-2-1 電鍍原理與應用 14
2-2-2 電化學複合沉積原理 16
2-3 放電加工原理 17
2-3-1 微放電加工原理 18
2-3-2 線式放電研削原理 19
2-4 高速快淺研削原理 19
2-4-1 研削基本原理 19
2-4-2 磨削之材料移除機制 21
2-4-3 高速快淺研削應用 22
第三章 實驗設備設計 24
3-1 立方晶氮化硼輪刀胚料之電化學複合沉積槽設計 24
3-1-1 基材旋轉機構之設計 25
3-1-2 漏斗式模具設計(微細盤狀工具) 26
3-2 鑽石磨棒的電化學複合沉積槽設計 26
3-2-1 鑄液對流設計 26
3-2-2漏斗式模具設計(微細柱狀工具) 27
3-3 電化學複合沉積機構週邊硬體 29
3-3-1 槽體溫控設計 29
3-3-2 精密電源供應器 30
3-4 複合式CNC微型加工機應用 31
3-5 高速主軸應用 31
3-6 線切割放電加工機應用 33
3-7 實驗所用之量測儀器設備 34
3-7-1 工具顯微鏡 34
3-7-2 掃描式電子顯微鏡 34
3-7-3 白光干涉儀 35
3-7-4 3D雷射掃描顯微鏡 35
3-8 實驗材料 36
3-8-1 微型研削工具基材 36
3-8-2 微型研削工具之磨粒選用 37
3-8-3 銅線電極材料 38
3-8-4 被研削材—氧化鋯陶瓷 39
3-8-5 被研削材—光學玻璃 39
3-8-6 被研削材—NAK80模具鋼 40
第四章 實驗方法 41
4-1 微型陣列式CBN輪刀開發 42
4-1-1 陣列式輪刀之高精密心軸設計 42
4-1-2 臥式同心滾鍍實驗 43
(1) 滾鍍槽防漏設計 43
(2) 磨粒聚合實驗 43
(3) 磨粒均佈率與沉積時間關係 45
4-1-3 磨粒沉積量影響因子 47
(1) 單位容積磨粒含量對沉積量的影響 48
(2) 鑄液流速對磨粒沉積量的影響 50
(3) 主軸轉速對磨粒沉降量的影響 51
(4) 結果與討論 52
4-1-4 陣列式CBN圓盤胚料放電修整實驗 53
(1) 輪刀胚料同心放電修整 54
(2) 放電能量參數選用 56
(3) 陣列式CBN輪刀成型修整與放電間隙關係 57
(4) 結果與討論 58
4-2 微型鑽石磨棒開發 58
4-2-1 刀具基材成型加工 59
4-2-2 陽極形狀對微細磨棒成型之影響 61
4-2-3 磨粒沉積量影響 62
(1) 陰極最佳鑄區實驗 62
(2) 陣列式漏斗模具設計與實驗 63
4-2-4 各式微細磨棒製作與驗證 65
4-2-5 結果與討論 66
第五章 精微超硬研削工具應用與驗證 67
5-1 微型陣列式CBN輪刀應用 67
5-1-1 光學玻璃微溝研削加工 67
(A)、研削深度對切割道品質的影響 68
(B)、切刃厚度對切割道長度的影響 73
(C)、討論 74
5-1-2 NAK80模具鋼微溝研削加工 74
(A)、輪刀鍍層厚度對微溝寬度的影響 75
(B)、NAK80微溝表粗 77
5-1-3 陣列式CBN輪刀之刀具壽命探討 79
(A)、研削光學玻璃陣列細溝之刀具壽命 80
(B)、研削NAK80陣列細溝之刀具壽命 81
5-2 微型鑽石磨棒應用 83
5-2-1 精密陶瓷去角研削加工 84
5-2-2 表面粗糙度探討 85
第六章 結論 86
6-1 結果 86
6-2 未來展望 89
參考文獻 91
個人簡歷 95
附註: 已發表論文 96

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