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Electronic device trend of development, if LED and the chip resistance and the semiconductor device, its size obviously reduces.Electronic component process advancement and products assembly, surface mount technology (SMT) demand for rapid, miniaturization, thinning, mass, etc., of which electronic components for SMT may be wrapped in tape and reel (Tape-And-Reel) package delivery. However, when the Cover Tape is removed, even if the Electronic Tape Cover Tape is an antistatic agent treated material, it may stick to the surface during the SMT process. In order to reduce the time, money, and spiritual cost of electronic component packaging, and to improve the competitiveness of the industry, this study hopes to investigate whether the temperature will affect the packaging of electronic components. To investigate whether the temperature will affect electronica’s cover tape through experiments, and provide the results of temperature experimental data to the industry as a reference for material selection and design to reduce the probability of failure. The experiment mainly uses experimental observation method, using two tapes (Cover Tape) plus two carrier tapes (Carrier Tape), cross-matching, controlling temperature and time to observe temperature for electronic materials and cover tape whether or not sticking. After the experimental result, it was found that the baking temperature was 65 ° C, 48 hr or more, and the material began to have a partial sticky condition. Therefore, it is known that the temperature does have an impact on the packaging materials. The results of this research are provided to the packaging material suppliers, electronic material suppliers and machine manufacturers as the reference for the material selection design.
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