臺灣博碩士論文加值系統

本研究係應用田口方法針對筆記型電腦作分析，以熱傳理論的公式計算其各散熱座模組實驗數值量測在強制對流狀態下的熱傳，運用實驗設計得出的實驗數據，採用田口實驗設計方法加以驗證。使用一個 直交表 選定為實驗計劃，設定風扇位置(A，B)、風扇位置(C，D)、墊片厚度、風扇流動方式、傾斜角、風量、散熱面積、調整電流等八項參數設計作為控制因子，除第一項設定二水準外，其餘均採用三水準，應用直交表和信號雜音比求得最佳化參數。從田口方法分析結果發現，採用不同的控制因子，每個目標進行最佳化，找出最佳的散熱座方式。實驗結果顯示1組風扇放在(40,60)位置，2組風扇在(80,100)位置，軸流風扇向上吹方式，墊片高度0.4㎜，傾斜角為20.4°，風量為20m3/s，散熱面積為600mm2，電流150微安培的散熱效果最佳，可使筆記型電腦的散熱得到最佳之參數設計。
關鍵詞:田口方法，最佳化，筆記型電腦，散熱器。

In this study, the application of Taguchi method for notebook computers for analysis, heat transfer theory to calculate the heat of their numerical experiments Block measurement module in the state forced convection heat transfer.
Using design of experiment we have experiment values to be confirmation experiments using the Taguchi experiment-design method. An orthogonal array was selected as the experimental plan. Set up fan position(A,B) 、fan position(C,D)、pad high 、fan air flow direction 、above angle 、air-mass flow rate 、heat transfer areas 、alternate amperes…,eight various parameters design of control factors. Except for first parameter set up two levels, various parameters three levels. Using orthogonal array and signal/noise ratio to find optimize parameter. This is an analysis result to found from Taguchi method. Using to other control factor. Every object is to be optimization. Found optimized hest sink method. Experimental results showed that Group 1 fan on (40,60) the location of the fan in the Group 2 (80,100) position, axial fan blowing upward way gaskets 0.4 mm height, tilt angle of 20.4 °, the wind capacity of 20m3 / s, bulk thermal area of 600mm2, current 150 micro-amperes of the best cooling effect. It was found notebook computer have the best of heat sink by the optimized for the experiment method heat sink of design parameter.
Keyword: Taguchi method, optimize, notebook computer, heat sink.

