臺灣博碩士論文加值系統

由於現今射頻積體電路製造技術的進步，單一射頻系統封裝內可整合更多弁鉆q路，加上操作頻率有向上提升的趨勢，以至於電路元件遭受高頻電磁及雜散效應的影響更形嚴重。在此嚴苛的設計條件下，唯有準確寬頻的元件模型始能提供電路設計者準確分析電路的特性行為，進而設計出符合目標規格的電路。
本文使用數值分析與微波網路分析兩種方法，發展應用於螺旋狀電感器的模型萃取程序及全分析性之數學合成公式。藉由模型簡化及分解合併技巧可大幅簡化萃取方法的複雜度並減少計算資源的需求，而能快速準確地建構出相容於 SPICE 模擬器的寬頻化 T 型或 PI 型等效電路模型。
實驗以數個有機基板內嵌式和Si基板CMOS的螺旋狀電感器為例，經由比較模擬值與量測值的結果，驗證所提之模型化方法具有寬頻及準確的特性。

Following the improvement in the manufacturing techniques of radio-frequency integrated circuits (RFICs) nowadays, more functional circuits can already be integrate into a single RF system package. Due to the increase in operating frequency, the operations and features of RFICs will suffer perturbations more from various complicated high-frequency parasitic and electromagnetic (EM) effects. In these design conditions, only accurate broadband models can provide the accurate circuit analysis for circuit designers to design a circuit conforming to the specifications.
This study used numerical analysis and microwave network analysis to develop model extraction procedure and further to provide fully-analytical mathematical extraction formula to be applied in spiral inductor. Through model simplification and composition-decomposition techniques, the complexity of the extraction approach can be simplified and the requirement of computational resources can also be reduced. As a result, a broadband T- or PI-equivalent circuit model compatible with SPICE simulators can rapidly and accurately be constructed.
Experimental samples used several spiral inductors as the type of embedded in organic laminate substrate and fabricated using Si-based CMOS process. Through the comparisons of the simulated and measured results, the proposed modeling approach proved to possess the characteristics of broadband and accuracy.

中文摘要 Ⅰ
Abstract Ⅱ
致謝 Ⅳ
目錄 V
表目錄 VIII
圖目錄 VIII
第一章 緒論 1
1.1 研究動動與目的 1
1.2 研究方法 3
第二章 等效電路與模型化理論 4
2.1 微波網路分析之雙埠網路 4
2.1.1 雙埠網路運用 6
2.2 模型化方法 7
2.3 寬頻模型化概述 10
2.3.1寬頻模型建立軟體 10
2.3.2寬頻模型化 10
第三章 有機基板嵌入式螺旋狀電感器模型 12
3.1 簡介 12
3.2 有機基板簡介 13
3.3 微波網路分析法 14
3.3.1 等效電路模型 15
3.3.2 模型萃取方法 16
3.3.3 實驗結果 20
3.4 向量擬合法 24
3.4.1 等效電路模型 24
3.4.2 模型建立 25
3.4.3 實驗結果 29
第四章 Si基板CMOS螺旋狀電感器模型 32
4.1 簡介 32
4.2 諧振式T型CMOS螺旋狀電感器模型 34
4.2.1等效電路結構 34
4.2.2模型分解與元件萃取 35
4.2.3實驗結果 37
4.3 諧振式PI 型CMOS螺旋狀電感器模型 40
4.3.1 等效電路模型 40
4.3.2 模型萃取方法 41
4.3.3 實驗結果 44
第五章 有機基板模擬實例 49
5.1 量測與模擬比較 49
5.2 實驗結果 50
第六章 結論 56參考文獻 57

[1] 郭仁財，微波工程，出版社:高立圖書有限公司，2006。
[2] D. M. Pozar, Microwave and RF Design Of Wireless Systems, John Wiley & Sons, Inc., 2001.
[3] 蔡友遜，微波被動式元件之寬頻修正T型等效電路模型，國立中山大學電機工程研究所博士論文，2007。
[4] 陳清文，CMOS 螺旋電感等效電路之探討，國立交通大學電信工程研究所碩士論文，2005。
[5] 林奇樑，有機及軟性基板內埋被動式元件設計與模型化研究，國立中山大學電機工程研究所碩士論文，2005。
[6] D. Melendy and A. Weisshaar, “A new scalable model for spiral inductors on lossy silicon substrate,” in IEEE MTTS Int. Microwave Symp. Dig., pp. 1007-1010, 2003.
[7] A, Scuderi, T. Biondi, E. Ragonese, and G. Palmisano, “A lumped scalable model for silicon integrated spiral inductors,” IEEE Trans. Circuits Syst. I., vol. 51, pp. 1203-1209, June 2004.
