臺灣博碩士論文加值系統

　　本研究以有限元素方法(FEM)建立線性及順序進行(Sequential processing)模型，模擬電子構裝經製程階段後的測試階段，以JEDEC的三個測試等級規範，探討在不同測試條件下因溫濕效應產生的翹曲及應力，並藉量測構裝表面之翹曲來驗證模擬方法之正確性，順序進行模型考慮前一階段的殘留變形及應力使得模擬更為接近真實的情況。
　　另一部分研究，探討構裝界面存在裂縫之破壞力學，模擬在封膠階段中黏膠界面存在一裂縫，以破壞力學觀點，探討不同黏膠材料與厚度，對能量釋放率及相角之影響，評估黏膠之界面黏著強度。

Both the linear and sequential processing model are construed to simulate the package warpage and stresses under thermal and moisture loadings during the test process. The test conditions of package are based on three JEDEC test standards. The simulated package warpage is verified by the measurement of package warpage. The sequential processing model takes into consideration of residual deformation and stresses of package assembly can more practically simulate the real test process of package.
The other part of this study, fracture mechanics is used to study the interfacial damage of package. The finite element model is based on a defect on the die attach interface. The energy release rate at the defect tip is simulated. The effects of material properties and thickness of die attach on energy release rate is discussed to evaluate the interfacial strength of die attach.

中文摘要 ----------------------------------------------------------------------- i
英文摘要 ----------------------------------------------------------------------- ii
誌謝 ----------------------------------------------------------------------- iii
目錄 ----------------------------------------------------------------------- iv
表目錄 ----------------------------------------------------------------------- vi
圖目錄 ----------------------------------------------------------------------- vii
符號說明 ----------------------------------------------------------------------- xi
第一章 緒論----------------------------------------------------------------- 1
1.1 前言----------------------------------------------------------- 1
1.2 研究動機----------------------------------------------------------- 2
1.3 文獻回顧----------------------------------------------------------- 3
1.4 研究目的----------------------------------------------------------- 6
第二章 研究方法----------------------------------------------------------- 8
2.1 有限元素方法----------------------------------------------------- 8
2.2 構裝結構與溼氣擴散及破壞分析---------------------------------- 9
2.3 構裝模擬分析步驟----------------------------------------------- 14
2.4 構裝翹曲量測--------------------------------------------------------- 16
第三章 構裝力學與濕氣擴散理論------------------------------------------- 17
3.1 翹曲分析理論-------------------------------------------------------- 17
3.1.1 雙層板翹曲理論----------------------------------------------------- 17
3.1.2 Suhir構裝翹曲理論------------------------------------------------ 19
3.2 多層板應力分析理論----------------------------------------------- 22
3.2.1 雙層板界面熱應力分析理論---------------------------------------- 22
3.2.2 多層板界面熱應力分析理論--------------------------------------- 25
3.3 濕度擴散理論--------------------------------------------------------- 29
3.3.1 濕度擴散定律--------------------------------------------------------- 29
3.3.2 熱濕固耦合方程------------------------------------------------------- 30
3.4 破壞力學理論----------------------------------------------------- 30
3.4.1 線彈性破壞力學-------------------------------------------------- 30
3.4.2 雙材料界面破壞力學-------------------------------------------- 33
3.5 有限元素方法------------------------------------------------- 35
3.5.1 有限元素變形分析--------------------------------------------------- 35
3.5.2 應力計算公式---------------------------------------------------------- 36
3.5.3 奇異性元素------------------------------------------------------------- 37
3.5.4 有限元素法J積分----------------------------------------------------- 39
第四章 構裝濕氣擴散、翹曲及界面應力模擬------------------------------ 40
4.1 FBGA測試階段濕氣擴散模擬-------------------------------------- 40
4.1.1 A款 60 Ball幾何尺寸及溼度性質材料參數--------------------- 40
4.1.2 溼度負載條件---------------------------------------------------------- 42
4.1.3 濕度負載實驗與水氣重量量測結果------------------------------- 43
4.1.4 濕度模擬理論及邊界條件設定------------------------------------- 44
4.1.5 濕氣擴散模型建立、模擬與結果------------------------------------ 46
4.1.6 濕度模擬結果與討論------------------------------------------------- 46
4.2 FBGA從製程到測試階段所衍生之翹曲及應力----------------- 51
4.2.1 FBGA之幾何尺寸及材料參數-------------------------------------- 51
4.2.2 溫濕度負載條件------------------------------------------------------ 54
4.2.3 製程與測試階段翹曲量測------------------------------------------- 55
4.2.4 FBGA模型建立、模擬與結果--------------------------------------- 57
4.2.4.1 FBGA模型建立-------------------------------------------------------- 57
4.2.4.2 模擬翹曲與量測比較------------------------------------------------- 59
4.2.4.3 各階段翹曲與晶片/黏膠界面應力模擬結果--------------------- 62
4.2.5 模擬有無考慮製程狀態的測試階段翹曲與應力比較---------- 70
4.2.6 FBGA模擬結果與討論----------------------------------------------- 77
4.3 破壞力學分析黏膠材料與厚度對構裝之能量釋放率影響---- 78
4.3.1 雙材料樑DCB---------------------------------------------------------- 78
4.3.2 雙材料四點彎矩梁--------------------------------------------------- 80
4.3.3 TSOP破壞力學模擬------------------------------------------- 81
4.3.3.1 破壞力學模擬分析之假設與溫度負載---------------------------- 83
4.3.3.2 裂縫尖端收斂性分析與J積分路徑分析-------------------------- 83
4.3.3.3 TSOP封膠製程黏膠材料與厚度參數分析----------------------- 85
4.3.4 黏膠材料性質與厚度對能量釋放率影響------------------------- 89
4.3.5 模擬結果與討論------------------------------------------------------- 90
第五章 結論----------------------------------------------------------------- 91
參考文獻 ----------------------------------------------------------------------- 93
簡歷 ----------------------------------------------------------------------- 97

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