臺灣博碩士論文加值系統

壓電材質鋯鈦酸鉛（PZT）一直是力量感測器中感測端的重要元件，其壓電的特性也造成了後端處理電路的複雜性。而處理壓電特性的訊號處理電路－電荷放大器（Charge Amplifier），大都是採用電壓式運算放大器為主的處理方法。有關市面上電荷放大器的設計KISTLER公司皆有成品開發但因其所設計的面積較大皆不適於封裝於壓力感測器之內部，所以就藉由財團法人國家晶片系統設計中心依其下線製作符合封裝於感測器內部之積體電路晶片，因此目標朝向於將晶片封裝於感測器內部來達成體積小，有效率的壓電感測器。對於感測器裝配於射出成型機內部其電路則需要考量在內部溫度變化而造成目標值的不確定性，所以提出利用能帶能隙參考電路來改善因溫度變化所造成的影響，並且依所設計之電路來佈局驗證並且下線製作，有關訊號處理電路的分析設計，是利用HSPICE來模擬並驗證其在低雜訊、低功率、高頻寬的特性。而晶片製作是採用TSMC 0.35um 1P4M的製程參數。

Lead-zirconate-titanate (PZT) is always a significant component of force-sensing device, and it，s piezoelectric characteristic also complicates the readout processing circuit. Charge amplifier is the main method of voltage model operation amplifiers. There are lots of products developed on related market （KISTLER）, but most of those product’s chip areas are too large and too difficult to be packaged on the sensor. Thus, by using the design rules of CIC, we hope can design and tape out the suitable chips, which could be well fitted to all the processing and packaging conditions. Because the temperature dependences and modulations of designed sensor always do huge distortion on the ideal value, we propose a bandgap reference circuit to improve device temperature-dependent affects and verifies our design circuit. The analyses of our signal processing circuit are simulated and verified by HSPICE and it’s simulate manufacture of is based on TSMC 0.35 um 1P4M processing parameters.

中文摘要 i
英文摘要 ii
誌謝 iii
目錄 iv
表目錄 vii
圖目錄 viii
第一章 緒論 1
1.1 研究背景 1
1.2 研究動機 2
1.3 論文架構 3
第二章 電荷放大器之原理及文獻回顧 4
2.1 簡介 4
2.2 壓電元件操作原理與模型 5
2.3 訊號處理電路 8
2.4 電荷放大器的原理與問題 9
2.5 改善開關雜訊問題的方法 11
2.6 低阻抗電壓模式（LIVM） 14
2.7 結論 14
第三章 訊號處理電路之設計與製作 15
3.1 簡介 15
3.2 運算放大器設計 19
3.2.1 運算放大器設計之模擬結果 23
3.2.1.1 頻率響應 23
3.2.1.2 開迴路特性 24
3.2.1.3 暫態響應 25
3.3 輸出級設計 27
3.3.1 轉導放大器設計之模擬結果 31
3.3.1.1 頻率響應 31
3.3.1.2 開迴路特性 32
3.3.1.3 暫態分析 33
3.3.2 輸出級設計之模擬結果 34
3.3.2.1 頻率響應 34
3.3.2.2開迴路特性 35
3.3.2.3暫態分析 36
3.4 偏壓電路設計 36
3.4.1 啟動電路考量 40
3.4.2 偏壓電路模擬 42
3.5 差動放大器設計 44
3.5.1 差動放大器電路模擬 45
3.5.1.1 頻率響應 45
3.5.1.2 暫態響應 46
3.5.1.3 失真考量 47
3.6 電荷放大器設計 47
3.5.1 電荷放大器電路模擬 49
第四章 製作量測與討論 53
4.1 積體電路流程及佈局考量 53
4.1.1 佈局考量 54
4.1.2 電阻佈局 54
4.1.3 電晶體差動對佈局 55
4.2 整體電路佈局 56
4.2.1 軌對軌摺疊放大器佈局 56
4.2.2 轉導放大器 57
4.2.3 輸出級電路佈局 57
4.2.4 偏壓電路佈局 59
4.2.5 整體電荷放大器佈局 61
4.3 電源供應考量 62
4.4 封裝設計考量 63
第五章 結論與展望 66
5.1 結論 66
5.2 未來展望 67
參考文獻 68

