臺灣博碩士論文加值系統

本文以國內某大型晶圓製造廠之自動化物料搬運系統(Automated Material Handling System)為研究對象，使用SIMPLE++物件導向模擬軟體，搭配UML為基礎之物件導向模式構建方法論，分別進行雙迴圈雙負載Interbay系統派車法則、系統負載分析及黃光區Intrabay系統規劃等議題的模擬分析
首先，本研究純粹探討派車法則對雙迴圈雙負載Interbay系統的影響。經分析結果發現，派車法則與晶舟搬運率及搬運車車數之間存在顯著的交互作用，並歸納出不同環境下最適合之派車法則。此外，更進一步利用反應曲面法(Response Surface Method)，在搬運績效極值化之前提下，探討最適派車法則在不同環境下之績效表現。確立最適派車法則之後，建構包含倉儲系統(stocker)之完整Interbay系統，透過模擬尋找出該系統最大搬運負荷量，並且分析出不同環境下，最合適之內外軌道搬運車車數配置。
另外，本研究應用系統模擬於12吋晶圓廠之黃光區機台配置規劃問題。藉由系統模擬之回饋(feedback)特性，規劃出一合理之黃光區機台與車數配置方案，以降低黃光區Intrabay搬運系統之負荷。並對OHT(Overhead Transpoter)式及AGV(Automated Guided Vehicle)式搬運設備進行比較，發現在此黃光區Intrabay系統中，OHT的搬運效率較AGV佳。

摘要i
謝誌ii
目錄iii
圖目錄 vi
表目錄 x
第一章緒論1
1.1.研究背景與動機1
1.2.研究目的3
1.3.研究範圍3
1.4.研究步驟與方法3
1.5.論文架構6
第二章文獻回顧7
2.1.晶圓廠自動化物料搬運系統之變遷7
2.1.1.晶圓廠物料搬運系統之演進7
2.1.2.12吋晶圓時代的來臨9
2.2.晶圓廠自動化物料搬運系統之組成12
2.2.1.硬體13
2.2.1.1.晶圓載具13
2.2.1.2.自動化載入埠(Load Port)14
2.2.1.3.軌道系統15
2.2.1.4.Stocker系統16
2.2.1.5.搬運車系統16
2.2.2.軟體20
2.3.晶圓廠自動化物料搬運系統相關研究文獻整理21
2.3.1.佈置規劃問題(Layout Design Issue)21
2.3.2.績效分析問題(Performance Analysis Issue)26
2.3.3.車輛管理問題(Vehicle Management Issue)27
2.3.4.資源配置問題(Resource Allocation Issue)28
2.4.無人搬運車系統文獻回顧29
第三章雙迴圈式Interbay系統派車法則模擬研究34
3.1.系統描述與問題定義34
3.2.派車法則定義39
3.3.模擬模式構建44
3.3.1.UML為基礎之物件導向模擬模式發展程序方法論44
3.3.1.1.起始階段45
3.3.1.2.分析階段45
3.3.1.3.設計階段45
3.3.1.4.實作階段46
3.3.2.雙迴圈式Interbay系統派車法則模擬模式之構建47
3.3.2.1.起始階段47
3.3.2.2.分析階段47
3.3.2.3.設計階段51
3.3.2.4.實作階段54
3.4.實驗設計57
3.4.1.環境因子57
3.4.2.控制因子57
3.4.3.績效指標57
3.4.實驗分析步驟58
3.5.實驗結果分析60
3.6.小結71
第四章雙迴圈式Interbay系統負載分析與車數配置研究72
4.1.系統描述與問題定義72
4.2.模式構建74
4.2.1.起始階段74
4.2.2.分析階段74
4.2.3.設計階段79
4.2.4.實作階段81
4.3.實驗設計84
4.3.1.環境因子84
4.3.2.控制因子84
4.3.3.績效指標84
4.4.實驗分析步驟85
4.5.實驗結果分析87
4.5.1.雙迴圈Interbay系統搬運負荷量分析87
4.5.2.雙迴圈Interbay系統內外軌道搬運車車數配置分析88
4.6.小結95
第五章系統模擬應用於黃光區Intrabay系統之規劃96
5.1.系統描述與問題定義96
5.2.Intrabay系統搬運類型100
5.3.模式構建101
5.3.1.起始階段101
5.3.2.分析階段101
5.3.3.設計階段105
5.3.4.實作階段107
5.4.黃光區Intrabay系統佈置規劃111
5.5.黃光區Intrabay系統搬運車數量配置分析115
5.5.1.OHT數量分析115
5.5.2.AGV數量分析116
5.5.3.OHT 與AGV之比較117
5.6.小結121
第六章結論與建議122
6.1.結論122
6.2.建議123
參考文獻124
附錄一 派車法則UML圖、模擬數據與變異數分析表129
附錄二 負載分析與車數配置UML圖及模擬數據143
附錄三 黃光區Intrabay系統UML圖、模擬數據與變異數分析表150

1. 王志宏，”無人搬運車系統之智慧型派車機構之研究”，清華大學工業工程研究所碩士論文，1993。
2. 呂博裕與王福琨，”晶圓製造廠自動化物料搬運與儲存系統之模擬分析”, 工業工程學刊，第十六卷，第二期，頁183-194，1999。
3. 周上傑，”晶圓廠自動化物料搬運系統之派車模擬研究”，清華大學工業工程研究所碩士論文，1999。
4. 林靖智，”模組化晶圓製造廠物料搬運系統之設計”，交通大學工業工程研究所碩士論文，1999。
5. 郭曜賑，”UML為基礎之物件導向模擬模式發展程序方法論-晶圓廠自動物料搬運系統為例”，清華大學工業工程研究所碩士論文，1999。
6. 陳紹偉，”12吋IC代工廠自動化物料搬運系統之系統模擬與派工法則的研究”，台灣大學機械工程研究所碩士論文，1999。
7. 1998自動化與企業經營國際研討會，民國87年。
