臺灣博碩士論文加值系統

摘要
黃光製程是IC生產中最關鍵的一門技術，它決定了整個製程的先進程度，而光罩圖案轉移的優劣會直接影響後續製程的進行。在現行的半導體黃光製程中，由於不同機台、不同光罩(Mask)與晶圓本身都會造成不同層(Layer)間的光罩圖案疊合時產生位移和誤差，尤其隨著關鍵尺寸不斷縮小、晶圓尺寸變大以及光罩數目的增加，黃光重疊控制誤差容忍度也越來越嚴苛，當黃光製程的重疊控制誤差超過誤差容忍度則層間設計電路可能因為位移發生斷路、短路而無法通過電性測試影響良率，進而造成產品報廢。因此，重疊控制誤差控制-準確的濾除不確定及隨機因素並估測出精確的最佳化可調整參數來穩定地降低重疊控制誤差，是控制生產良率的重要指標，也因此，重疊控制(Overlay)量測 - 即針對晶圓上先前已有定義過的圖案，量測一個黃光圖案置於晶圓時的精準度，以避免重疊控制錯誤造成的元件故障，在黃光製程中相形重要。
在生產管理及許多工業工程領域的文獻探討中，發展出了許許多多不同的派工法則來滿足此種限制，諸如：同族(Family-based)派工法則、避免飢餓法(Starvation Avoidance, Glassey and Petrakian, SA)、FIFO…etc.但目前的方式都是被動地被單機限制下(Single Tool Constrain)所發展出來的解法，並無法真正解決問題。
本研究藉整合多個製程與製造的專家控制系統，主動地解決單機限制問題，並運用作業研究之動態規劃模式搭配系統化的邏輯思考方式來撰寫輔助軟體，實際建構出一套模式與系統，期真正能協助解決半導體公司所遇到的問題。

Abstract
Photo is a critical process and technology in semiconductor manufacturing and it plays a role how intelligent the IC processing, in which the quality of mask pattern will have a great direct impact on downstream processing. During lithographing process, the motion and difference will occur in mask overlapping due to different tools, different masks and a wafer itself. However, the tolerance for mask overlapping has become more critical as the dimension of metal line shrines to be narrower, the wafer size becomes bigger and the mask layers increase. The circuit may be malfunction as the tolerance in overlapping is over. Therefore, error-overlapping control to move out uncertainty and stochastic risk factors is they key for fab yield by accurately estimate parameters. Overlapping measurement that is predefined pattern for wafer accuracy to avoid breakdown in IC device is very important in Photo.
In many research for industrial engineering and operation research, there are so many dispatching rules to satisfy such constraints, such as family-based dispatching rule, starvation avoidance-Glassey and Petrakian, SA, Fifo (First-in-First-Out), etc. All of them are developed to such solutions but cannot be really solve under the single tool constraints.
In this paper, we propose a model that integrates actively control the single tool problem. By means of dynamic planning model on operation research and logical thinking with systematic software, such a model and system can practically solve the problem in semiconductor manufacturing.

中文摘要........................................................................................................................ii
Abstract.......................................................................................................................iii
誌 謝...........................................................................................................................iv
目 錄............................................................................................................................v
圖目錄..........................................................................................................................vii
第一章 緒論................................................................................................................1
1.1 研究背景及動機.............................................................................................1
1.2 研究目的.........................................................................................................5
1.3 研究範圍與限制.............................................................................................7
1.4 論文架構.........................................................................................................8
第二章 文獻探討........................................................................................................9
2.1半導體產業與黃光製程技術概況..................................................................9
2.2黃光重要製程介紹........................................................................................11
2.2.1 黃光臨界尺寸....................................................................................13
2.2.2 黃光重疊控制....................................................................................16
2.3 重疊控制誤差的成因與造成的影響...........................................................18
2.3.1 重疊控制誤差的成因........................................................................18
2.3.2 重疊控制誤差之測量與影響............................................................19
2.4動態規劃法....................................................................................................22
2.4.1動態規劃問題的特性.........................................................................23
2.4.2動態規劃問題的應用.........................................................................25
第三章 系統建構與模式設計..................................................................................26
3.1專家系統功能................................................................................................26
3.1.1智慧型製程控制系統.........................................................................26
3.1.2智慧型重疊控制系統.........................................................................28
3.2動態規劃模式設計........................................................................................30
3.2.1系統設計.............................................................................................31
3.2.2 系統限制............................................................................................33
第四章 實作分析與驗證..........................................................................................35
4.1個案公司簡介與資料收集............................................................................35
4.2原有問題描述與現況掌握............................................................................36
4.2.1問題描述與現況掌握—新演算公式需求.........................................37
4.2.2問題描述與現況掌握—專家系統需求.............................................38
4.3 系統建置與實作分析...................................................................................38
v
4.3.1 新演算法則之系統發展....................................................................38
4.3.2 EOCS系統使用之未知參數估算......................................................39
4.3.3 EOCS系統功能設計..........................................................................39
4.3.4 EOCS系統介面設計..........................................................................40
4.3.5 成果驗證............................................................................................40
第五章 結論與未來研究建議....................................................................................45
5.1. 結論......................................................................................................45
5.2. 未來研究建議......................................................................................46
參考文獻......................................................................................................................48

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