臺灣博碩士論文加值系統

本論文主要探討ViaLuxTM81( Du pont )感光性介電材料(photo dielectric)於高密度印刷電路板之研究，配合田口實驗規劃，作出增層式印刷電路板中感光性介電層之4 mil 微孔洞微影最適化參數。在製程上是選用Build up製程，參數設定分別為曝光量、曝後烤溫度及曝後烤時間和顯影時間。以光學顯微鏡和3次元量床，觀測並分析微孔洞的構造，比較實驗條件不同之微孔洞，得到最適化微影的實驗條件。使用MDSC(調幅式示差掃瞄熱分析儀)掃描曝光量不同之ViaLuxTM81感光性介電材料，分析ViaLuxTM81之光驅動反應。以及曝後烤溫度對ViaLuxTM81熱驅動反應之影響。
由於發現其黏著性普遍不佳，所以在改用聚四氟已烯(Polytetrafluoro-ethylene,PTFE)介電材料，利用高週波電漿改質技術增加PTFE親水性，並使用ESCA作表面的分析及探討，分析不同參數對PTFE表面的親水性的影響。

The study of Photo Dielectric Material (ViaLuxTM81, Du pont ) applied on the high density printed circuit board. In the experiment which is getting the optimum operation for 4 mil photo dielectric via on the Build-up substrate by Taguchi.Four operation parameters which are the exposure, the temperature of post bake , the time of post bake and the time of development.
Analyzing the structure of 4 mil photo dielectric via by O.G.P and microscopy.Getting the best operation parameters of 4 mil photo dielectric via analyzing by different vias.Analyzing the photo dielectric material of ViaLuxTM81 by using the MDSC.
We analyzed the photo dielectric under the different exposure by MDSC. Studying the effect of the reaction of photolytic of the photo dielectric. Then analyzing of the different temperature of post bake photo dielectric by MDSC. Studying the effect of thermal of photo dielectric.
The adhesion of photo dielectric was not well. Using the PTFE for the dielectric material. Then using the RF plasma to increase the hydrophilic of the PTFE. Analyzing the surface of the PTFE by ESCA.

中文摘要 I
ABSTRACT II
致 謝 III
總目錄 IV
圖目錄 VII
第一章前 言 1
1-1研究背景 1
1-2 研究目的 2
1-3研究內容 3
第二章理論說明與文獻回顧 5
2.1印刷電路板簡介 5
2.1-1印刷電路板之發展 6
2.2印刷電路板之製程技術與材料 9
2.2-1印刷電路板之製程技術 9
2.2-2印刷電路板之材料 12
2.2-3介面黏著理論 19
2.3電漿改質原理 22
2.3-1電漿簡介 22
2.3-2電漿特徵 23
2.3-4電漿表面改質 27
第三章實驗步驟及流程 50
3.1 增層式印刷電路板製作流程 50
3.1-1微孔洞之光學量測 51
3.1-2調幅式示差掃瞄熱分析儀 52
3.2 電漿改質步驟 53
3.2-1 接觸角量測 54
3.2-2電子能譜化學元素分析(ESCA) 55
3.3 實驗藥品及分析儀器 56
3.3-1藥品 56
3.3-2儀器設備 56
第四章結果與討論 69
4.1 ViaLuxTM 81之材料分析 69
4.1-1孔洞立體結構之最佳操作條件 69
4.1-2曝光量對ViaLuxTM 81光驅動反應 70
4.1-3烘烤溫度對ViaLuxTM81熱驅動反應 71
4.2電漿處理分析 71
4.2-1壓力對PTFE表面改質後接觸角之影響 71
4.2-2電漿功率對PTFE表面改質後接觸角之影響 74
4.2-3電子能譜化學元素分析(ESCA) 75
第五章結論 95
文獻回顧 97
附 錄 101

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