8. Binder, H., and Honlod, A., “Automation and Fab Concepts for 300 mm Wafer Manufacturing”, Microelectronic Engineering, Vol.45, No.2, pp.91-100, 1999.
9. Brain, M., and Abuzeid, S., “Minienvironment Technology and Automation Systems for Next Generation IC Fabs”, International Symposium on Semiconductor Manufacturing, pp.173-178, 1994.
10. Brain, M., Gould R., Kaempf, U., and Wehrung, B., “Emerging Needs for Continuous Flow FOUP Transport”, Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium, pp.76-82, 1999.
11. Campbell, P. L. and Laitinen, G., “Overhead Intrabay Automation and Microstocking- a Virtual Fab Case Study”, IEEE/SEMI Advanced Semiconductor Manufacturing Conference and Workshop, pp.368-372, 1997.
12. Cardarelli, G., Marcello, P. M., and Granito, A., “Track-Robot for Wafer Fabrication Intrabay Handling”, Assembly Automation, Vol.13, No.2, pp.25-29, 1993.
13. Cardarelli, G., and Marcello, P. M., “Simulation Tool for Design and Management Optimization of Automated Interbay Material Handling and Storage Systems for Large Wafer Fab”, IEEE Transactions on Semiconductor Manufacturing, Vol.8, No.1, pp.44-49, 1995.
14. Cardarelli, G., Marcello, P. M., and Granito, A., “Performance Analysis of Automated Interbay Material Handling and Storage Systems for Large Wafer Fab”, Robotics & Computer-Integrated Manufacturing, Vol.12, No.3, pp.227-234, 1996.
15. Cheng, T. C. E., ”A Simulation Study of Automated Guided Vehicle Dispatching”, Robotics and Computer-Integrated Manufacturing, Vol.3, No.3, pp.335-338, 1987.
16. Chrisos, J., and Nestel-Patt, J., “Integration Risks in 300-mm Wafer Fab Automation”, Solid State Technology, Vol.41, No.7, pp.193, 196, 198, 200, 202, 1998.
17. Csatary, P., Nolan, D., Wolf, P., and Honold, A., “300mm Fab Layout and Automation Concepts”, Future Fab, Vol.1, Issue5, 1997.
18. DeJule, R., “Further Fab Automation: Intrabay Handling”, Semiconductor International, vol.20, no.5, pp.79-80, 82, 84, 86., 1997.
19. Design-Expert, Version 5.0.8, Stat-Ease, Minneapolis, MN.,1997.
20. Egbelu, P. J., ” Pull Versus Push Strategy for Automated Guided Vehicle Load Movement in a Batch Manufacturing System”, Journal of Manufacturing System, Vol.6, No.3, pp.271-280, 1987.
21. Egbelu, P. J. and Tanchoco, J. M. A., ” Characterization of Automated Guided Vehicle Dispatching Rules”, International Journal of Production Research, Vol.22, No.3, pp.359-374, 1984.
22. Hwang, H. and Kim, S. H., ” Development of Dispatching Rules for Automated Guided Vehicle Systems”, Journal of Manufacturing System, Vol.17, No.2, pp.137-143, 1998.
