臺灣博碩士論文加值系統

IC (Integrated Circuit)是最基本的電子元件，它是將電晶體、二極體、電阻、電容整合至一個矽晶片上，而這個矽晶片就是所謂的半導體。近年來由於半導體產業的蓬勃發展及積體電路複雜度的增加，使得晶片測試在整個半導體製造過程中，越來越重要。但究竟何謂測試工程，積體電路晶片測試的目的便是在晶片產出後，驗證功能是否與原設計相符，即使晶片正處於其定義在最惡劣的環境條件(Worse Condition)，仍然能正常工作。而測試工程必須要考慮的重點就是，如何在成本效益考量下完成積體電路的所有測試項，提供產品最佳的出貨品質。
半導體種類複雜，但大致上可分為記憶體(Memory)IC，邏輯(Logic)IC，微元件IC及混合訊號(Mixed signal)IC四大類。相對的測試方法也不太相同。本文將針對記憶體及邏輯IC的測試方法做研究，介紹測試製程及各類測試機結構，進而探討測試原理。並將藉業界產品做為實例，分享異常分析案例。

IC (Integrated Circuit) is the most basic component of electronics, which integrates the transistor, diode, resistor and capacitor into a chip and this chip is called Semiconductor. In recent years, semiconductor industry has been growing fast and the complexity of IC has been increasing, therefore chip testing has become more important in the process of semiconductor manufacture. What is the test engineering? The purpose of semiconductor testing is to verify the device function of design rule after chip fabricated, and to make it work normally even the chip is in worse conditions. The most important of test engineering concern is how to complete all test items with best shipping quality in low cost solution.
There are some many kinds of semiconductor device. In roughly, it can separate into 4 kinds of device that include memory IC, logic IC, microprocessor and mixed signal IC. We will focus on memory and logic testing methodology in this paper. Also we will introduce the tester hardware structure and testing manufacture and then look into the testing theorem. Furthermore, we will use the true device for real example.

封面內頁
簽名頁
授權書．．．．．．．．．．．．．．．．．．．．．．．．．iii
中文摘要．．．．．．．．．．．．．．．．．．．．．．．．iv
英文摘要．．．．．．．．．．．．．．．．．．．．．．．．v
誌謝．．．．．．．．．．．．．．．．．．．．．．．．．．vi
目錄．．．．．．．．．．．．．．．．．．．．．．．．．．vii
圖目錄．．．．．．．．．．．．．．．．．．．．．．．．．ix
表目錄．．．．．．．．．．．．．．．．．．．．．．．．．xi

第一章　緒論
1.1 研究背景與動機．．．．．．．．．．．．． 1
1.2 論文架構．．．．．．．．．．．．．．．． 1
第二章 IC製造流程
2.1 生產流程．．．．．．．．．．．．．．．． 2
2.2 晶圓測試．．．．．．．．．．．．．．．． 3
2.3 成品測試．．．．．．．．．．．．．．．． 4
2.4 封裝．．．．．．．．．．．．．．．．．． 6
2.4.1封裝方法及目的 ．．．．．．．．．．．． 6
2.4.2封裝型態 ．．．．．．．．．．．．．．． 7
2.4.3封裝製作流程 ．．．．．．．．．．．．． 11
第三章 測試系統架構分析
3.1邏輯測試系統．．．．．．．．．．．．．．．16
3.1.1測試系統基本架構．．．．．．．．．．．．16
3.1.2測試系統硬體說明．．．．．．．．．．．．18
3.2記憶體測試系統．．．．．．．．．．．．．．23
3.2.1記憶體修補分析(MRA)單元．．．．．．．．24
3.2.2記憶體修補輸出格式．．．．．．．．．．．25
第四章 產品測試原理探討
4.1邏輯產品測試方法．．．．．．．．．．．．．27
4.1.1直流特性測試．．．．．．．．．．．．．．27
4.1.2交流特性測試．．．．．．．．．．．．．．34
4.2記憶體產品測試方法．．．．．．．．．．．．38
4.2.1記憶體IC基本構成．．．．．．．．．．．．38
4.2.2記憶體IC測試形態．．．．．．．．．．．．40
4.3記憶體備份電路修補方法．．．．．．．．．． 43
4.3.1備份電路(Redundancy)的意義 ．．．．．．43
4.3.2雷射修補方法．．．．．．．．．．．．．．44
第五章 結果分析
5.1偵錯工具(Debug Tool)．．．．．．．．．．．47
5.2異常分析．．．．．．．．．．．．．．．．．．51
第六章 結論．．．．．．．．．．．．．．．．．．55
參考文獻．．．．．．．．．．．．．．．．．．．．56

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