臺灣博碩士論文加值系統

IC的不斷的發展使得電子元件輕薄短小、多功能，使我們生活更加便利方便。電子元件中的錫球是重要的元件之一，除了電訊導通、增加機械結構強度，因此錫球的可靠度是研究人員所探討的重點。本文主要探討SAC305無鉛錫球在WLCSP封裝疲勞壽限預測的探討，利用現有實驗數據與有限元素模擬分析結果，推導出SAC305安南模式在累積塑性功密度的破壞指標下，疲勞壽命公式預測。
為了滿足欠缺有限元素模型技巧的研究分析人員進行結構分析，完成通用的錫球為周邊陣列分布或全域陣列分布的WLCSP封裝體，ANSYS有限元素模型程式碼建立。使用者可輸入想要分析的幾何尺寸，材料參數與熱循環負載設有一組自訂值，設計者可自行修正。兩款WLCSP封裝體，分別為周邊陣列分布之錫球，晶片長度為6 mm的模組A與全域陣列分布之錫球，晶片長度為8 mm的模組B，並成功地進行ANSYS有限元素模型程式碼的驗證。
現有的實驗數據為熱衝擊模組A四個不同晶片封裝厚度(400、550、715、815m)與熱循環模組B晶片封裝厚度為 400 m。在有限的資料下，進行Schubert的錫球破壞模式分析可知，兩款WLCSP封裝熱循環與熱衝擊第三循環的累積潛變應變能密度範圍(W)與累積von Mises潛變應變範圍()，取對數後為分別為線性；不同負載W與的關係互相平行，顯示其相關性良好。但Schubert的疲勞壽命公式預測有某種程度的誤差，源於分析與實驗(SAC305)的錫球材料特性的差異。在熱衝擊負載中，將實驗壽命與分析結果，利用最小平方差線性回歸法可得兩個不同疲勞破壞指數的壽命預估模式，其預估壽命與實驗誤差可達8 % 以內。進而推導熱循環負載兩個不同疲勞破壞指數的壽命預估模式，並可預測其模擬實驗壽命。
最後利用前述模擬實驗壽命與實際實驗壽命，在安南模式下，所得到的累積潛變應變能密度範圍(W)，同樣利用最小平方差回歸法求得熱循環與熱衝擊的錫球壽命預測方程式，可以發現與預估壽命做比較誤差非常小。
吾人將前述的錫球壽命方程式，應用於另種WLCSP上，而此種WLCSP分為傳統的標準型設計與Ankor型的新設計，兩者之間最大差異則在於錫球銅柱是否有跟綠漆接觸，吾人將此兩種構裝體經由熱衝擊及熱循環分析後，吾人發現機台實驗數據與模擬分析所得之疲勞壽命，兩者之間誤差亦非常小。

The continuous development of IC has the electronic components thin, compact and versatile which makes our lives more convenient. As one of the most important components in the electronics, solder ball can not only enable telecommunications but also strengthen its mechanical structure, therefore, the reliability of solder ball becomes a discussion topic of the researchers. This paper mainly discusses SAC305 lead-free solder ball in the fatigue life prediction of WLCSP package, and uses existing experimental data and finite element simulation results to deduce the fatigue life prediction equation for SAC305 Anand mode in the destruction indicator of accumulated plastic work density.
In order to meet the demand of researchers lack of the finite element model analysis techniques for structural analysis to complete the common WLCSP package with the solder ball distribution of peripheral array or global array, the program code of ANSYS finite element model was created. Users can enter the desired analyzed geometry, while material parameters and thermal cyclic loading with a set of user-defined values can be amended by the designer at discretion. Both WLCSP packages were Module A with the solder ball distribution of peripheral array and a chip length of 6mm as well as Module B with the solder ball distribution of global array and a chip length of 8mm, respectively, and successfully carry out validation of the program code of ANSYS finite element model.