23. Hwang, H. and Kim, S. H., ”An Adaptive Dispatching Algorithm for Automated Guided Vehicles Based on an Evolutionary Process”, International Journal of Production Economics, Vol.60-61, pp.465-472, 1999.
24. Johnson, B., Mastroianni, S., Stanley, T., and Tull, D., “300mm Fab Architecture”, Future Fab, Vol.1, Issue3, pp.51-58, 1997.
25. Kaempf, U., “Automated Wafer Transport in the Wafer Fab”, IEEE/SEMI Advanced Semiconductor Manufacturing Conference, pp.356-361, 1997.
26. Klein, C. M. and Kim, J., ”AGV Dispatching”, International Journal of Production Research, Vol.34, No.1, pp.95-110, 1996.
27. Kobayashi, S., Tokuaga, K., Kobayashi Y., Kato, K., and Minami, T., “Particle Characteristics of 300-mm Minienvironment (FOUP & LPU)”, IEEE International Symposium on Semiconductor Manufacturing Conference, pp. 39-42, 1999.
28. Kurosaki, R., Nagao, N., Komada, H., Watanable, Y., and Yano, H., “AMHS for 300mm Wafer”, IEEE International Symposium on Semiconductor Manufacturing Conference, pp.D-13-D16, 1997.
29. Liu, C. M., and Duh, S. H., ”Study of AGVS Design and Dispatching Rules by Analytical and Simulation Methods”, International Journal of Computer Intergrated Manufacturing, 5(4?), pp.290-299, 1992.
30. Mackulak, G. T., Lawrence, F. P., and Rayter J. “Simulation Analysis of 300mm Intrabay Automation Vehicle Capacity Alternatives”, 1998 IEEE/SEMI Advanced Semiconductor Manufacturing Conference, pp.445-450, 1998.
31. Nadoli, G. and Pillai, D, “Simulation in Automation Material Handling Systems Design for Semiconductor Manufacturing”, Proceeding of the 1994 Winter Simulation Conference, pp.892-899, 1994.
32. Peters, B. A. and T. Yang, “Integrated Facility Layout and Material Handling System Design in Semiconductor Fabrication Facilities”, IEEE Transactions on Semiconductor manufacturing, Vol.10, No.3, pp.360-369, 1997.
33. Pflueger, J., and Ballentine, P., “Operational Considerations for PGVs in 300mm Wafer Fabs”, SEMICON Korea, pp.1-8, 1997.
34. Pillai, D., “Material Handling Automation for Wafer Fabrication Facilities”, IEEE/CHMT '90 IEMT Symposium, pp.277-286, 1990.
35. Pierce, N. G., and Stafford R., “Modeling and Simulation of Material Handling for Semiconductor Wafer Fabrication”, Proceedings of the 1994 Winter Simulation Conference, pp.900-906, 1994.
36. Plata, J.J., “300 mm Fab Design-A Total Factory Perspective”,1997 IEEE International Symposium on Semiconductor Manufacturing Conference Proceedings , pp.A5-8, 1997.
37. Robertson, F., and Foster, L., “300mm Factory System Integration”, Future Fab Vol.1, Issue 4, pp.29-31, 1997.
38. SIMPLE++, 1999, Reference Manual Version 6.0, AESOP GmbH, Stuttgart, Germany.
39. Schroeder, J. P., “Automation-Centric Processing Bay Layout”, Semiconductor International, Vol.20, No.6, pp.209-10, 212, 214, 1997.
40. VanLeeuwen, C., and Irwin, J., “Fab Automation : Coming of Age” , Semiconductor International, Vol.22, No.6, pp.99-100, 102, 104, 106, 1999.
41. Weiss, M., “Semiconductor Factory Automation”, Solid State Technology, Vol.39, No.5, pp.89-90, 92, 95-96, 1996.
42. Weiss, M., “300mm Fab Automation Technology Options and Selection Criteria”, 1997 IEEE/SEMI Advanced Semiconductor Manufacturing Conference Workshop, pp373-379, 1997.
43. Weiss, M., “New Twists on 300mm Fab Design and Layout”, Semiconductor International, Vol.22, No.8, pp. 103-4, 106, 108 , 1999.
44. Yim, D. S. and Linn, R. J. ” Push and Pull Rules for Dispatching Automated Guided Vehicles in a Flexible Manufacturing System”, Internal journal of Production Research, Vol.31, No.1, pp.43-57, 1993.