臺灣博碩士論文加值系統

本論文將針對創新性零插入力微型連接器的設計、製作與特性量測進行探討。零插入力微型連接器，可解決目前微機電連接器開發所面臨的技術瓶頸，如端子磨耗、高速訊號傳輸之完整性、電磁干擾與缺乏夾持機構設計等相關議題。零插入力微型連接器，除可作為細間距、高速訊號傳輸之連接器應用外，更可將其應用範圍拓展至三維立體封裝、微機電元件測試平台與異質性材料系統構裝等領域。
接觸電阻在連接器應用中扮演著極重要的角色，因此本論文將開發嶄新量測微接觸特性的測試元件，定量化在不同接觸次數下接觸電阻、接觸力與表面粗糙度間關係。由於測試元件具備寄生電阻的校正功能，可增加接觸電阻量測的準確性，因此可萃取出相關的微接觸特性，除此之外，更發展誤差傳遞理論，評估接觸電阻量測誤差對微接觸特性萃取所造成的影響。

MEMS-based connectors, manufactured for various applications in industry, are often criticized for problems such as the wearing effect, the poor signal integrity, the EMI prevention for high-speed signal transmission, and the lack of latch design. In this thesis a novel zero-insertion-force (ZIF) micro(μ)-connector and its characterization were presented. The characterization included the design, fabrication, analysis, and quantitative evaluation. The proposed ZIF μ-connector has been shown to remedy these problems. Potential applications of the ZIF μ-connector were addressed.
Contact resistance for MEMS-based devices has been investigated. In particular, a micromachined testing device, designed for the removal of the parasitic resistance, was used to more precisely analyze the relationships among the contact force, the contact resistance, and the contact surface across multiple contact cycles. Error propagation analysis has been conducted to evaluate the accuracy of the measured properties.

中文摘要 I
英文摘要 II
誌謝 III
目錄 IV
圖目錄 VII
表目錄 XII
第1章 前言 1
1-1 研究動機 1
1-2 研究目標 3
1-3 未來可應用領域 5
1-4 論文架構 9
第2章 設計與理論分析 17
2-1 零插入力微型連接器設計 17
2-1-1 微型連接器結構設計 17
2-1-2 端子出平面幾何形狀控制原理 18
2-1-3 夾持機構設計 19
2-1-4 零插入力設計 19
2-1-5 矽基材電阻的選用 20
2-1-6 過負載保護設計 21
2-1-7 阻抗匹配設計 21
2-2 端子特性理論分析 21
2-2-1 端子出平面幾何形狀控制理論分析 22
2-2-2 端子出平面幾何尺寸限制條件 30
2-2-3 最大傳送訊號電壓與功率分析 30
第3章 製程與特性模擬與量測 45
3-1 製程設計與結果 45
3-1-1 底座晶片的製程 45
3-1-2 上蓋的製程 46
3-1-3 公端的製程 46
3-1-4 微型連接器的組裝 47
3-1-5 端子製程挑戰與解決方案 47
3-1-6 製程結果 48
3-2 特性模擬與量測 49
3-2-1 端子出平面幾何形狀的量測與理論分析的驗證 49
3-2-2 正向力理論分析結果與模擬分析驗證 50
3-2-3 零插入力致動電壓的量測 51
3-2-4 端子傳送訊號最大電壓與功率估算 51
3-2-5 接觸電阻的量測 52
3-2-6 接觸電阻的量測誤差分析 53
3-2-7 高頻特性分析與量測 54
3-2-8 阻抗匹配設計 55
3-3 微型連接器特性比較 55
第4章 微型連接器接觸特性探討 75
4-1 微接觸電阻特性 76
4-2 微接觸特性的萃取 78
4-2-1 氧化膜厚度萃取 78
4-2-2 等效接觸面積半徑萃取 79
4-3 微接觸測試元件開發 80
4-3-1 微接觸測試元件設計 81
4-3-2 微接觸測試元件自身電阻校正 83
4-4 微接觸特性量測 84
4-4-1 測試元件製程與組裝 85
4-4-2 測試元件特性量測 85
4-4-3 接觸正向力與接觸電阻量測 86
4-4-4 接觸特性萃取 87
4-5 微接觸行為模型 88
4-6 微接觸測試元件應用 89
第5章 總結 108
5-1 研究成果 108
5-2 未來工作 110
參考文獻 113
附錄 A 薄膜楊氏係數量測 121
A-1 理論分析 121
A-2 二氧化矽懸臂樑測試鍵製作 122
A-3 測試儀器架設 123
A-4 楊氏係數萃取 123
A-4-1 金膜楊氏係數萃取 123
A-4-2 類鑽膜楊氏係數萃取 124
附錄 B 薄膜殘餘應力量測 130
B-1 殘餘應力之生成 130
B-2 殘餘應力量測 131
B-2-1理論分析 132
B-2-2金膜殘餘應力 134
B-2-3類鑽膜殘餘應力 135
附錄 C 微接觸特性萃取的誤差傳遞分析 140
C-1 誤差傳遞理論分析 140
C-1-1 Explicit函數的誤差傳遞分析 140
C-1-2 Implicit 函數的誤差傳遞分析 142
C-1-3 Kundsen ratio < 1之等效接觸面積半徑誤差傳遞分析 144
C-1-4 Kundsen ratio > 1之等效接觸面積半徑誤差傳遞分析 144
C-1-5 Ohmic電阻誤差傳遞分析 145
C-1-6 Sharvin電阻誤差傳遞分析 145
C-1-7 氧化膜厚度誤差傳遞分析 146
C-2 微接觸特性萃取的誤差傳遞分析驗證 147

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