臺灣博碩士論文加值系統

近年來，精細銀導線成為電子封裝的重點發展材料之一，其相對於傳
統的打線材料，如金導線、銅導線或鍍鈀銅線等具有更優異的電與熱特性。然而，銀導線與鋁襯墊接合時容易受到環境腐蝕的影響，進而導致接合強度不足。為了改善上述缺點，銀導線系統添加入金與鈀作為合金元素，可大幅提高其抗電遷移特性與接合可靠度。現今的銀基導線發展多集中於銀合金線，然而在銀線中加入鈀與金等合金元素將造成導線的電阻率大幅增加。另一方面，銀線中加入鈀會使得材料變硬脆，進而增加伸線製程的斷線機率與模具耗損。基於此，銀合金線多作為一替代方案於光電產業中使用。
無氰鍍金銀線是一具有奈米級金鍍層的微細導線，該線材可滿足現今
封裝產業之打線要求。與傳統銀導線相比，鍍金銀線具有良好的接合強度並可長時間存放於大氣環境中。然而，目前尚未有研究對此新型線材的抗氧化、抗硫化與接合特性等關鍵因子進行系統性調查，故本研究將針對鍍金銀線的表面特徵、高溫電性、推球失效模式、拉伸破斷機制與介金屬化合物等進行一系列探討與評估。本論文發現退火 550°C 之鍍金銀線具有穩定的微觀組織與良好機械性質。鍍金銀線於時效 175°C/ 500 小時後，金屬球與鋁墊間可觀察到介金屬化合物 Ag 2 Al 與 AuAl 2 生成。另一方面，氧化和硫氣試驗可證實銀線表面的金鍍層可有效提升線材耐蝕性。高溫偏壓耐受性試驗亦顯示鍍金線材在 125°C 的測試環境中可保持與室溫環境同等的電特性。上述結果顯示金鍍層於嚴苛環境中具有保護芯部銀線之作用。
本論文對鍍金銀線做了基礎性評估，並拓展出鍍鈀金層銀線與化鍍金
銀線，比較結果顯示兩款新型線材具有良好的打線操作性與低電阻特性，兩線材皆可應用於先進封裝製程中。

This report presents a novel Au coated Ag wire (ACA wire), prepared by a cyanide-free bath method. In this report, ACA wire, annealed at 550 degrees C was found to induce the stable microstructure and excellent mechanical properties. After the long-term current test, the ACA wire was found to have improved electrical properties, due to the equiaxed grain growth. The ACA wire offers an oxidation-resistant layer and added benefits compared with Ag and Ag-4pd wires. For automotive electronics packaging applications, electrical properties at high temperature manifest that an ACA wire still maintains superior electrical resistivity.
We also developed the Au-coated Ag wire-chemical (ACA-C wire) and the Pd-Au coated Ag wire (PCA wire), which can be improved to 2nd bond performance and attained without wire fracture during the drawing process. Results of our study
provide insights regarding the reliability issue in advanced bonding processes.

摘要 I
英文延伸摘要 II
誌謝 VIII
目錄 IX
表目錄 XIII
圖目錄 XVI
第一章 緒論 1
第二章 理論基礎與文獻回顧 3
2-1 打線接合製程 3
2-2 球型接合與楔型接合 3
2-3微細導線特性評估方法 4
2-3-1機械性質試驗 4
2-3-2電性試驗 5
2-3-3高溫時效試驗 6
2-4高溫偏壓耐受性試驗 7
2-5打線接合材料 7
2-5-1金線與金合金線 7
2-5-2銅線與鍍鈀銅線 8
2-5-3銀線與銀合金線 9
2-6微細導線電鍍技術 10
2-6-1氰化物鍍金技術 11
2-6-2綠色無氰鍍金技術 11
2-7研究目的 12
第三章 實驗方法與設備 20
3-1實驗流程概述 20
3-2實驗材料 21
3-2-1鍍金銀線 21
3-2-2鍍鈀金層銀線 21
3-2-3化鍍金銀線 22
3-3熱處理製程 22
3-4打線接合設備 22
3-5微觀組織分析 22
3-5-1掃描式電子顯微鏡 22
3-5-2聚焦離子束顯微鏡 23
3-5-3電子微探儀 23
3-6機械性質試驗 23
3-6-1拉伸試驗 23
3-6-2微硬度試驗 24
3-6-3推球試驗 24
3-7通電試驗與電阻率量測 24
3-8氧化試驗 25
3-9硫氣試驗 25
3-10高溫時效測試 25
3-11高溫電學穩定性試驗 25
3-12 XRD繞射分析 26
3-13拉曼光譜儀檢測 26
第四章 結果與討論 34
4-1線材表面與次表面組織特性 34
4-2製程退火對鍍金銀線組織與機械性質之影響 34
4-3鍍金銀線之電性與失效分析 35
4-4高溫儲存與通電時效對鍍金銀線特性之影響 36
4-5氧化及硫化對鍍金銀線特性之影響 37
4-6鍍金銀線成球特性調查 38
4-7鍍金銀線與鋁墊間界面反應調查 40
4-8鍍金銀線於高溫環境下通電穩定性解析 41
4-9不同鍍層下銀基導線的應用特性解析 42
4-9-1鍍層特性解析 43
4-9-2機械性質解析 43
4-9-3電性質解析 43
4-9-4大氣高溫時效與電性之比較 44
4-9-5鍍鈀金層銀線成球特性與接合界面評估 44
第五章 結果與討論 79
參考文獻 80

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