臺灣博碩士論文加值系統

本文利用有限元素法(Finite Element Method)模擬，以及壓印實驗來探討模具線寬與金屬薄膜厚度的改變對於壓印結果之影響。在有限元素分析模擬中，可分為五個部分，包含了模具間材料填充高度與壓印深度關係模擬、材料回彈量與壓印深度關係模擬、模具角度與模具受力關係模擬以及模具線寬與金屬薄膜厚度對模具下壓深度關係模擬等五大部分。系統模型建立與分析方法皆利用限元素軟體MSC Marc，建構在二維平面應變理論上進行模擬。
實驗相關的工作包括模具的製作、金屬薄膜的製備、機台的校正、各式量測儀器的操作等。本研究特別針對不同線寬的模具與不同金屬銅薄膜分別進行壓印，實驗結果方面分別對模具壓印深度、材料堆積高度與寬度做討論。同時，實驗結果亦與有限元素模擬之結果進行比較，可以觀察出此一微米級金屬薄膜壓印製程的可行性。

This thesis presented an investigation on the effect of pattern width of the mold and the thickness of the copper thin film on the variation of pattern size and thin film thickness by using Finite Element Method simulation and experiment. FEM simulation could be separated into five parts, including the relationships between infill of material and imprinting depth, springback of material and imprinting depth, angle of mold and force on mold, pattern width and imprinting depth, thin film thickness and imprinting depth.
The commercial FEM software MSC Marc was used to construct the analytical model and to perform simulation on the basis of 2-D plan strain problem. Meanwhile, the molds with different pattern widths and thin films with different thicknesses were employed for the experiment. The imprinting depths of mold, the heights and the widths of material pileup were discussed. Good agreement between FEM simulation and experimental results is obtained.

中文摘要…………………………………………………………………Ⅰ
英文摘要…………………………………………………………………Ⅱ
目錄………………………………………………………………………Ⅲ
圖目錄……………………………………………………………………Ⅵ
表目錄……………………………………………………………………Ⅹ
第一章　緒論………………………………………………….…….......01
1-1 前言………………………...…………………………….……...……01
1-2 文獻回顧……………………………...………………….……...……02
　1-2-1 微奈米熱壓印實驗文獻回顧………………………...….……02
　1-2-2 微奈米熱壓有限元素分析文獻回顧………………...….……03
1-3 本文內容………………………………………………..….....………06
第二章　微奈米壓印製程分析………………………………...….……08
2-1 微奈米壓印的沿革………………………………………......….……08
2-2 微奈米壓印成形與射出成形比較……………………......…….……09
2-3 塊材與小尺度金屬塑性成形比較……………………….......………10
2-4 微奈米壓印加工原理與製程順序……………………..…....….……11
　2-5 金屬塑性加工成形解析法-(滑移線場法) ………………..……...14
　2-5-1 平面應變的基本方程式……………………………..….……14
　2-5-2 平面應變塑性應力摩爾圓…………………………...………16
　2-5-3 漢基應力方程式…………………………………..….………19
　2-5-4 邊界條件與基本邊界值問題……………………..…….……20
　2-5-5 半無限平板壓印實例………………………………......……22
　2-6 非線性有限元素法-材料非線性有限元素法……………..……24
　2-7 非線性求解方法-牛頓拉弗森法…………………………………27
第三章　有限元素法與模擬分析………………………………..……32
3-1 有限元素分析軟體- MSC MARC之介紹………………………..…32
3-1-1 MARC套裝軟體系統之架構與弁遄K………………………33
3-1-2 MENTAT前後處理數據模組弁鄐坐雯苤K………...………33
3-2 微米壓印製程模擬…………………………………………......……34
3-2-1 模型建立…………………………………………...…………34
3-2-2 微米壓印模型元素收斂性分析…………………...…………39
3-3 壓印深度與材料填充率的關係………………………......…………40
3-4 壓印深度與金屬薄膜回彈量模擬…………………......……………43
3-5 模具模角與壓印力量模擬……………………………......…………45
3-6 壓印深度與模具線寬關係模擬……………………...…...…………47
3-6-1 模具線寬對於壓印力與材料強度的影響…………...………50
3-6-2 模具線寬對於堆積效應(Pile-up)成長的影響……......……51
3-7 模具壓印深度與金屬薄膜厚度關係模擬………………......………53
3-7-1 薄膜厚度對於壓印力與薄膜強度的影響…………...………55
3-7-2 薄膜厚度對於堆積效應(Pile-up)的影響……………......…56
3-7-3 拔模點所需力量……………………………………...………57
第四章　實驗規劃………………………………………………………63
4-1 模具與金屬膜的尺寸設計……………………………......…………63
4-2 模具與金屬膜的製作與準備…………………………......…………65
4-2-1 半導體製程製作微米級模具………………………...………65
4-2-2 化學電鍍製程製作微米級金屬銅薄膜……………...………67
4-3 工研院壓印機台與量測設備……………………….....……………68
4-3-1 奈米壓印機台(Nanoimprinting system)……….......………68
4-3-2 奈米壓痕系統(Nanoindenter system)……………......……70
4-3-3 掃瞄電子顯微鏡(Scanning Electron Microscope)…..........…73
4-3-4 白光干涉儀…………………………………..………………74
4-4 實驗前量測項目………………….....………………………………75
4-4-1 模具量測…………………..…………………………………75
4-4-2 金屬薄膜粗糙度量測……..…………………………………80
4-5 壓印深度與模具線寬實驗……………..…………………...………81
4-6 壓印深度與薄膜厚度關係實驗………..……………...……………84
第五章　實驗結果與討論…………………………………..…………87
5-1 模具線寬與壓印深度實驗結果……………….....…………………87
5-2 奈米壓痕實驗結果……………………………….....………………94
5-3 薄膜厚度與壓印深度實驗結果……………….....…………………95
第六章　結論與未來工作………………………….…………………100
6-1 結論…………………....……………………………………………100
6-1-1 模具線寬對於微壓印成型之影響………………..………100
6-1-2金屬薄膜厚度對於微壓印成型之影…………....…………100
6-2 建議與未來工作………………………………………………….…101
參考文獻...........................................................................................103