[8] F. M. Rotella, V. Blaschke, and D. Howard, “A broad-band scalable lumped-element inductor model using analytic expressions to incorporate skin effect, substrate loss, and proximity effect,” in Proc. IEEE Electron Devices Int. Meeting, pp. 471-474, 2002.
[9] Y. Cao, R. A. Groves, X. Huang, N. D. Zamdmer, J. O. Plouchart, R. A. Wachnik, T. J. King, and C. Hu, “Frequency-independent equivalent-circuit model for on-chip spiral inductors,” IEEE J. Solid-State Circuits, vol. 38, pp. 419-426, Mar. 2003.
[10] D. Melendy, P. Francis, C. Pichler, K. Hwang, G. Srinivasan, and A. Weisshaar, “Wide-band compact modeling of spiral inductors in RFICs”, IEEE MTT-S Digest, pp. 717-720, June. 2002.
[11] N. A. Talwalker, C. P. Yue, and S. S. Wong, “Analysis and synthesis of on-chip spiral inductors”, IEEE Trans. Electron Devices, vol. 52, no. 2, pp. 176-182, Feb. 2005.
[12] M. H. Chiou and K. Y. J. Hsu, “A new wideband modelling technique for spiral inductors,” IEE Proc. Microw. Antennas Propag., vol. 151, pp. 115-120,Apr. 2004.
[13] Z. Qi, H. Yu, P. Liu, S. X.-D. Tan, and L. He, “Wideband passive multiport model order reduction and realization of RLCM circuits,” IEEE Trans. Comput.-Aided Des. Integr. Circuits Syst., vol. 25, pp. 1496-1509, Aug. 2006.
[14] S. H. Lee, T.-Y. Huang, and R.-B. Wu, “Fast waveguide eigenanalysis by wide-band finite-element model-order reduction,” IEEE Trans. Microwave Theory Tech., vol. 53, pp. 2552-2558, Aug. 2005.
[15] N. Wong., V. Balakrishnan, C. K. Koh, and T. S. Ng, “Two algorithms for fast and accurate passivity-preserving model order reduction,” IEEE Trans. Comput.-Aided Des. Integr. Circuits Syst., vol. 25, pp. 2062-2075, Oct. 2006.
[16] T. Wittig, I. Munteanu, R. Schuhmann, and T. Weiland, “Two-step lanczos algorithm for model order reduction,” IEEE Trans. Magnetics, vol. 38, pp. 673-676, July 2002.
[17] J. M. Wang, C.-C. Chu, Q. Yu, and E.-S. Kuh, “On projection-based algorithms for model-order reduction of interconnects,” IEEE Trans. Circuits Syst. І: Fundam. Theory Appl., vol. 49, pp. 1563-1585, Nov. 2002.
[18] L. T. Pillage and R. A. Rohrer, “Asymptotic waveform evaluation for timing analysis,” IEEE Trans. Comput.-Aided Des. Integr. Circuits Syst., vol. 9, no. 4, pp. 352-366, Apr. 1990.
[19] P. Feldmann and R. W. Freund, “Efficient linear circuit analysis by Padé approximation via the lanczos process,” IEEE Trans. Comput.-Aided Des. Integr. Circuits Syst., vol. 14, no. 5, pp. 639-649, May 1995.
[20] J. R. Phillips, L. Daniel, and L. M. Silveira, “Guaranteed passive balancing transformations for model order reduction,” IEEE Trans. Comput.-Aided Des. Integr. Circuits Syst., vol. 22, no. 8, pp.1027-1041 Aug. 2003.
[21] S. Koziel, J. W. Bandler, and K. Madsen, “Theoretical justification of space-mapping-based modeling utilizing a database and on-demand parameter extraction,” IEEE Trans. Microwave Theory Tech., vol. 54, pp. 4316-4322, Dec. 2006.
[22] M. H. Bakr, J. W. Bandler, N. Georgieva, and K. Madsen, “A hybrid aggressive space-mapping algorithm for EM optimization,” IEEE Trans. Microwave Theory Tech., vol. 53, pp. 2440-2449, Dec. 1999.
[23] S. Koziel and J. W. Bandler, “Space-mapping optimization with adaptive surrogate model,” IEEE Trans. Microwave Theory Tech., vol. 55, pp. 541-547, Mar. 2007.
[24] M. H. Bakr, J. W. Bandler, K. Madsen, J. R. S. Ernesto, and J. Søndergaard, “Space-mapping optimization of microwave circuits exploiting surrogate models,” IEEE Trans. Microwave Theory Tech., vol. 48, pp. 2297-2306, Dec. 2000.
[25] Y. Ding, K.-L. Wu, and D.-G. Fang, “A Broad-band adaptive-frequency-sampling approach for microwave-circuit EM simulation exploiting stoer–bulirsch algorithm,” IEEE Trans. Microwave Theory Tech., vol. 51, pp. 928-934, Nov. 2003.
