臺灣博碩士論文加值系統

本研究主要以液/固反應偶之形式探討Sn-58 wt% Bi (SB)與Sn-0.7 wt% Cu (SC)兩種無鉛銲料與Fe-42 wt% Ni (Alloy 42)基材在240、270、300、330℃四個溫度，反應時間為1~50小時下的界面反應，探究其界面反應所生介金屬相形態、種類、反應動力與擴散機制等現象。實驗結果顯示在SB/Alloy 與SC/Alloy 42的界面反應中，僅有一FeSn2相生成，並無其他介金屬相的生成。在經過蝕刻處理過後，可觀察到所生成的FeSn2相有兩種晶粒形態。在迴銲溫度240℃時基材側生成平坦緻密細小的IMC，銲料端為板狀、塊狀的粗大IMC，並且有剝離界面的現象出現。隨著迴銲溫度的上升，銲料端的IMC形態轉變為柱狀並以垂直基材的方向往銲料中生長，此時並無界面剝離的現象出現。且此兩種形態的FeSn2厚度皆隨著反應時間及溫度增加而變厚。

動力學方面，除了SB/Alloy 42於240℃迴銲為晶界擴散所控制，其餘各迴銲溫度的反應偶，其厚度成長皆符合拋物線定律。最後於Alloy 42表面濺鍍一層Mo，作為反應前原始界面的標記，接著進行界面反應並探討Sn與Fe於介金屬相中擴散速率的快慢。實驗結果顯示，Sn為主要擴散的反應物原子。

In this research, we studied the interfacial reactions between Sn-58 wt% Bi and Sn-0.7 wt% Cu lead-free solders and Alloy 42 substrate. The liquid/solid reaction couples were reflowed for 1~50 hours at 240, 270, 300 and 330℃. In this study, the kinetic, reaction mechanism and the sort of the intermetallic component of the interfacial reactions were investigated. The experiment results indicated that only the FeSn2 phase was formed on the interfaces of the SB/Alloy 42 and SC/Alloy 42 couples. After etching process, there are two kind of morphology of the intermetallic component layer for each sample. In low reflowing temperature, there are chunk and plank type IMCs near the solder, and close to the substrate a flat, dense reaction layer are formed. The chunk, plank type IMCs are easy to spall away. The morphology of the IMC change to form column type grains and the spalling doesn’t happen when the reflow temperature increase. All the IMCs become thick with increasing temperature.

In the kinetics study, the couples of SB/Alloy 42 reflowed at 240℃ is grain boundary diffusion controlled. And the others are diffusion controlled.

Finally, we sputtered a Mo layer on the alloy 42 substrate. The layer of Mo act as a marker which indicated the origin position of the reaction. The experiment results demonstrated that Sn is the dominate diffusion atoms.

摘 要 I
Abstract II
致 謝 III
目 錄 V
圖目錄 VII
表目錄 XII
第一章 前言 1
第二章 文獻回顧 4
2-1無鉛銲料 4
2-1.1 Sn-58 wt% Bi (SB)系統 6
2-1.2 Sn-0.7 wt% Cu (SC)系統 8
2-2助銲劑 9
2-3 界面反應 11
2-4 擴散理論與機制 14
2-5 界面反應控制動力學 18
2-6 晶粒熟化剝離機制 19
2-7銲料/基材界面反應之文獻回顧 22
2-7.1 Sn/Fe界面反應 22
2-7.2 Sn/Alloy 42界面反應 25
第三章 實驗方法與步驟 28
3-1 銲料/Alloy 42基材反應偶製備 28
3-2 金相處理 29
3-3 試片分析 29
第四章 結果與討論 33
4-1 Sn-58 wt% Bi與Alloy 42基材的界面反應 33
4-2 Sn-58 wt% Bi與Alloy 42基材的界面反應動力學探討 53
4-3 Sn-0.7 wt% Cu與Alloy 42基材的界面反應 61
4-4 Sn-0.7 wt% Cu與Alloy 42基材的界面反應動力學探討 80
4-5 反應物原子在FeSn2擴散速率的探討 84
第五章 結論 89
第六章 參考文獻 91
作者簡介 94

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