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研究生:張佳蓉
研究生(外文):Chia-Jung Chang
論文名稱:半導體製程與設備之健康指標分析
論文名稱(外文):Health Index of Semiconductor Processes & Equipments
指導教授:桑慧敏桑慧敏引用關係曾勝滄曾勝滄引用關係
指導教授(外文):Wheyming SongSheng-Tsaing Tseng
學位類別:碩士
校院名稱:國立清華大學
系所名稱:工業工程與工程管理學系
學門:工程學門
學類:工業工程學類
論文種類:學術論文
論文出版年:2007
畢業學年度:95
語文別:英文
論文頁數:32
中文關鍵詞:半導體健康指標製程/機台品質管制
外文關鍵詞:Semiconductor IndustryEquipment Health Index
相關次數:
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半導體產業為現今台灣最重要且資金稠密度最高的產業之一。隨著科技的發展與製程技術的改善,晶圓尺寸日益增大;而其製作出之元件/晶片的尺寸則日趨輕薄短小。針對此高精密度的製程,如何即時有效瞭解機台的健康狀況及其對應之製程表現,進而提升製程良率、增進產出並降低成本,實為一極具挑戰性的重要議題。

此外,由於半導體製程之步驟繁複且歷時甚久,產品的品質特徵值在各製程加工中難以即時取得。如何仰賴生產線之機台製程資料,定義機台各子系統的健康指標並且有效偵測出製程之異常表現,為現今半導體業製程監控工作之重大挑戰。本研究提出一系統性的半導體製程品質管制監控系統,依據生產線之機台製程資料,可有效並快速的偵測異常製程並且提供機台的即時健康情況之分析。
Semiconductor industry is one of the most important and capital-intensive industries in Taiwan. As the trend of extended wafer size and narrowed feature size of chips and dies, the powerful and suitable control scheme for such highly accurate manufacturing becomes the essential issue to improve the yield, enhance the throughput and decrease the cost.

Due to the rare output observation known as metrology compared with the huge sensor data set collected on-line over the whole process, it is the crucial challenge to detect the abnormal performance of process and analyze the health conditions of equipment effectively within the shortest possible time. In this research, the novel fault detection and classification, FDC, system is provided to perform the fast and precise diagnosis for process/equipment healthy performance determination.
ABSTRACT I
CHINESE ABSTRACT II
ACKNOWLEDGEMENT III
CONTENTS IV
FIGURE AND TABLE CAPTIONS V
CHAPTER 1. INTRODUCTION 1
1.1. BACKGROUND 1
1.2. MOTIVATION 2
1.3. ORGANIZATION 3
CHAPTER 2. LITERATURE REVIEW 5
2.1. STATISTICAL PROCESS CONTROL, SPC 5
2.2. FAULT DETECTION AND CLASSIFICATION, FDC 6
2.3. HIDDEN EXTRAPOLATION 8
2.4. WESTERN ELECTRIC RULES, WERS 8
CHAPTER 3. CONCEPTS OF NEW FDC FOR SEMICONDUCTOR INDUSTRY 10
3.1. DATA DISCRIMINATION 11
3.2. HIDDEN EXTRAPOLATION IN FDC FOR IC PROCESS 12
3.3. SCORING MECHANISM 14
3.4. FAULTY WAFER/EQUIPMENT DIAGNOSIS 15
CHAPTER 4. ADJUSTMENTS OF WERS (WESTERN ELECTRIC RULES) FOR THE AUTO-CORRELATED DATA 17
4.1. SIMULATION EXPERIMENT AND RESULTS OF MODIFIED WERS 17
4.2. THE FURTHER DISCUSSION AND SUMMARY ON SIMULATION RESULTS 21
CHAPTER 5. ILLUSTRATED EXAMPLES AND CONCLUSIONS 24
5.1. TWO ILLUSTRATED EXAMPLES 24
5.2. CONCLUSIONS AND FUTURE RESEARCH 30
REFERENCE 31
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