臺灣博碩士論文加值系統

目前LED的射出導線架大多以熱塑型材料為主，而使用最大量的即是PPA (Polyphthalamide)及PCT (Poly1,4-cyclohexylene dimethylene terephthalate)，PPA主要使用為低功率應用，而一些中低功率使用主要為PCT，兩種材料在市場上都相當成熟，但是隨著降低成本下使用功率的提升及全新照明應用，支架本身對於環境，如硬度及吸水性…等，另外抗熱效果的提升就很重要，如耐黃化…等,因此市場上多了一些熱固型材料的選擇，如 EMC (Epoxy Molding compound ) 及SMC (Silicone Molding compound ) ....等。

本論文主要要探討熱固型材料EMC在高功率產品上的應用，預計會使用2W以上，一開始針對製程上差異作比較分析，如噴砂及下料....等，實際封裝實驗結果發現經過噴砂除膠製程並不會造成光學損失,且透過滲透實驗可以知道熱固型材料與支架結合程度與熱塑型材料無差異,與接著主要會比較光學上性質透過光量測儀器了解比較熱固材料反射率及封裝後初始亮度與熱塑材料無差異,而透過烘烤 150 oC 長時間烘烤及250 oC 反覆過爐的實驗看耐熱程度及抗黃化的表現熱固型皆比熱塑型為優，最後使用熱固型材料(EMC)透過長時間在常溫25 oC、60 oC 及 85 oC 上的點亮測試(@400mA)比較光衰減及壽命推估表現。

關鍵詞：LED發光源、LED塑料(PPA、PCT、EMC、SMC)

In present, the thermoplastic polymer has been commonly utilized as one of LED packaging materials, in which thermoplastic-based PPA(Polyphthalamide) and PCT(Poly1,4-cyclohexylene dimethylene terephthalate)-based material are abundantly used. The PPA and PCT are mainly used for low- and medium-power applications, and both are the most commercial available materials in the LED packaging market. However, with reducing cost and increasing input power in LED solid-state lighting applications, the new packaging materials with better resistance to impact, humidity, heat, and encapsulant yellowing, have been developing for passing different environmental loads. Hence, there are some thermosetting polymer-based materials developed to meet the requirement, such as EMC (Epoxy Molding Compound) and SMC (Silicone Molding Compound), etc.

The study is mainly focused on the applications of EMC package (with thermosetting polymer-based material) in high-power LED products, which is driven by greater than input power of 2W. First, it is to make a detailed analysis on each LED packaging process, such as sandblasting and punching, etc, and to further measure the initial light intensity of the package, relating to EMC''s reflectivity after packaged. Next, the material heat resistance and optical characterization for the package were examined before and after the long-term high-temperature aging and several reflow cycling tests. Finally, the adhesive bond at an interface between EMC material and silver leadframe was observed with a red ink experiments. In the mean time, the light decay and lifetime for the package were also determined by experimentally recording the LED light intensity when continually operated at a certain driven I=400mA under different ambient temperature conditions of 25 oC, 60 oC, 80 oC for a long time.

Keywords: LED, Package, EMC thermosetting-based packaging material, PPA thermoplastic-based packaging material

摘要...............i
Abstract...............ii
誌謝...............iv
目錄...............v
表目錄...............vii
圖目錄...............viii
第一章 序論...............1
1.1前言...............1
1.2 LED介紹...............2
1.3研究動機與目的...............3
1.4論文架構...............4
第二章 LED介紹及相關原理...............5
2.1 LED介紹...............5
2.2白光發光原理...............9
2.2.1 LED白光發光方式...............9
2.2.2 LED封裝製程...............10
2.2.3 LED封裝材料...............12
第三章 實驗設計及儀器介紹...............16
3.1實驗目的...............16
3.2實驗設計...............17
3.3儀器原理及說明...............20
3.3.1紫外光-可見光光譜原理...............20
3.3.2熱阻量測原理...............22
3.3.3可靠度測試介紹...............25
3.3.4 LED量測系統介紹...............30
第四章 結果與討論...............33
4.1除膠製程差異&不同塑料結合度&受熱黃化的比較結果...............33
4.2塑料耐熱結果及可靠度比較結果...............34
4.3 EMC支架熱阻及可靠度結果...............35
第五章 結論...............44
參考文獻...............45
Extended Abstract...............47
簡歷...............50

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