目 錄
中文摘要……………………………………………………………I
英文摘要……………………………………………………………II
目錄……………………………………………………………………IV
表目錄………………………………………………………………VII
圖目錄………………………………………………………………VIII
符號說明……………………………………………………………X
第一章 緒論…………………………………………………………1
1-1前言…………………………………………………………1
1-2研究動機……………………………………………………3
1-3文獻回顧…………………………………………………………4
1-4研究目的…………………………………………………………10
第二章 散熱系統理論基礎……………………………………12
2-1散熱器散熱系統理論基礎…………………………………12
2-2熱對流………………………………………………………13
2-3 田口方法……………………………………………………16
2-3-1 田口方法介紹……………………………………16
2-3-2 田口實驗設計……………………………………18
2-3-3 參數設計………………………………………19
2-3-4 信號因子………………………………………20
2-3-5 控制因子………………………………………20
2-3-6 雜音因子………………………………………20
2-4 直交表………………………………………………21
2-4-1 直交表及其直交原理…………………………21
2-4-2 直交表的選擇………………………………24
2-5 信號雜訊比……………………………………………26
2-6 田口方法應用在散熱系統實驗的適用步驟…………27
第三章實驗設備與方法……………………………31
3-1 實驗系統………………………………………31
3-1-1 散熱器……………………………………31
3-1-2 電源供應器………………………………31
3-1-3 控制的電路板……………………………32
3-1-4 熱電偶線…………………………………32
3-1-5 溫度紀錄器…………………………………32
3-1-6 萬用數字型電錶…………………………32
3-1-7 測試筆記型電腦………………………………33
3-1-8 數位式交流電錶………………………………33
3-2 實驗方法…………………………………………34
3-2-1 實驗前之準備……………………………………34
3-2-2 實驗步驟…………………………………………35
第四章 結果與討論…………………………………………………41
4-1 實驗數據的結果…………………………………41
4-2 使用田口方法做分析…………………………………42
4-3 實驗數據的預測……………………………………45
4-3-1 各控制因子的歸類………………………………45
4-3-2 結果推定……………………………………………46
4-3-3 驗證實驗與結果推定……………………………46
4-3-4 推估效果…………………………………………47
第五章 結果與建議…………………………………………………64
5-1結論………………………………………………………64
5-2 建議………………………………………………………65
參考文獻……………………………………………………………66
表目錄
表2-1 直交表…………………………………………….....………29
表4-1 C1,D1,風扇向下吹,加一墊片…………………………………49
表4-2 C2,D2,風扇向下吹,加一墊片…………………………………50
表4-3 C3,D3,風扇向下吹,加一墊片…………………………………51
表4-4 A1,B1,風扇向上吹,加一墊片…………………………………52
表4-5 A2,B2,風扇向上吹,加一墊片…………………………………53
表4-6 A3,B3,風扇向上吹,加一墊片…………………………………54
表4-7 L18直交表………………………………………………55
表4-8 參數水準表………………………………………………56
表4-9 實驗直交表………………………………………………57
表4-10 各組平均值，標準偏差，及S/N比……………………58
表4-11 S/N比的因子反應表……………………………………59
表4-12 品質特性反應表…………………………………………59
表4-13 控制因子的分類表…………………………………………60
圖目錄
圖 2-1 信號因子、雜音因子、控制因子參數……………………30
圖3-1 實驗系統圖……………………………………………………36
圖3-2 散熱器尺寸圖…………………………………………………37
圖3-3 系統實體圖…………………………………………………38
圖3-4 散熱器圖…………………………………………………38
圖3-5 風扇控制的電路器……………………………………………39
圖3-6 溫度記錄器…………………………………………………39
圖3-7 實驗設計流程圖………………………………………………40
圖4-1 A1,B1,風向向上，加一墊片，Length,Width及Nu之變動關係…………………………………………………………60
圖4-2 A2,B2,風向向上，加一墊片，Length,Width及Nu之變動關係………………………………………………………60
圖4-3 A3,B3,風向向上，加一墊片，Length,Width及Nu之變動關係………………………………………………………61
圖4-4 C1,D1,風向向下，Length,Width及Nu之變動關係………………………………………………………61
圖4-5 C2,D2,風向向下，Length,Width及Nu之變動關係…………………………………………………………62
圖4-6 C3,D3,風向向下，Length,Width及Nu之變動關係………………………………………………………62
圖4-7 S/N因子反應圖………………………………………………63
圖4-8 品質特性的因子反應圖………………………………………63

