臺灣博碩士論文加值系統

硬磁薄膜中的殘留應力對於微機電系統（MEMS）中的磁性元件的性能和可靠性是重要的關鍵。然而，因為MEMS中磁性元件需較高磁能積的電鍍硬磁薄膜，因此硬磁薄膜需要達到一定的厚度，亦由於硬磁薄膜厚度增加，導致存在薄膜內部的應變能增加，因此不可避免地產生顯著的殘留應力。許多文獻已開發了各種方法來降低電鍍硬磁薄膜中的殘留應力，其中最有效的方法為在電鍍過程中摻入中間層，用以增強附著性和釋放薄膜殘留應力。
在本研究中，以電鍍方式製備具有六方最密堆積（HCP）且織構方向為c軸方向之Co-Mn-P硬磁薄膜，針對相同的總磁性層厚度，比較單層CoMnP硬磁薄膜及多層CoMnP/Cu系統。運用X光sin2繞射法與曲率量測法，探討CoMnP硬磁薄膜微觀上晶粒應力、巨觀上膜層應力及硬磁性能三者之間相互關係。結果發現，中間層Cu的摻入能有效消除薄膜之膜層應力，多層CoMnP/Cu系統之硬磁性能仍保持在與單層CoMnP硬磁薄膜相當的水平，而硬磁性能與晶粒應力之間有強烈的關聯性，符合應力導致異向性之硬磁材料性質。

Residual stress in hard magnetic layers has been an important matter for both performance and reliability of magnetic components in magnetic microelectromechanical systems (MEMS). However, in order to achieve high energy-product, many MEMS devices heavily rely on increasing the thickness of magnetic layer by electrodeposition. Due to the increased magnetic volume, as elastic strain energy stored in the films increases, residual stress in the electrodeposited thick layers is inevitably generated. Various techniques have been developed to reduce residual stress in electrodeposited magnetic layers. Introducing interlamination layers for enhancing adhesion and reducing the residual stress during electrodeposition process is one promising technique to address the issue.
In this study, highly textured Co-Mn-P hard magnetic layers possessing hexagonal close-packed (HCP) microstructures was electroplated in single layered and multi-layered configurations with a same total magnetic thickness of 20 μm. Copper interlayers was introduced for film stress relieving. Relationships among hard magnetic properties and stresses characterized by sin2ψ XRD and curvature methods were systematically investigated. Interlamination layer of Cu can be an effective stress relieving layer. The VSM results indicate hard magnetic properties can be preserved with the multi-layered configuration. Hard magnetic properties of the electroplated Co-Mn-P are closely tied to XRD characterized stress because of stress induced anisotropy.

第一章、緒論 1
1.1 前言 1
1.2 背景與研究動機 3
第二章、理論基礎與文獻回顧 5
2.1 理論基礎 5
2.1.1 磁性材料 5
2.1.2 磁滯現象與磁異向性 8
2.1.3 薄膜殘留應力分析 11
2.1.3.1 X光sin2ψ繞射法 – 晶粒應力 13
2.1.3.2 曲率法 - Stoney方程式 21
2.2 文獻回顧 24
2.2.1 電鍍硬磁合金 24
2.2.2 多層膜系統 27
2.2.3 薄膜殘留應力 30
第三章、實驗方法 33
3.1 實驗設計 33
3.1.1 第一部份：單層CoMnP膜層 33
3.1.2 第二部份：多層CoMnP/Cu系統 33
3.1.3 第三部份：單層與多層系統之間特性比較 34
3.2 實驗流程與參數 35
3.2.1 基板選用及前處理 36
3.2.2 樣品製備 38
3.2.3 電鍍材料與參數 39
3.3 分析設備與方法 42
3.3.1 膜厚量測與表面粗糙度分析 42
3.3.2 表面形貌與化學成分分析 44
3.3.3 晶體結構分析 45
3.3.4 薄膜應力量測 46
3.3.5 磁性量測 48

第四章、結果與討論 50
4.1 單層CoMnP合金基本特性 50
4.1.1 電鍍參數及薄膜厚度之探討 50
4.1.2 表面形貌與成分分析 53
4.1.3 粗糙度分析 55
4.1.4 結晶結構分析 57
4.1.5 晶粒應力分析 58
4.1.6 硬磁性能分析 66
4.2 多層CoMnP/Cu系統基本特性 68
4.2.1 表面形貌及成分分析 68
4.2.2 粗糙度分析 71
4.2.3 結晶結構分析 75
4.2.4 晶粒應力分析 76
4.2.5 硬磁性能分析 79
4.3 單層CoMnP與多層CoMnP/Cu之比較 82
4.3.1 膜層成份與粗糙度比較 82
4.3.2 膜層應力比較 83
4.3.3 晶粒應力比較 85
4.3.4 硬磁性能比較 86
第五章、結論 90
參考文獻 91
附錄 95

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