臺灣博碩士論文加值系統

印刷電路板(PCB)在生產過程中，難免因製程上的外在因素而造成短路、斷路及漏電等電性功能上的瑕疵，這些都有賴於製程上之電性測試加以篩檢。現今PCB的高密度、細間距、多層次設計，不僅是生產製作的難度越來越高，相對的電性測試時也面臨了電測治具製作、與穩定測試的瓶頸，因此如何提昇PCB電性測試技術已為產業的重要課題之一。
本文主要選用L9(3⁴)田口實驗計劃表，針對印刷電路板電性測試用治具加工最常用的三種微鑽針尺寸0.6mm、0.4mm、0.2mm，以主軸旋轉數、進給率、退刀率與主軸提刀高度四項因子，在鑽孔機對FR-4玻璃纖維板進行鑽削實驗，利用電子顯微鏡觀察微鑽針的磨耗變化，同時分析不同磨耗變化對於鑽削精度的影響，作為判定刀具使用壽命的依據。再利用田口實驗法進行各項所需數據之計算，並繪製回應表與回應圖，得到最佳加工參數條件。最後由此最佳加工條件，實際再度測試而做最終品質驗證。並以此加工條件模式，建立微鑽針加工FR-4玻璃纖維板材料的最佳化技術資料庫，相信對PCB產業之電性測試深具參考價值。

In the production of printed circuit boards (PCB), it is inevitable to cause electrical functional defect, short circuit and electrical leakage, etc. resulted from the external factors during the process. Those defects all depend on the electrical testing process to screen them out. Today’s PCB even integrated with high-density, fine pitch, and multi-level designs. It has pushed the manufacturing to a more difficult level and also made the electrical testing harder than ever before. In particular, on the preparation of electrical test fixture to meet these complicated designs. Due to the resulted bottleneck on the stability of electrical testing, it has been an important issue for the industry to work out the improvement in testing technology.
This study adopted the L9(3⁴) orthogonal table in Taguchi method to conduct the experiment on the electrical testing fixture of the printed circuit board with the three most commonly used micro-drill sizes, i.e., 0.6mm, 0.4mm, and 0.2mm, respectively. Together with other factors such as the spindle rotation speed, feed rate, retraction rate and spindle pull up height as the varying parameters set on the drilling machine to process FR-4 glass fiber circuit boards. The worn out of micro-drills after each of the test are examined by using the electron microscope. In the meantime, the variations of wear on the drilling accuracy are also investigated and served as the index on the tool life. The relating experimental data are also used to construct the response table and chart in the Taguchi experimental method to get the best processing parameters. Finally, these optimum processing conditions are verified with the completion of a practical drilling test for the final quality confirmation. All these processing conditions are used as the basis for the establishment of an optima technical information library in micro-drilling the FR-4 glass fiber boards. It is believed that the investigations are a valuable reference for the electrical test of PCB manufacturing industry.

書名頁 i
論文口試委員審定書 ii
授權書 iii
摘要 iv
ABSTRACT vi
誌謝 viii
目錄 ix
圖目錄 xii
表目錄 xvi
符號說明 xviii
第1章 緒論 1
1.1 前言 3
1.2 研究動機與目的 4
1.3 印刷電路板的製造方法 5
1.4 印刷電路板的製造流程簡介 7
1.4.1 內層 7
1.4.2 壓合 9
1.4.3 鑽孔 10
1.4.4 鍍通孔 11
1.4.5 外層線路 12
1.4.6 防焊綠漆 12
1.4.7 文字印刷 14
1.4.8 表面處理 15
1.4.9 成型切割 15
1.4.10 電性測試與終檢包裝 16
1.5 高密度連接板介紹 17
1.5.1 高密度連接板定義 17
1.5.2 高密度連接板的優勢 18
1.5.3 高密度連接板基礎架構 18
1.6 印刷電路板的測試簡介 20
1.6.1 電測原理 20
1.6.2 測試網路的概念 20
1.6.3 測試不良種類 21
1.6.4 電測種類與設備及其選擇 22
1.6.4.1 專用型(Dedicated) 23
1.6.4.2 汎用型(Universal) 23
1.6.4.3 飛針測試 26
1.7 文獻回顧 27
第2章 基礎理論 31
2.1 鑽孔原理 31
2.2 切削理論 32
2.3 鑽針磨耗 33
2.4 治具之鑽孔 40
2.5 孔位精度 43
2.6 製程能力分析 44
2.6.1 Cpk值與6σ之關係 46
2.7 田口方法理論 48
2.7.1 直交表 50
2.7.2 訊號雜訊比(S/N比) 52
2.7.3 變異數分析 54
第3章 實驗 57
3.1 實驗設備 57
3.1.1 加工物件 57
3.1.2 鑽孔機介紹 58
3.1.3 高速孔位量測機 59
3.2 鑽針磨耗觀察分析 61
3.3 田口實驗 67
3.3.1 實驗步驟 67
3.3.2 規劃選用直交表 69
3.3.3 實驗方法 70
3.3.4 ϕ0.2mm鑽針實驗數據分析 72
3.3.5 ϕ0.4mm鑽針實驗數據分析 76
3.3.6 ϕ0.6mm鑽針實驗數據分析 80
第4章 實驗結果與討論 84
第5章 結論與建議 87
5.1 結論 87
5.2 建議 88
參考文獻 89

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