參考文獻
[1] Lin Chao,” Second-Generation Intel® Centrino™ Mobile
Technology”, Intel Technology Journal, Vol. 9, Issue 1, 2005.
[2] 陳律安，”電腦水冷散熱系統之效益研究”，成奶j學工
程科學系，碩士論文，2005年.
[3] C.L.Chapmam, S.lee，B.L.Schmidt,”Thermal
performance of an elliptical pin fin heat sink”,Tenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium. IEEE，1994,pp.24-31.
[4] Wirtz,R.A.,Chen W.M.,and Zhou, R.H., “Effect of flow
bypass on the performance of longitudinal fin heat sinks”,Journal of Electronic Packaging, ASME, Vol .116, 1994, pp. 206-211.
[5] Marsuria,M.S and Kamath, V.,”Optimization of a
high-performance heat-sink /fan assembly”, Heat Transfer in Electronic System, ASME, Vol. 292, 1994,pp.95-104.
[6] 王志賓，“CPU鰭片散熱效益之研究”，國立成奶j學工
程科學研究所碩士論文，1994年.
[7] Butterbaugh, M.A. and Kang, S.S., ”Effect of air-flow bypass on the performance of heat sinks in electronic
cooling”, Advance in Electron Packing , ASME, Vol. 10-2,1995,pp.843-848.
[8] Wirtz, R.A. Sohal, R. and Wang H.,，”Thermal Performance of Pin-Fin Fan-sink Assemblies”,Journal of Electronic Packaging, ASME, Vol.119,1997, pp. 26-31.
[9] H.Xie,A.Ali and R.Bhatia,”The use of Heat pipe in a computer”,1998 Inter Society Conference on Thermal Phenomena, 1998,pp.442-448.
[10] Andrea de Lieto Vollaro, Stefano Grignaffini, Franco
Gugliermetti,” Optimum design of vertical rectangular fin
arrays”, Int. J. Therm. Sci. ,Vol.38,1999, pp.525-529.
[11] Tavassoli,B., ”A Novel Heat Sink Design for Low Speed Flow a BGA Example” ,Intersociety Conference on Thermal Phenomena (I-THERM2000),IEEE, Las Vegas, Nevada, USA, 2000,pp. 16-20, May 23-26.
[12] Thurlow, E.Prather., and Mansingh,V., “Fan Sirwl Effect on Cooling Heat Sink and Electronic Packages”, Sixteenth IEEE SEMI-THERM Symposium, Vol. 1, No 7,2000,pp.91-98.
[13] L.A.Brignoni and V.Garimella,”Experiment optimization of confined air jet impingement on a pin fin Heat Sink”, IEEE Transaction on components and Packaging Technology, Vol .22,2000,pp. 300-308.
[14] H.A.El-Sheikh and V.Garimella,”Experiment air jet impingement heat transfer using pin-fin heat sink”, IEEE Transactions on Components and Packaging Technology, Vol. 23,2000,pp. 300-308.
[15] Nauyen, T.,Mochizuki, M.,Mashiko, K., and Saito, Y., “Use of heat pipe/heat sink for thermal management of high of performance CPUs”, Sixteenth IEEE-THERM Symposium, 2000,pp. 76-79.
[16] H.Y.Zhang,D.Pinjala, O.K.Navas, M.K.Chan, X.P.Liu,
.Hayashi, J.B.Han.,”Development of thermal solutions for
high performance laptop computer”, IEEE Inter Society
Conference on Phenomena, 2002,pp. 433-440.
[17] E.Dallago, G Venchi, “Thermal Characterization of Compact Electronic System: A portable pc as study case”, IEEE Transactions on Power Electronics,Vol.17,No.2, March 2002,pp.187-195.
[18] El-Sayed, S.,Mohamed, S.M.,Abdel-latif, A.M.,and Abouda,A.E., ”Investigation of Turbulent Heat Transfer and Fluid in Shrouded Fin Array of Different Geometries and Shrouded Fin Array”, Experimental Thermal and Fluid Science, Vol .26,2002,pp 879-900.
[19] Sikka,K.K., Torrance, K.E.Scholler, C.U. and Salanova, P.I., ”Heat Sinks With Fluted And Wavy Plate Fin in Natural and Low-Velocity Forced Convection.”，IEEE Transactions on Components and Packaging, Vol. 25 ,No 2.June 2002,pp.283-292.
[20] 呂韋龍，劉碩倫，”CPU冷卻器散熱鰭片之分析研究”，
國立屏東科技大學機械工程系，碩士論文，2002年.
[21] 吳培立，”筆記型電腦散熱系統之研究—成奶j學工程科學”， 碩士論文，2006年.
[22] Bayram Sahin , Kenan Yakut, Isak Kotcioglu,Cafer Celik,” Optimum design parameters of a heat exchanger”, Applied Energy, Vol.82 ,2005,pp.90–106.
[23] Kenan Yakut , Nihal Alemdaroglu , Isak Kotcioglu, Cafer Celik ,”Experimental investigation of thermal resistance of a heat sink with hexagonal fins”, Applied Thermal Engineering, Vol.26 ,2006 ,pp.2262–2271.
[24] Ko-Ta Chiang,” Optimization of the design parameters of Parallel-Plain Fin heat sink module cooling phenomenon based on the Taguchi method”, International Communications in Heat and Mass Transfer, Vol.32,2005,pp.1193–1201.
[25] Ko-Ta Chiang,” Modeling and optimization of designing parameters for a parallel-plain fin heat sink with confined impinging jet using the response surface methodology”, Applied Thermal Engineering ,Vol.27,2007,pp.2473–2482.
[26] 黃振康、蘇程裕、徐振民等人，“散熱鰭片自然對流性能
提昇之研究”，中國機械工程學會第二十五屆全國學術研
討會論文集，2008年.
[27] J.P.Holman著，熱傳遞學，王鎮雄等譯，七版，高立出版社，台北，民國九十五年.

[28] 李輝煌著，田口方法品質設計的原理與實務，高立圖書有
限公司，第三版，2008年.
[29] 蘇朝墩，“田氏品質工程”，中華民國品質學會，2002年.
[30] Phadke,M.S., ”Quality Engineering Using Robust
Design”, Prentice Hall, 1989.
[31] Taugchi,G., Chowdhury,S. and Wu,Y. ”Taguchi Quality Engineering HandBook”, John Wiley & Sons.
2004.