1.S. Y. Chou, P. R. Krauss and P. J. Renstrom, “Nanoimprinting lithography,” J.Vac.Sci.Technol., B, Vol.14, No.6, pp.4129-4133 1995.
2.S. Y. Chou, P. R. Krauss, Z. W. Guo, “Sub-10nm imprintlithography andapplications,” J.Vac.Sci. Technol.,B, Vol.15, No.6, pp.2897-2904 1997.
3.S. Y. Chou, P. R. Krauss and, P. J. Renstrom, “Imprint of sub-25 nm vias and trenches in polymers,”Applied physics letters, 67, pp.3114-3116, 1995.
4.M. Heckele, Bacher and D. K. Muller, “HotEmbossing-The molding technology for plastic micro－structure,” MicrosystemTechnology4, pp.122-124, 1998.
5.M. Heckele, and W. Bacher, “Flexibleintegration of nonsilicon　　　　　　 microstructures on microelectronic circuits,” The International Society for Optical Engineering, v 4408, p 469-477, 2001.
6.M. Heckele, and W. Bacher, “Large area polymer replication for microfluidic devices,”The International Society for Optical Engineering, v 4408, p 469-47 ,72001.
7.L. Lin, Y. T. Cheng and C. J. Chiu, “Comparative study of　hotembossing microstructures fabricated by laboratory and commercial environments,”
Microsystem　technology 4, pp113-116,1998.
8.賴文童，”微結構熱壓成形缺陷之探討”，國立交通大學機械工程研究所1998.
9.王培良，”塑膠微熱壓成形特性之研究”，國立交通大學機械工程研究所1997.
10.Y. Hirai, M. Fujiwara, T. Okuno, “Study of the resist deformation in nanoimprint lithography,” Ameican vaccum society B(19)6, 2005.
11.Y. Hirai, S. Yoshida, N. Takagi, “Defect analysis in thermal nano-imprint lithography,” Ameican vaccum society,techno.B(21)6, 2003.
12.Y. C. Lu, D. M. Shinozaki, “Effects of substrate constraint on micro-indentation testing of polymer coatings,”Material science and engineering A, pp77-86, 2005.
13.W. B. Young, “Analysis of the nanoimprint lithography with a viscous model,”Microelectronic engineering77, pp405-411, 2005.
14.H.C. Scheer, H. Schulz, “ A contribution to the behavior of thin polymer
Films during hot-embossing lithography, ”Microelectronic Engineering, 56isues 3-4, pp.311-332, 2001.
15.王興邦，“玻璃微熱壓之成形特性研究”，國立交通大學機械工程研究所2003.
16.http://www.mse.tsinghua.edu.cn/faculty/kangfy/research/fuel%20cell.htm.
17.www.trade-taiwan.org/ to_buy/to_buy2_c.asp?typ...
18.William F. Hosford, Robert M.Caddell, ” Metal forming-Mechanics and metallurgy,” Englewood Cliffs, N.J. :Prentice-Hall,c1983.
19.鍾春生，韓靜濤，” 金屬塑性變形力計算基礎 ”，冶金工業出版社，北京市，1994.
20.吳永禮，“計算固體力學方法，”科學出版社，北京市2003.
21.X. Lu Peng, Y.Balendra Qin, “Analysis of laser-heating methods for micro-parts stamping applications,” Journal of materials processings technology 150, pp84-91, 2004.
22.X. Peng, “FE simulations of laser-aided stamping,”Journal of materials processings technology 150, pp84-91, 2004.
23.莊達人，“VLSI 製造技術”，高立圖書出版社，台北縣，2002
24.http://www.hysitron.com/Products/ProductPages/products_triboindenter.Htm
25.D. E. Kramer, A. A. Volinsky, N. R. Moody, “Substrate effects on indentation plastic zone development in thin soft films,”J.Mater.Res., Vol16, NO.11, 2001.
26.蔡嘉文，“尺寸效應對於為硬度之影響”，第二十一屆中國機械工程學術研討論文，高雄市，2004.
27.S. H. Hong, K. S. Kim, Y. M. Kim, “Characterization of elastic moduli of Cu thin film using nanoindentation technology,”Composite Science and Technology 65, pp1401-1408,2005.