Existing experimental data include the four different chip package thicknesses (400, 550, 715, 815 m) of thermal shock Module A and the chip package thickness (400 m) of thermal recycling Module B. Based on limited data and known from Schubert's solder ball failure mode analysis, the accumulated creep strain energy density range (W) and the accumulated von Mises creep strain range () for thermal cycle and third cycle of thermal shock of both WLCSP packages are respectively linear by taking logarithm; W and for different loads are parallel, showing good correlation. But Schubert's fatigue life prediction equation has errors of a certain degree, resulting from the difference in SAC305 solder ball characteristics. In the thermal shock loads, the experiment life and analysis results are treated with the least square linear regression method to get two fatigue life prediction modes for two different fatigue failure indices having a difference between life expectancy and experimental error of 8% or less. Thus deduce the life prediction mode for two different fatigue failure indices for thermal cycle loading, which can be used to predict the simulation experiment life.
Finally by use of the above-mentioned simulation experiment life and the actual experiment life, in the Anand mode, the accumulated creep strain energy density range (W) is obtained, and also, the least square linear regression method is used to get the solder ball life prediction equation for thermal cycle and thermal shock, showing that there is a small error with the life expectancy.
The author applied the above-mentioned solder ball life prediction equation to another WLCSP which is divided into a conventional standard design and new Ankor type design. The large difference between them is whether the copper post of solder ball is contact with green paints. After two packages were treated with thermal shock and thermal cycle analysis, the author found that there is also a small error between the actual experiment fatigue life and the simulation experiment fatigue life.

目錄
中文摘要.................................................................................... i
英文摘要................................................................................. iii
誌謝....................................................................................... vi
目錄........................................................................................ vii
圖目錄.................................................................................... ix
表目錄.................................................................................... xi
第一章、簡介.............................................................................. 1
1-1半導體封裝介紹............................................................ 1
1-2研究動機與目的......................................................... 8
1-3研究方法................................................................... 9
第二章、WLCSP封裝介紹.............................................................. 10
第三章、錫球可靠度...................................................................... 14
3-1 Syed無鉛錫球壽命模式[16]............................................. 16
3-2 Schubert無鉛錫球壽命模式[18]........................................ 19
3-3 Zahn無鉛錫球壽命模式[21]............................................. 21
第四章、有限元素分析.................................................................. 23
4-1有限元素模型程式........................................................ 23
4-2有限元素模型............................................................... 27
4-3材料特性..................................................................... 29
4-4負載及邊界條件............................................................ 30
第五章、結果與討論...................................................................... 32
5-1有限元素模型............................................................... 32
5-2疲勞破壞模式............................................................. 35
5-3 SAC305破壞模式....................................................... 42
5-4有限元素分析結果......................................................... 44
第六章、Ankor型式WLCSP疲勞壽命探討....................................... 48
6-1封裝體介紹................................................................. 48
6-2有限元素模型............................................................ 52
6-3邊界條件及負載條件................................................... 53
6-4標準型與Ankor型設計之疲勞壽命比較........................ 54
第七章、結論.............................................................................. 59
參考文獻....................................................................... 62

1. 黃舒意，”台灣年輕族群對消費性電子產品的未來需求”，國立政治大學，國際經營管理英語碩士學位學程(IMBA)，碩士論文，2009年。
2. 張玉奭，”電子產品之吸引力與進步性效能分析－以筆記型電腦為例，東吳大學，EMBA高階經營碩士在職專班，碩士論文，2008年。
3. 鍾文仁、陳佑任，「IC封裝製程與CAE應用」，全華科技圖書有限公司，2006年。
4. Uwww.DfRSolutions.comU。
5. Chang-Ming Liu, Kuo-Ning Chiang,” Solder Bumps Layout Design And Reliability Enhancement of Wafer Level Packaging,” International Conference on Electronic Packaging Technology, pp. 56-64, 2003.
6. Chang-Chun Lee, Shu-Ming Chang, Kuo-Ning Chiang, ”Design of Double Layer WLCSP Using DOE with Factorial Analysis Technology,” Electronics Packaging Technology Conference, pp. 776-781, 2004.
7. Chang-Ann Yuan, Cheng Nan Han, Ming-Chih Yew, Chan-Yen Chou, and Kou-Ning Chiang, ”Design, Analysis, and Development of Novel Three-Dimensional Stacking WLCSP,” IEEE Transactions ON Advanced Packaging, Vol. 28, No. 3, pp. 387-396, August 2005.
