臺灣博碩士論文加值系統

在科技快速變遷的時代，產品的生命週期逐漸縮短，產品從研發試作至量產上市的時間愈縮愈短，如何由產品先行試作至快速量產，並確保產品可靠度無虞是企業的核心競爭力之一。因此，如何在短時間內了解產品的壽命狀況與其可靠度的變化行為，必須擬定一套方法，而加速壽命試驗則成為業界之重要對策。
本文將Prokopowisz 和 Vaskas提出的加速壽命試驗理論，應用於積層陶瓷電容器（Multi-layer Ceramic Capacitor, MLCC）的加速壽命測試與可靠度分析之研究。配合有限元素法模擬其電容器內部結構應力大小與產品壽命之可靠度關係，以建立應力與壽命關係，並應用於其它尺寸與電容量的電容器，即先以有限元素法分析新結構體的應力，再推估產品之壽命，以縮短產品試作至量產的時間。總之，藉此可預測高應力低壽命之問題，進而提升產品之可靠度。

Living in an era when technology advances fast, product life cycle becomes

shorter and shorter. From R&D trail run to mass production, one of the core

competitive strength for any industry, depends on how fast it takes to advance a

product from trail run, to the final mass production stage. Therefore, to

understand the transformation on product life cycle and product reliability, it is

necessary to mark plans accordingly. One of the important strategy is to conduct

the Highly Accelerate Life Test(HALT).

This article will present the research on HALT and product reliability

analysis, using the theory suggested by Prokopowisz and Vaskas which applied

on Multi-layer Ceramic Capacitor(MLCC). To establish the relation between

stress and life cycle, and using it on other sizes of the MLCC, is to model the

inner structural relation between stress effects with the reliability of product life

cycle on MLCC .In other words, by using Finite Element Method(FEM) to

analysis the stress within the new structure the product life cycle can be

predicted in order to shorter the duration from trail run to mass production.

Above all, this could predict the problem of higher stress and shorter life

cycle, making one step forward to increase product reliability.

目 錄
中文摘要----------------------------------------------------------------------------------Ⅰ

英文摘要----------------------------------------------------------------------------------Ⅱ

誌謝----------------------------------------------------------------------------------------Ⅳ

目錄----------------------------------------------------------------------------------------Ⅴ

表目錄-------------------------------------------------------------------------------------Ⅸ

圖目錄-------------------------------------------------------------------------------------Ⅹ

符號說明-------------------------------------------------------------------------------ⅩⅣ



第1章 緒論------------------------------------------------------------------------------------1

1.1研究動機---------------------------------------------------------------------------------- 1

1.2研究目的---------------------------------------------------------------------------------- 2

1.3研究範圍與方法-------------------------------------------------------------------------2

1.3.1研究範圍------------------------------------------------------------------------------------- 2

1.3.2研究方法------------------------------------------------------------------------------------- 3

1.4文獻回顧---------------------------------------------------------------------------------- 4

1.5論文架構---------------------------------------------------------------------------------- 6


第2章 理論基礎-----------------------------------------------------------------------------7
2.1積層陶瓷電容器失效型態---------------------------------------------------------- 7

2.1.1電容器失效型態的種類--------------------------------------------------------- 7

2.1.2解決策略---------------------------------------------------------------------------- 9

2.2積層陶瓷電容器簡介----------------------------------------------------------------10
2.2.1積層陶瓷電容器製造流程----------------------------------------------------13

2.2.2積層陶瓷電容器的分類--------------------------------------------------------15
2.2.3積層陶瓷電容器電容值之計算-----------------------------------------------16

2.3可靠度理論------------------------------------------------------------------------------18

2.3.1可靠度的定義-----------------------------------------------------------------------18

2.3.2可靠度函數與失效率函數--------------------------------------------------------19

2.3.3浴缸型失效模式-------------------------------------------------------------------------------21
2.3.4常用壽命分佈---------------------------------------------------------------------- 23

2.3.5產品可靠度的估計法-------------------------------------------------------------28

2.3.6加速壽命試驗模式----------------------------------------------------------------- 29