[1] A. Brandolini, A. Gandelli, "A Piezoelectric-Hybrid Tactile Sensor for Robotics", in Proceedings of 1988 ISHM Symposium, Seattle, WA, U.S.A., October 17-19, 1988.
[2] A. Brandolini, A. Gandelli, "High-precision Single-cell Hybrid Tactile Sensor for Large Object Manipulation", in Proceedings of 1989 ISHM Symposium, Baltimore, MD, U.S.A., October 24-26, 1989.
[3] G. D’Antona, A. Gandelli, "Modular Technology in Developing Thick-Film Sensors" in Proceedings of 1991 ISHM Symposium, Orlando, FL, U.S.A., October 21-23, 1991.
[4] Moscovici. Alfi, High speed A/D converters understanding data converters through SPICE, Kluwer Academic Publishers: Boston, MA , c2001.
[5] 盧明智,盧鵬任，感測器應用與線路分析，臺北；全華出版社，2000。
[6] Donald R.Askeland, The Science and Engineering of Materials, 臺北；全華出版社, 1996年5月初版
[7] M. Ismail and T. Fiez, Analog VLSI Signal and Information Processing, McGraw-Hill, Inc. 1994.1
[8] Bruno Stefanelli, Jean-Paul Bardyn, Andreas Kaiser, Daniel Billet, "A Very Low-Noise CMOS Preamplifier for Capactive Sensors", IEEE Journal of Solid-State Circuits. Vol. 28, No. 9, September 1993.
[9] J. C. Stanton, "A Low Power Low Noise Amplifier For A 128 Channel Detector Read-Out Chip", IEEE Transactions on Nuclear Science, vol. 36, No. 1, February 1989.
[10] A. Brandolini, A. Gandelli, "Signal Evaluation and Measurement Techniques in a Single Cell Hybrid Tactile Sensor for Large Object Manipulation", in Proceedings of IMTC ’90, SanJose, CA, U.S.A., February 13-15, 1990.
[11] Alessandro Gandelli, Roberto Ottoboni, "Charge Amplifiers For Piezoelectric Sensors", in Proc. Of IMTC ’93, Irvine, Orange Country, CA, U.S.A., May 18-20, 1993.
[12] Siliconix, "Analog Switches and Their Applications", Santa Clara, CA, 1976.
[13] Alessandro Gandelli, Roberto Ottoboni, "Analog Processing Electronics In Intelligent Snesors For Advanced Robotics", IECON’93, Lahaina, Maui, Hawaii, U.S.A., November 18-20, 1993.
[14] Graeme Jerald G, Amplifier applications of Op Amps, New York: McGraw Hill, c1999.
[15] Sakurai. S. Ismail. M, "Robust design of rail-to-rail CMOS operational amplifiers for a low power supply voltage", IEEE JSSC, 1996, pp. 146-156.
[16] 王勇順，生物感測器訊號處理之關鍵積體電路方塊設計，碩士論文，中原大學電子工程研究所，中壢，2001。
[17] R. Jacob Baker, Harry W. Li, and David E. Boyce, CMOS circuit design, layout, and simulation, New York: IEEE Press, c1998
[18] Paul R. Gray, Robert G. Meyer, Analysis and design of analog integrated circuits, New York: John Wiley, c2001, pp.384-387.
[19] Phillip E. Allen, Douglas R. Holberg, CMOS analog circuit design, New York: Oxford University Press, 2002, pp.153-157.
[20] 賴鴻楠，聯華0.5um CMOS製程之儀表放大器設計，碩士論文，中華大學機械與航太工程研究所，新竹，1999。
[21] P. H. Lu, "Layout Techniques for Mixed-Signal IC", CIC, 1999.
[22] Jun Cheng and Guican Chen. "A CMOS bandgap reference circuit" ASIC, 2001. Proceedings. 4th International Conference on, 23-25, Oct. 2001, pp.271-273.
[23] Siew Kuok Hoon, Jun Chen, Maloberti, F. "An improved bandgap reference with high power supply rejection", Circuits and Systems, 2002, ISCAS 2002, 26-29 May 2002 pp.833-836. Vol.5
[24] "Piezoelectric Measurement System Comparison" http://www.dytran.com/
[25] 林大為，壓電式壓力感測器訊號處理電路之分析與設計，碩士論文，台北科技大學，機電整合研究所，台北，1999。
[26] Behzad Razavi, Design of analog CMOS integrated circuit, McGraw-Hill
Companies, Inc, 2001.