8. Chang-Ming Liu, Kuo-Ning Chiang, ”Reliability Enhancement of Wafer Level Packaging Using Solder Ball Layout Methodology,” International Conference on Electronic Packaging Technology, 2005.
9. Ji-Cheng Lin, Hsien-Chie Cheng, and Kuo-Ning Chiang, ”Design and Analysis of Wafer-Level CSP With a Double-Pad Structure,” IEEE Transactions on Components and Packaging Technologies, Vol. 28, No 1, pp. 117-126, March 2005.
10. John H. Lau, S-W. Ricky Lee, ”Reliability of Wafer Level Chip Scale Package (WLCSP) with 96.5Sn-3.5Ag Lead-Free Solder Joints on Build-up Microvia Printed Circuit Board,” Int’l Symp on Electronic Materials &; Packaging, pp. 55-63, 2000.
11. John H. Lau, S-W. Ricky Lee and Chris Chang, ”Solder Joint Reliability of Wafer Level Chip Scale Packages (WLCSP): A Time-Temperature-Dependent Creep Analysis,” ASME Journal of Electronic Packaging, Vol. 122, pp. 311-316, December, 2000.
12. John H. Lau, Stephen H. Pan and Chris Chang, ”Creep Analysis of Wafer Level Chip Scale Package (WLCSP) With 96.5Sn-3.5Ag and 100In Lead-free Solder Joints and Microvia Build-up Printed Circuit Board,” ASME Journal of Electronic Packaging, Vol. 124, pp. 69-76, June, 2002.
13. John H. Lau, Stephen H. Pan and Chris Chang, ”A New Thermal-Fatigue Life Prediction Model for Wafer Level Chip Scale Package (WLCSP) Solder Joints,” ASME Journal of Electronic Packaging, Vol. 124, pp. 212-220, September, 2002.
14. Satish C. Chaparala, Brian D. Roggeman, James M. Pitarresi, Bahgat G. Sammakia, John Jackson, Garry Griffin, and Tom McHugh,” Effect of Geometry and Temperature Cycle on the Reliability of WLCSP Solder Joints,” IEEE Transactions on Components and Packaging Technologies, Vol. 28, No 3, pp. 441-448, September, 2005.
15. April B. Jacobe, Pinky B. Lomibao, John Jackson, “Board Level Reliability of Wafer Level Chip Scale Packages With Copper Post Technology,” International Electronic Manufacturing Technology, pp. 155-161, Putrajaya, Malaysia 2006.
16. Ahmer Syed,” Updated Life Prediction Models for Solder Joints with Removal of Modeling Assumptions and Effect of Constitutive Equations,”7th. Int. Conf. on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE pp. 1-9, 2006.
17. Wiese, S.,et al, “Microstructural Dependendence ofConstitutive Properties of Eutectic SnAg and SnAgCuSolders,” 53rd Electronic Components and Technology Conference, pp. 197-206, 2003.
18. Schuber A, ”Fatigue Life Models for SnAgCu and SnPb Solder Joints Evaluated byExperiments and Simulation,”IEEE Electronic Components and Technology Conference, pp. 603-610, 2003.
19. A. Schubert, R. Dudek, H. Walter, E. Jung, A. Gollhardt, B. Michel, H. Reichl, “Reliability Assessment of Flip-Chip Assemblies with Lead-free Solder Joints,” IEEE Electronic Components and Technology Conference, pp.1246-1255, 2002
20. Dudek, R., Nylen, M., Schubert, A., Michel, B., Reichl,H., “An Efficient Approach to Predict Solder Fatigue Lifeand its Application to SM-and Area Array Components,”47IhECTC Electronics Components &;Technology Conference,San Jose, CA, USA, May 21-24, pp. 462-471, 1997.
21. Bret A. Zahn, “Solder Joint Fatigue Life Model Methodology for 63Su37Pb and 95.SSn4AgO.SCu Materials,” IEEE Electronic Components and Technology Conference, pp,83-94, 2003.
22. Mohammad Motalab, Zijie Cai, Jeffrey C. Suhling, Pradeep Lall, ”Determination of Anand constants for SAC Solders using Stress-Strain or Creep Data,”13th IEEE ITHERM Conference, pp. 910-923, 2012.