2.4加速測試方法----------------------------------------------------------------------------31

2.4.1熱應力-------------------------------------------------------------------------------- 31

2.4.2非熱應力------------------------------------------------------------------------------ 32

2.4.3複合應力-------------------------------------------------------------------------------32
2.5失效判訂準則----------------------------------------------------------------------------34


第3章 實證研究-----------------------------------------------------------------------------35

3.1實驗方式----------------------------------------------------------------------------------36

3.1.1試件規格-----------------------------------------------------------------------------37

3.1.2儀器設備-----------------------------------------------------------------------------37

3.1.3實驗步驟-----------------------------------------------------------------------------41

3.2實驗分析流程---------------------------------------------------------------------------45

3.3電容值/絕緣阻抗(Cap/IR)初值量測------------------------------------------------46

3.4電容值之初值量測分佈情形-------------------------------------------------------47

3.5高加速壽命測試-----------------------------------------------------------------------53

3.6應力分析模擬與平均破壞時間(MTTF)------------------------------------------ 68

3.7實例驗證------------------------------------------------------------------------------- 78


第4章 結論與展望------------------------------------------------------------------------83

4.1結論----------------------------------------------------------------------------------------83

4.2展望----------------------------------------------------------------------------------------84


參考文獻--------------------------------------------------------------------------------------85
附錄一積層陶瓷電容器編碼原則及尺寸規格-----------------------------------------------88
附錄二 EIA(Electronic Industries Alliance)---------------------------------------------- 89

附錄三韋伯分佈之機率密度函數、可靠度函數與失效率函數演算過程-----90

附錄四韋伯分佈和韋伯斜率(Weibull slope)之說明----------------------------------91

自述----------------------------------------------------------------------------------------------93

[1]T.I.Prokopowicz and A.R.Vaskas,”Research and Development,Intrinsic Reliability,Subminiature Ceramic Capacitors,”Final Report,ECOM-90705-F, NTIS AD-864068,p175(1969) 。

[2]Ling H.C.,& Jackson A.M., orrelation of Silver Migration with Temperature-Humidity-Bias (THB) Failures in Multilayer Ceramic Capacitors ,”IEEE Transaction on Components, Hybrids,And Manufacturing Technology ,Vol.12,No.1,March130-37(1989) 。

[3]J.Yamamatsu,N.Kawano,T.Arashi,A.Sato,Y.Nakano,T.Nomura.,Reliability of multilayer ceramic capacitors with nickel electrodes .Journ of Power Sources 60 ,199-203(1996) 。

[4]B.S.Rawal and N.H.Chan,”Failure Analysis of Multilayer Ceramic Capacitors,”in Proceedings of the Workshop on the Reliability of Multilayers Ceramic Capacitors, ,pp.118-124(1981) 。

[5]. Cramer, H. , Oliver, J. and Dix, G. , ,”MMIC Capacitor Reliability ”, EIA/Electric Sensors and Systems Sector GaAs Product Department , pp46 ~ 51(1998) 。

[6]. Confer, R. , Canner, J. and Trostle, T. , ,”Use of Highly Accelerate Life Test (HALT) to Determine Reliability of Multilayer Ceramic Capacitors”, Materials Research Laboratory , pp320 ~ 322( 1991) 。

[7].Munkoti, R. and Dhar, P. , ,”Highly Accelerated Life Testing(HALT) For Multilayer Ceramic Capacitor Qualification” ,IEEE/Transactions on Component , Hybrids. and ManufacturingTechnology. Vol.11 No.4 , pp342 ~ 345(1988) 。

[8]Design and Process Guidelines for Use of Ceramic Chip Capacitors
CALCE Electronic Products and System Center University of Maryland(1980) 。

[9]John Maxwell ,Electronics Engineer;December. AVX corporation(1988)。


[10]郤紹群,應用整體擴展技術結合類神經網路預測積層陶瓷電容器粉末先行之介電常數;國立成功大學(2005)。

[11]Hennings,D.F.K.Dielectric materials for sintering in reducing atmospheres.
Journal of the European Ceramic Society,21,1637-1642 (2001)。

