臺灣博碩士論文加值系統

本文是以LabVIEW 程式開發雷射修阻機之操作系統並與X-Y table 的運動
控制的程式設計做結合，能適用於在影像辨識模板上的電路後，再根據辦別出模
板上電路的電阻位置座標，透過NI PCI-7390 這張運動控制卡把資料點傳給X-Y
table，接收到資料點後移動X-Y table 到目標電阻進行雷射切割。
本文設計在模板電阻上切割出L 型的路徑，發現在進行雷射切割結束後，
原路徑上會有切不乾淨的現象，由於此現象會對量測到的電阻值產生誤差，所以
本文設計可以在原路徑上來回切割，以便達到量測的電阻值與目標的電阻值相
同。

In this paper, the research is based on LabVIEW program to develop laser
trimming machine operating system and combine the X-Y table motion control
program designed, the research can be applied to image recognition the circuit on the
template, and then according to determine the resistance location coordinates on the
template circuit, through this NI PCI-7390 motion control card transfer data to the
X-Y table ,then moving X-Y table to the target resistor laser cutting.
This paper design on the template resistance cut out L-type path, after the end of
the laser cutting, found there is not a clean cut on the original path of the
phenomenon .Therefore, the measured resistance value will generate an inaccuracy,
this design can be cut back and forth on the original path, in order measure the
resistance value of the resistance value reaches the same goal.

目錄
中文摘要......................................................................................................................... i
Abstract .......................................................................................................................... ii
目錄.............................................................................................................................. iii
圖目錄............................................................................................................................ v
表目錄........................................................................................................................ viii
第一章 緒論.................................................................................................................. 1
1.1 研究背景 ............................................................................................................. 1
1.2 研究目的 ............................................................................................................. 2
1.3 國內外相關研究 ................................................................................................. 2
第二章 雷射修阻機實驗架構及原理.......................................................................... 4
2.1 GALVO 雷射工作原理 .......................................................................................... 4
2.2 雷射修阻機相關原理.......................................................................................... 5
2.3.1 NI PCI-6229 資料擷取卡(DAQ) ......................................................... 5
2.3.2 NI PXI-8175 裝置................................................................................. 6
2.3.3 Basler SCA640-70gm(CCD) ................................................................ 7
2.3.4 伺服馬達 Panasonic Minas A4 AC ..................................................... 7
2.3.5 步進馬達 ckm245-01ah....................................................................... 8
2.4 實驗架構............................................................................................................ 10
2.4.1NI Vision 影像處理實驗架構 ............................................................. 10
2.4.2 運動控制卡與X-Y table 實驗架構 .................................................. 11
第三章 雷射修阻機之操作系統設計........................................................................ 13
3.1 NI VISION 影像處理與操作設定 ....................................................................... 13
雷射修阻機之開發
iv
逢甲大學e-Theses & Dissertations(103 學年度)
3.2 雷射切割路徑 ................................................................................................... 17
3.3 雷射切割路徑之旋轉設計................................................................................ 19
3.4 X-Y TABLE 運動控制與操作設定 ...................................................................... 21
3.4.1 Motion 操作設定步驟 ........................................................................ 21
3.4.2 平台校正設計..................................................................................... 23
第四章 雷射修阻機之程式設計................................................................................ 26
4.1 影像程式設計 .................................................................................................... 26
4.2 主程式設計 ........................................................................................................ 30
4.3 模板旋轉校正之程式設計 ................................................................................ 35
4.4 FPGA 之程式設計 ............................................................................................. 38
第五章 雷射修阻機之實驗結果................................................................................ 39
5.1 NI VISION 影像處理實驗結果 ........................................................................ 39
5.2 雷射切割路徑實驗結果.................................................................................... 42
5.3 模板比對實驗結果 ........................................................................................... 43
第六章 結論................................................................................................................ 45
參考文獻...................................................................................................................... 47