臺灣博碩士論文加值系統

本研究以微電鍍機電鍍塑膠之金屬薄膜，將丙烯腈-丁二烯-苯乙烯共聚物 (Acrylonitrile Butadiene Styrene 簡稱 ABS)，使用化學處理在ABS試片附著一層金屬導電層，經直流電源供應器控制進行電鍍鎳金屬薄膜，藉有參數設定為敏化處理時間不同、電鍍液溫度調整差異及控制電流大小與時間，對鎳離子沉積速度極敏化處理時間差異，鎳離子因沉積速度不同影響金屬電鍍表面微結構，以掃描電子式顯微鏡(SEM)進行分析表面與斷面形貌、表面粗度輪廓儀分析金屬薄膜機械性質，最後以實驗結果根據各項性能測試結果建議ABS塑膠電鍍鎳最佳化參數。

This study is plating metal film on plastic by micro-electroplating machine. Acrylonitrile and Butadiene and Styrene copolymer (Acrylonitrile Butadiene Styrene is short for ABS) conductive layer on ABS test chip by chemical treatment. Plating nickel metal film is controlled by DC Power Supply. Adjust the parameter settings to different sensitization treatment time, different the temperature of the plating solution and control current magnitude and time will change nickel deposition rate and extremely sensitized time. Due to different deposition rate of the Nickel ions affect metal plating surface microstructure. Analysis surface and section by scanning electron microscope (SEM).Analysis mechanical properties of the metal film by surface coarseness profiling instrument. Finally, according to the results and the performance test, recommend parameters optimization of the ABS plastic plating Nickel.

目錄
中文摘要------------------------------------------------------------i
英文摘要-----------------------------------------------------------ii
誌謝--------------------------------------------------------------iii
目錄---------------------------------------------------------------iv
表目錄------------------------------------------------------------vii
圖目錄-------------------------------------------------------------ix
第一緒論------------------------------------------------------------1
1-1前言-------------------------------------------------------------1
1-2研究動機與目的----------------------------------------------------2
第二文獻回顧 --------------------------------------------------------3
2-1 基本原理---------------------------------------------------------4
2-2 影響電鍍參數-----------------------------------------------------4
2-2.1 溫度----------------------------------------------------------4
2-2.2 攪拌----------------------------------------------------------5
2-2.3 電流密度及效率-------------------------------------------------5
2-2.4 pH值----------------------------------------------------------7
2-2.5 填加劑--------------------------------------------------------7
2-2.6 電解液--------------------------------------------------------7
2-3常見的鍍液種類與應用----------------------------------------------10
2-3.1鍍液中各成分的影響----------------------------------------------12
2-4 塑膠電鍍原理----------------------------------------------------14
2-5 ABS塑膠(樹脂)---------------------------------------------------15
第三章 實驗設備、材料與實驗流程---------------------------------------17
3-1實驗儀器---------------------------------------------------------17
3-1.1鎳微電鍍槽------------------------------------------------------17
3-1.2直流電源控制器---------------------------------------------------19
3-1.3 電鍍前處理槽----------------------------------------------------21
3-1.4 3D列印機-------------------------------------------------------23
3-1.5 3D表面粗度輪廓儀------------------------------------------------25
3-1.6 掃描式電子顯微鏡-------------------------------------------------26
3-2實驗材料-----------------------------------------------------------29
3-2.1 ABS塑膠---------------------------------------------------------27
3-2.2硫酸 (Sulfuric acid)---------------------------------------------28
3-2.3氯化亞錫 (Tin(Ⅱ) chloride)---------------------------------------29
3-2.4鹽酸 (Muriatic acid)---------------------------------------------31
3-2.5銷酸銀-----------------------------------------------------------33
3-2.6 氨水------------------------------------------------------------35
3-2.7氫氧化鈉---------------------------------------------------------37
3-2.8 葡萄糖----------------------------------------------------------39
3-3實驗流程-----------------------------------------------------------40
3-3.1 實驗流程圖------------------------------------------------------40
3-3.2 實驗步驟--------------------------------------------------------41
第四章 結果與討論------------------------------------------------------43
4-1 敏化時間不同對鍍膜厚度與質量之影響-----------------------------------43
4-2薄膜沉積時間不同分析金屬薄膜厚度與質量--------------------------------46
4-2.1 電流密度為0.36A/〖dm〗^2不同電鍍時間之影響------------------------46
4-2.2 電流密度為0.45A/〖dm〗^2不同電鍍時間之影響-------------------------49
4-3調整電鍍溫度之厚度分析-----------------------------------------------52
4-4金屬薄膜微結構分析--------------------------------------------------60
4-4.1 前處理對金屬表面粗糙度之影響--------------------------------------60
4-4.2 電鍍液溫度不同對金屬膜沉積之影響-----------------------------------64
第五章 結論----------------------------------------------------------70
參考文獻-------------------------------------------------------------71

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