[12]陳聰文,積層陶瓷電容器製程簡介,工業材料108期84年12月。

[13]林居南,積層陶瓷電容器電性測試,工業材料108期84年12月。
[14]Kapur,K.C.,and Lamberson,’’Reliability in Engineering Design,”John Wiley & Sons,N.Y.(1977)。

[15] .王宗華，可靠度工程技術手冊，中華民國品質管制協會(1998)。

[16].柯煇耀， 可靠度保証-工程與管理與技術之應用，中華民國品質協會(1999)。

[17].陳耀茂，可靠度工程-方法與應用，五南圖書(2001)。

[18].阮光業，品質管制與可靠度工程，超級圖書出版社(1980)。

[19].Young C.R. , Yoo, J.N. , “Assessment of Failure Rate of printed Board Assemblies by The High Temperature Accelerated Life Test”, IEEE/CPMT Elect Manufacturing Technology Symposium , p p 1~ 5 (1997) 。

[20].Ray, A.K. et al. ”Life Prediction of Service Exposed Reactor and Distillation Column Materials Used in A Petrochemical Industry”, Elsevier Science Ltd. Engineering Failure AnalysisVol.5.No.4 , pp289 ~ 298( 1998 ) 。

[21].Mogilevsky, B. M. and Shirn, G. A. ,”Accelerated Life Testing of Ceramic Capacitors” , IEEE/Transactions on Component , Hybrids,and Manufacturing Technology. Vol.11 No.4 , pp351 ~ 357(1988).。

[22]石逸群,累積失效與可靠度關係之探討,國立中央大學, (2000)。

[23].阮光業、盛其安，品質管制與可靠度工程，超級圖書出版社(1980)。

[24]Young-II Shin,Kyung-Moo Kang ,Yeon-Gil Jung,Jeong-Gu Yeo,Sang-Gyu Lee,Ungyu Paik.,Internal stress in BaTiO3/Ni MLCCs.,Journal of the European Cearmic Society23 1427-1434(2003)。

[25]Ramachandra Munikoti and PulakDhar .,low-voltage failure in multilayer ceramic capacitors:a new accelerated stress screen,IEEE Transaction on Components,Hybrids,And
Manufacturing Technology, Vol.11.NO.4.December (1988)。

[26]Hee young Lee,Kyo-chol Lee,J.Neil schunke,And Larry C.Burton,member,IEE
Leakage Currents in Multilayer Ceramic Capacitors., IEEE Transaction on Components,Hybrids,And Manufacturing Technology, Vol.Chmt-7,NO.4.December (1984)。

[27]William J.Minford., Accelerated life testing and reliability of high K multilayer ceramic capacitors., IEEE Transaction on Components,Hybrids,And Manufacturing Technology, Vol.Chmt-5,NO.3.September (1982)。
[28]Ramachandra Munikoti and pulak DHAR .,Highly accelerated life testing (HALT)for multilayer ceramic capacitor qualification., IEEE Transaction on Components,Hybrids,And Manufacturing Technology, Vol.11,NO.4.December (1988)。

[29]Michael S.Randall,Abhijit.Gurav,Daniel J.Skamser,James J.Beeson.,Lifetime modling of sub 2 micron dielectric thickness BME MLCC .,CARTS’ Conference (2003)。

[30].賴耿陽，產品壽命試驗技術，復漢出版社(1988)。

[31].載永久，可靠度導論，三民股份有限公司(1980)。

[32].葉小蓁，高等統計學，萬達出版社(2002)。

[33].張忠孝，可靠性的原理與應用，中華民國品質管制協會(1978)。

[34].王宗華，可靠度試驗與評估，中華民國品質管制協會(1994)。

[35] .王宗華，可靠度工程技術的理論與應用，中華民國品質管制協會(1983)。

[36]張盛智，氧化鏑薄膜電容器與場效電晶體之電性與可靠度分析，國立清華大學( 2005)。