臺灣博碩士論文加值系統

　　本研究針對Sn-3.0Ag-0.5Cu及Sn-3.8Ag-0.7Cu無鉛銲料(簡稱SAC305、SAC387)，以0°C、8°C、25°C多組冷卻源之連續冷卻速率實驗，探討冷卻速率對銲料微結構的影響，藉由一系列冷卻速率與金相圖的比較，以釐清其微結構變化。
　　研究結果顯示，由於實驗設備經過約250°C預熱，冷卻速率只有些微的變化，但結晶時間隨冷卻速率的降低而明顯增加。Sn-Ag-Cu銲料於非平衡凝固條件下，其共晶凝固可表示為：L→L+(β-Sn+Ag3Sn)→β-Sn
+Ag3Sn+Cu6Sn5；由於Ag、Cu元素添加比例的差異，Cu6Sn5的成長會比Ag3Sn慢，隨冷卻速率的下降與結晶時間的增長，Ag3Sn、Cu6Sn5共晶化合物尺寸及形貌之變化如下：顆粒狀→顆粒狀與針狀混合→針狀→針狀與板狀或長條片狀混合→板狀。
　　對機械性質而言，快速的冷卻速率下的Ag3Sn、Cu6Sn5化合物較為細緻且初析β-Sn區域較小，其微硬度較高；而SAC305中的Ag、Cu含量較SAC387少，在冷卻凝固過程中，β-Sn區域生成較多，但SAC305於快冷下的微結構呈較緻密的網狀共晶組織，所以其β-Sn區域對於微硬度的降低沒有太大的影響，所以SAC305微硬度稍低於SAC387。

　　Effect of different cooling rates(0°C, 8°C, and 25°C water cooling experiments) on microstructural evolution of Sn-3.0Ag-0.5Cu(SAC305) and Sn-3.8Ag-0.7Cu(SAC387) lead-free solder were investigated. The influence of morphology it produced would be evaluated via tensile strength.
　　The study showed the cooling rates are only a few changes by equipment preheat to 250°C. Crystallization time increased significantly with cooling rates decreasing. SAC solder stood on non-equilibrium solidification process, so the process could be expressed as: L→L+(β-Sn+Ag3Sn)→β-Sn+Ag3Sn +Cu6Sn5. Cu6Sn5 compounds would grow slower than Ag3Sn by different proportion of Ag and Cu content. The decline of the cooling rates and the rise of crystallization time made the morphology of Ag3Sn and Cu6Sn5 eutectic compounds develop as : particle-like → particle and needle mixed → needle-like → needle and plate or long flake mixed → plate-like.
　　In terms of mechanical properties, the size of Ag3Sn and Cu6Sn5 with rapid cooling was tiny that it had the higher hardness. SAC387 added more Ag content caused that eutectic compounds and β-Sn area grew larger. Hardness of SAC305 is lower than SAC387.

口試合格證書 I
摘要 II
AbstractIII
誌謝 IV
總目錄 V
表目錄 VII
圖目錄 VIII
一、前言 1
二、文獻回顧 4
2-1無鉛銲料近年發展概況 5
2-2二元合金銲料 9
2-3Sn-Ag-X三元合金銲料 13
2-4冷卻速率的影響 17
三、實驗步驟與方法 21
3-1實驗規劃 21
3-2試件製備 24
3-3實驗內容 27
四、實驗結果與討論 30
4-1連續冷卻速率曲線分析 30
4-2冷卻速率對銲料微結構之影響 40
4-3冷卻速率對銲料微硬度之影響 61
五、結論 72
六、建議與未來方向 73
七、參考文獻 74

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