[1]L. A. Nelson, K. S. Sekhon and J. E. Fritz, Direct Heat Pipe Cooling of Semiconductor Devices, Proc. Int. Heat Pipe Conf., 3rd., pp.373-376, 1987.
[2]Mark Aaron Chan, Christopher R. Yap, Kim Choon Ng, Modeling and testing of an advanced compact two-phase cooler for electronics cooling, International Journal of Heat and Mass Transfer 52, pp.3456–3463, 2009.
[3]S. Shuler, Thermal Management: Understanding How To Incorporate Effective Thermal Strategies Into Overall Portable Electronic Design for Better Performance, Materials and Design, Vol. 21, pp.39-44, 2000.
[4]鄭皓元,已知縱長型散熱座的鰭片數目、深度與寬度時,求鰭片的最佳厚度,大同大學機械工程研究所碩士論文,2009[5]盧宜忠,熱電除濕器的性能改善,國立成功大學機械工程學系碩士論文,2002[6]Andrew T. Morrison, Optimization of Heat Sink Fin Geometries for Heat Sink in Natural Convection, IEEE, InterSociety Conference on Thermal Phenomena, pp.145-148, 1992.
[7]Tae Young Kim, Sung Jin Kim, Fluid Flow and Heat Transfer Characteristics of Cross-cut Heat Sink, International Journal of Heat and Mass Transfer, pp.5358-5370, 2009.
[8]Hung-Yi Li, Shung-Ming Chao, Measurement of Plat-fin Heat Sink with Cross Flow Cooling, International Journal of Heat and Mass Transfer, pp.2945-2955, 2009.
[9]E. M. Sparrow and S. B. Vemuri, Orientation Effect on Natural Convection / Radiation Heat Transfer from Pin-fin Arrays, International Journal of Heat and Mass Transfer, Vol.29, pp359-68, 1986.
[10]M. A. Habib, A. M. Mobarak, A. M. Attya, A. Z. Aly, Enhanced Heat Transfer in Channels with Staggered Fin of Different Spacings, International Journal of Heat and Fluid Flow, Vol.14, No.2, pp. 158-190, 1993.
[11]Seok Hwan Moon, Gunn Hwang, Ho Gyeong Yun, Tae Goo Choy, Young II Kang, Improving Thermal Performance of Miniature Heat Pipe for Notebook PC Cooling, Microelectronics Reliability, Vol. 42, pp.135-150, 2002.
[12]Kwang-Soo Kim, Myong-Hee Won, Jong-Wook Kim, Byung-Joon Back, Heat Pipe Cooling Technology for Desktop Pc CPU, Applied Thermal Engineering, pp.1137-1144, 2003.
[13]H. Xie, M. Aghazadeh, W. Lui, K. Haley, Thermal Solution to Pentium Processors in TCP in Notebooks and Sub-notebooks, IEEE Transaction on Component, Packaging and Manufacturing Technology, Part A, Vol.19, pp.54-65, 1996.
[14]Dae Hee Lee, Myeong Chan Jo, Jun Sik Lee, Yoon Seok Cha, Dae Keun Lee, Measurements of Air Temperature Distribution and Optimum Cooling Condition Inside the Computer System, Journal of Mechanical Science and Technology 23, pp544-549, 2009.
[15]R. L. Linton, D. Agonafer, Thermal Model of a PC, ASEM Journal of Electronic Packaging, Vol.116, pp.134-137, 1994.
[16]陳琦樺, 台灣電子產業價值創造之研究, 中山大學企業管理學系碩士班碩士論文, 2008[17]B. E. Launder, D. B. Spalding, Lectures in Mathematical Models of Turbulence, Academic Press, New York, 1976.
[18]S. V. Patankar, D. B. Spalding, A Calculation Procedure for Heat, Mass and Momentum Transfer in Three-Dimensional Parabolic Flower, International Journal of Heat Transfer, Vol. 15, pp. 1787-1806, 1972.
[19]S. V. Patankar, Numerical Heat Transfer and Fluid Flow, Hemisphere Publishing Co., New York, 1980.
[20]S. V. Patankar, A Calculation Procedure for Two-Dimensional Elliptic Situations, Numerical Heat Transfer, Vol. 4, pp. 409-425, 1981.