[26] J. D. Geest, T. Dhaene, N. Fache, and D. D. Zutter, “Adaptive CAD-model building algorithm for general planar microwave structures,” IEEE Trans. Microwave Theory Tech., vol. 9, pp. 1801-1809, Sept. 1999.
[27] R. Lehmensiek and P. Meyer, “Creating accurate multivariate rationalinterpolation models of microwave circuits by using efficient adaptive sampling to minimize the number of computational electromagnetic analyses,” IEEE Trans. Microwave Theory Tech., vol. 49, pp. 1419-1430, Sept. 2001.
[28] S. F. Peik, R. R. Mansour, and Y. L. Chow, “Multidimensional Cauchy method and adaptive sampling for an accurate microwave circuit modeling,”IEEE Trans. Microwave Theory Tech., vol. 46, pp. 2364-2371, Dec. 1998.
[29] I. Timmins and K. L. Wu, “An efficient systematic approach to model extraction for passive microwave circuits,” IEEE Trans. Microwave Theory Tech., vol. 48, pp. 1565-1573, Sept. 2000.
[30] K. L. Choi and M. Swaminathan, “Development of model libraries for embedded passives using network synthesis,” IEEE Trans. Circuit Syst.Ⅱ, Analog Digit. Signal Process, vol. 47, pp. 249-260, Apr. 2000.
[31] R. Neumayer, A. Stelzer, F. Haslinger, and R. Weigel, “On the synthesis of equivalent-circuit models for multiports characterized by frequency-dependent parameters,” IEEE Trans. Microwave Theory Tech., vol. 50, pp. 2789-2796, May. 2002.
[32] G. Antonini, “SPICE equivalent circuits of frequency-domain responses,” IEEE Trans. Electromagn. Compat., vol. 45, pp. 502-512, Aug. 2003.
[33] B. Gustavsen and A. Semlyen, “Rational approximation of frequency domain responses by vector fitting,” IEEE Trans. Power Del., vol. 14, pp. 1052-1061, July 1999.
[34] R. Gao, Y. S. Mekonnen, W. T. Beyene, and S. A. Jose, “Black-box modeling of passive systems by rational function approximation,” IEEE Trans. Adv. Packag., vol. 28, pp. 209-215, May 2005.
[35] R. Araneo, “Extraction of broad-band passive lumped equivalent circuits of microwave discontinuities,” IEEE Trans. Microwave Theory Tech., vol. 49, pp. 393-401, Jan. 2006.
[36] B. Gustavsen and A. Semlyen, “Enforcing passivity for admittance matrices approximated by rational functions,” IEEE Trans. Power Systems, vol. 16, pp. 97-104, Feb. 2001.
[37] A. Dounavis, R. Achar, and M. Nakhla, “A general class of passive macromodels for lossy multiconductor transmission lines,” IEEE Trans. Microwave Theory Tech., vol. 49, pp. 1686 -1696, Oct. 2001.
[38] Signal Integrity Design Assistants (SIDEA) User's Guide, Optimal Corp., San Jose, CA, USA, 2005.
[39] Broadband SPICE User's Guide, Sigrity, Inc. Santa Clara, CA, 2002.
[40] Advanced Design System (ADS) User's Guide, Agilent Technologies Corp., Palo Alto, CA, USA, 2005.
[41] 邱基綜，多層有機封裝基板上螺旋電感器之可比例伸縮寬頻模型，國立中山大學電機工程研究所碩士論文，2004。
[42] 蔡友遜、洪瑞豐、邱基綜,“應用於設頻系統封裝之嵌入式電感器的寬頻精簡模型,”全國電信研討會, pp. 964~967, Dec. 2008.
[43] 蔡友遜、李克明、洪瑞豐, “應用於射頻電路設計之準確嵌入式電感器模型”, 第二屆積體光機電科技應用與發展學術會議, pp. 184-191, Mar. 2009.
[44] J. C. Guo and T. Y. Tan, “A broadband and scalable model for on-chip inductors incorporating substrate and conductor loss effects,” IEEE Trans. Electron Devices, vol. 53, no. 3, pp. 413-421, Mar. 2006.
[45] 蔡友遜、洪瑞豐, “系統級構裝之嵌入式電感器模型”, 2009全國電磁相容技術與實務研討會, pp. 27-30, Apr. 2009.
[46] I. C. H. Lai, and M. Fujishima, “A new on-chip substrate-coupled inductor model implemented with scalable expressions,” IEEE J. Solid-State Circuits, vol. 41, pp. 2491-2499, Nov. 2006.
[47] J. C. Guo and T. Y. Tan, “A broadband and scalable model for on-chip inductors incorporating substrate and conductor loss effects,” IEEE Trans. Electron Devices, vol. 53, no. 3, pp. 413-421, Mar. 2006.