臺灣博碩士論文加值系統

　目前使用的電路板基材與半導體封裝材料，大都以環氧樹脂為原料。但
是，隨著半導體元件設計的日益高積體化、封裝的小型化、薄型化，以及
電腦能力的大幅增加（由 64K DRAM 到正在開發的16M），目前所用的電
子材料已經無法應付技術上的需求。因此對於環氧樹脂的製造方法、結構
、添加物等會影響其品質和特性的因素，已普遍成為研究改進的對象。本
研究將合成新穎多環氧樹脂基材，不只增加環氧基密度並且在其骨格上導
入堅硬構造，以達成高Tg的目的。　　本研究是利用TMA(
Thermomechanical Analyzer)所測得的Tg值來比較本研究所合成出的五種
新穎環氧樹脂與CNE(Cresol formaldehyde novolac epoxy)，Bis－A(
Bisphenol A epoxy resins (BPAE)) 兩種常用環氧樹脂之間的性質優劣
。我們發現，本計劃合成出的新穎三官能環氧樹脂，在Tg上確實高於 CNE
，Bis－A等樹脂，至於其他性質的比較，則有待改質後，再做一番比較，
而改質後的物性，機械性質之測定，將是往後的研究重點。

The goal of this research is focused on the syntheses of new,
high performance epoxy resins for printed circuit board
and semiconductor encapsulation. These novel materials will
fulfill the defect in the present materials.\　　With
consistant increase in the computer memory capacity (from
64K to present 16M DRAM),present laminates and encapsulants do
not meet the harsh enviroment of prevailing surface mount
technology (soldering at 260℃),therefore the development of
high Tg epoxy resins which will result in a three dimensional,
tightly crosslinked structure is the purpose of this study.　　
Five novel three functional epoxy resins have been and cured
with various curring agent, Tgs of the cured were measured by
Thermomechanical analyzer (TMA)and compared with commonly used
cresol formaldehyde novolac epoxy (CNE) and A epoxy resins
(BPAE).　The newly synthesized epoxy resins exhibited much
higher Tg than CNE and BPAE as expected, their mechanical
proporties have to be investigated further.