臺灣博碩士論文加值系統

本研究主要為利用極短之反應時間 (5-60 sec) 來探討鉛錫共晶焊錫與42合金界面平面之介金屬化合物生成情形。藉由特殊的斜磨後黏掀技術 (taper grinding and bound opening technique) 可露出界面平面而對其上所生成之介金屬化合物做觀察。
在鉛錫焊錫/42合金界面平面上可觀察到三種不同形態之介金屬化合物，並且提出其中一種相，SFL (sweet-flag-leaf) 相之形成機制及定出其成份為Ni3Sn4，而本研究將另一種未知成份及結構之相，柱狀相 (column phase)，利用複製膜 (replica) 的方式直接由焊錫基質中取出並以單晶X-ray及EPMA得知其成份及結構極可能為Ni3Sn4。在極短的反應時間下可在界面平面觀察到長寬約5-10 mm且數量極少的Fe-Sn化合物鑲嵌於焊錫基質中，具有長柱狀及塊狀的形態，同時也觀察到SFL相。若以純Ni為基板則其界面平面所生成之Ni3Sn4，與以42合金為基板所生成之SFL相的形態具有相當大之差異，是因為以42合金為基板會在焊錫與42合金之間形成一FeSn2界面層而使Ni在焊錫中的濃度大幅降低。
藉由研究短反應時間可以觀察到SFL相成核成長的過程符合之前所提出的SFL相形成機制。
本研究也提出對於Pb在焊接反應所扮演的角色，由Pb與常見之基板元素 (Ni、Fe、Cu) 之二元相圖可知，Pb對Ni、Fe、Cu有一極小的溶解度，而Pb則不會溶於Ni、Fe、Cu中，因此Pb可溶解基板表面而使Sn與基板得到較佳之接合。
剪切強度測試方面，利用lap-shear試片可知，極短的反應時間下剪切強度由隨著反應時間增加而增加的趨勢，可能是因為銲錫消耗形成IMC而使銲錫厚度減少。相同溫度下 (213℃)，短反應時間的剪切強度較以往研究之長時間反應為高，可能是因為柱狀相在長時間下於銲錫之中形成的緣故。
以相同之焊接條件 (213℃，60 sec) 不同的拉伸速率 (0.1-5 mm/min) 做剝離測試 (peel test)，拉伸速率2 mm/min下，最大荷重及平均荷重均為最高值。因室溫對銲錫而言已達其熔點之3/2，由強度s ﹦K (ε )m (K為材料常數，m為應變速率敏感因子) 可知，拉伸速率較快 (5 mm/min) 的情形下，因為強度s增加而使KC降低，而使其呈脆性斷裂；較慢拉伸速率時 (0.1 mm/min)，因為強度s低，為密佈窩穴延性斷面。

摘要 ………………………………………………………i
誌謝 ………………………………………………………iii
目錄 ………………………………………………………iv
I. 前言 ……………………………………………………1
II. 文獻回顧 …………………………………………… 4
II-1. 熔融銲錫-基板反應 ……………………………… 4
II-2. 介金屬化合物之成長 …………………………… 5
II-3. 接合強度測試 …………………………………… 8
III. 實驗步驟 ……………………………………………10
III-1. 材料 …………………………………………… 10
III-2. 焊接 …………………………………………… 10
III-3. 微結構觀察及分析……………………………… 11
III-4. 柱狀相成分及晶格常數鑑定…………………… 11
III-5. 機械性質試驗 ………………………………… 12
A. Single-overlap shearSpecimens ……………………… 12
B. Peel specimens …………………………………… 13
IV. 結果與討論 …………………………………………14
IV-1. 柱狀相成分及晶格常數鑑定…………………… 14
IV-2. 界面平面之IMC觀察…………………………… 15
IV-3. SFL相之成長 …………………………………… 17
IV-4. 剪切強度測試 ………………………………… 21
IV-5. 剝離測試 ……………………………………… 22
V. 結論 ………………………………………………… 24
VI. 參考文獻 …………………………………………… 26
圖 ……………………………………………………… 30
表 ……………………………………………………… 86
附錄 …………………………………………………… 88

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